Abstract: A fabrication method of a packaging substrate is provided, which includes the steps of: forming first conductive portions on a carrier; sequentially forming a conductive post and an alignment layer on each of the first conductive portions; forming an encapsulant on the carrier for encapsulating the first conductive portions, the conductive posts and the alignment layers; forming a conductive via on each of the alignment layers in the encapsulant and forming second conductive portions on the conductive vias and the encapsulant; and removing the carrier. Each of the first conductive portions and the corresponding conductive post, the alignment layer and the conductive via form a conductive structure. The alignment layer has a vertical projection area larger than those of the conductive post and the conductive via to thereby reduce the size of the conductive post and the conductive via, thus increasing the wiring density and the electronic element mounting density.

Abstract: A fabrication method of a packaging substrate includes: providing a metal board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of first openings for defining a first core circuit layer therebetween, the second surface has a plurality of second openings for defining a second core circuit layer therebetween, each of the first and second openings has a wide outer portion and a narrow inner portion, and the inner portion of each of the second openings is in communication with the inner portion of a corresponding one of the first openings; forming a first encapsulant in the first openings; forming a second encapsulant in the second openings; and forming a surface circuit layer on the first encapsulant and the first core circuit layer.

Abstract: The instant disclosure relates to a manufacturing method of connector which comprises the following steps. The first step is to provide a substrate layer and forming a first metal layer on the substrate layer. The next step is to pattern the first metal layer to form a wiring layer. The next step is to form a dielectric layer on the wiring layer, wherein the dielectric layer is formed with at least one via hole to partially expose the wiring layer and a conductive structure arranged on the inner wall of the at least one via hole and electrically connected to the wiring layer. The next step is to form a first protective layer on the dielectric layer and at least one cantilever structure between the first protective layer and the dielectric layer. The last step is to remove the substrate layer.

Abstract: The instant disclosure relates to a connector including a wiring layer, a dielectric layer, a conductive structure, a first protective layer and at least one cantilever structure. The dielectric layer is disposed on the wiring layer, wherein the dielectric layer has at least one via hole to partially expose the wiring layer. The conductive structure is disposed on the inner wall of the at least one via hole of the dielectric layer and electrically connected to the wiring layer. The first protective layer is disposed on the dielectric layer. The cantilever structure is disposed between the first protective layer and the dielectric layer, wherein the at least one cantilever structure is electrically connected to the wiring layer via the conductive structure.

Abstract: A confining structure of a rotating mop has a one-piece loop on a disc thereof, at least two stopping blocks arranged on the loop, and an n-typed body of a linking element being arranged correspondingly to the surface of the loop and the bottom of each stand thereof having an engaging block corresponding to the position of the stopping blocks. When the rotating rod is perpendicular to the disc, the linking element is closely joined but movable with the engaging blocks. When the bottom of the engaging blocks cannot abut on the loop and slips, the stopping blocks fix the position by abutting on the engaging blocks for the rotating rod to rotate for dewatering by centrifugal force. When the rotating rod is leaning, the linking element is not closely joined with the engaging blocks.

Abstract: An integrated circuit includes a plurality of transistors. The transistors are electrically connected in series and with their respective gates tied together. The transistors are implemented within a transistor array. The transistors are electrically connected between a first reference terminal and a second reference terminal. A non-dominator part of the transistors adjacent to the first reference terminal are implemented at corner regions of the transistor array.

Abstract: A power supply includes a housing, a power module, a top cover, a sealing sheet, and a filling member. The power module is disposed in the housing. The top cover is disposed above the housing. The sealing sheet is at least partially disposed between the housing and the top cover. The filling member is disposed between the housing and the sealing sheet.

Abstract: A fluorescent electronic ballast including: a rectifier circuit, for receiving an AC power supply and converting the AC power supply into a DC power supply; an inverter circuit, coupled to a fluorescent driver circuit, for converting the DC power supply into a high-frequency AC power supply for driving a fluorescent; and a detection protection circuit, coupled to the rectifier circuit and the inverter circuit, for detecting the DC power supply provided by the rectifier circuit, and cutting off the electric connection between a control chip of the inverter circuit and all of power supply when the voltage of the direct current power supply is lower than a predetermined value, wherein the power supply at least includes the direct current power supply provided by the rectifier circuit.

Abstract: A fabrication method of a packaging substrate includes: providing a metal board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of first openings for defining a first core circuit layer therebetween, the second surface has a plurality of second openings for defining a second core circuit layer therebetween, each of the first and second openings has a wide outer portion and a narrow inner portion, and the inner portion of each of the second openings is in communication with the inner portion of a corresponding one of the first openings; forming a first encapsulant in the first openings; forming a second encapsulant in the second openings; and forming a surface circuit layer on the first encapsulant and the first core circuit layer.

Abstract: An optical transceiver is provided and connected to a display surface, including a main body, a slider, an elastic element, a movable element, and a circuit board. The main body comprises a base and a cover. A protrusion and a groove are formed on a side of the main body, and the groove extends along a direction toward the protrusion. The circuit board is clamped between the base and the cover and not parallel to the protruding direction of the protrusion. The slider is movably connected to the groove. The elastic element is connected between the slider and the main body. The movable element is connected to the main body and the slider.

