Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.

Abstract: A driver is configured to provide an output voltage and an output current to a load according to an input voltage. The driver includes a power converter, first and second detecting devices and a controller. The power converter is configured to receive and convert the input voltage to the output voltage and the output current. The first detecting device is configured to detect the input voltage to generate a first signal. The second detecting device is configured to detect the output voltage to generate a second signal, and detect the output current to generate a third signal. The controller is configured to perform a calculation to the second signal and the third signal according to one of lookup tables corresponding to the first signal to generate a power value. An operation method of a driver and a light source system are also disclosed herein.

Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.

Abstract: An electronic package is provided, in which at least one first electronic component is arranged on one surface of a circuit structure with circuit layers and a plurality of second electronic components are arranged on the other surface. The first electronic component can electrically bridge two of the plurality of second electronic components via the circuit layers to replace part of the circuit layers of the circuit structure, so that the circuit layers of the circuit structure can maintain a larger wiring specification and reduce the number of circuit layers, thereby improving the process yield.

Abstract: An electronic package is provided, in which at least one first electronic component is arranged on one surface of a circuit structure with circuit layers and a plurality of second electronic components are arranged on the other surface. The first electronic component can electrically bridge two of the plurality of second electronic components via the circuit layers to replace part of the circuit layers of the circuit structure, so that the circuit layers of the circuit structure can maintain a larger wiring specification and reduce the number of circuit layers, thereby improving the process yield.

Abstract: A glasses type display device includes a front end assembly, a pair of legs and a light-shielding mask. Each of the pair of legs includes a front segment and a rear segment. The front segment is coupled to the front end assembly. The rear segment is pivotally connected to the corresponding front segment on an axis. The light-shielding mask includes a frame and a cover. The frame is connected to the front end assembly. The cover has flexibility and is connected to the frame to cover the eyes of the user. The movement range of the rear segment relative to the corresponding front segment partially overlaps with the cover in space.

Abstract: A glasses type display device including a front end assembly and a pair of legs is provided. Each of the pair of legs includes a front segment, a rear segment, a torsion mechanism, and a rotation mechanism. The torsion mechanism is disposed