Abstract: A method for manufacturing a touch panel includes the following procedures. A base plate is provided. An indium tin oxide film is formed on the base plate. The indium tin oxide film is etched to form a plurality of first and second electrodes which are alternatively arranged according to columns on the base plate and insulated from each other, and the first electrodes in a column along a first direction are electrically coupled to each other. A plurality of insulated layers is formed on the first and second electrodes. A plurality of conductive connectors are formed on the plurality of insulated layers via an ink jet printing method to electrically interconnect with the second electrodes in a column along the second direction intersecting the first direction. The widths of the conductive connectors are reduced below 10 ?m via a laser processing method.

Abstract: A environmental reproduction system multiplexes information from a variety of sources to reproduce a target environment having visual and/or auditory impediments. The visual impediments may include one or more environmental conditions, such as rain, sleet, snow, darkness, brightness, or any other type of environmental condition. The auditory impediments may include loud noises, such as construction noises, or sounds that are too low, such as an emergency vehicle sound not being heard. The environmental reproduction system may determine the environmental condition from one or more sources, such as an internal microphone, an external microphone, temperature sensor, a camera, a weather receiver, or other types of sensors. The environmental reproduction may be in communication with an environmental condition database and operative to apply a signal processing action to a recording (video and/or audio recording) of the target environment based on the determined environmental condition.

Abstract: A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads.

Abstract: A quick bench vise includes a base, a movable jaw, a threaded rod, a sleeve, an adjustment member and a board. The movable jaw has two rods which movably extend through the base. The threaded rod extends through the movable jaw and the base. A collar and a spring are mounted to the threaded rod. The sleeve is located in a chamber of the base and mounted to the threaded rod. The adjustment member is located in a recess of the sleeve and is threadedly connected to the threaded rod. The sleeve has a weight connected thereto and the adjustment member has a curved portion on the outside thereof. The board is connected to the threaded rod and the two rods of the movable jaw. The movable jaw is quickly moved to clamp the workpiece by the sleeve and the adjustment member.

Abstract: Some embodiments of the present disclosure relate to a stacked integrated chip structure having a thermal sensor that detects a temperature of one or a plurality of integrated chips. In some embodiments, the stacked integrated chip structure has a main integrated chip and a secondary integrated chip located on an interposer wafer. The main integrated chip has a reference voltage source that generates a bias current. The secondary integrated chip has a second thermal diode that receives the bias current and based thereupon generates a second thermal sensed voltage and a second reference voltage that is proportional to a temperature of the secondary integrated chip. A digital thermal sensor within the main integrated chip determines a temperature of the secondary integrated chip based upon as comparison of the second thermal sensed voltage and the reference voltage.

Abstract: A circuit board assembly includes a printed circuit board, at least one wire, at least one wire fixing device, and a plurality of electronic components. A wire fixing method includes following steps. Firstly, the wire fixing device is inserted into a conductive hole of the printed circuit board. Then, the wire fixing device is fixed on the printed circuit board via a soldering material. Then, a conducting terminal of the wire is introduced into an accommodation space of the wire fixing device through the first opening of the wire fixing device. Then, at least one concave structure is formed in an external surface of a first conducting part of the wire fixing device by a jig. Consequently, the conducting terminal of the wire is fixed on the wire fixing device, and the wire is electrically connected with the printed circuit board through the wire fixing device.

Abstract: Provided is a lamp ballast having a filament heating apparatus for gas discharge lamp, including a PFC converter for receiving an AC input voltage and converting the AC input voltage into a DC bus voltage; an inverter connected to an output end of the PFC converter for converting the DC bus voltage into an AC output voltage for driving gas discharge lamps; and a filament heating apparatus connected to the output end of the PFC converter. The filament heating apparatus includes an auxiliary heating circuit for converting the DC bus voltage into a heating power for pre-heating the filaments of the gas discharge lamps; and a control circuit connected to the inverter and the auxiliary heating circuit for generating an auxiliary voltage according to the heating power to activate the PFC converter.

Abstract: A wireless communication device and a wireless paring method thereof provided. The method is suitable for a first wireless communication device. The first wireless communication device includes a storing module storing a first operation system(OS) and a second OS. The method includes: executing the first OS, and executing a wireless paring of the first wireless communication device and a second wireless communication device through the first OS; storing a paring information into a sharing information backup region of the storing module through the first OS; executing the second OS, and reading the paring information from the sharing information backup region through the second OS; and establishing a wireless connection between the first wireless communication device and the second wireless communication device through the second OS according to the paring information.

Abstract: A fabrication method of a packaging substrate includes: providing a metal board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of first openings for defining a first core circuit layer therebetween, the second surface has a plurality of second openings for defining a second core circuit layer therebetween, each of the first and second openings has a wide outer portion and a narrow inner portion, and the inner portion of each of the second openings is in communication with the inner portion of a corresponding one of the first openings; forming a first encapsulant in the first openings; forming a second encapsulant in the second openings; and forming a surface circuit layer on the first encapsulant and the first core circuit layer.

Abstract: Methods and systems for determining dance steps based on music and/or other dancers. A wearable computing system may include a head mounted display (HMD). The wearable computing system may receive a media sample including an audio sample associated with a song and/or a video sample associated with one or more dancers performing a dance. The wearable computing system may communicate the media sample to a content analysis server that may include a content identification module. The content identification module may provide information associated with a content of the media sample, such as identification of the song and the dance, to the wearable computing system. The wearable computing system may determine dance steps corresponding to the content of the media sample and may generate a display of the dance steps on the HMD.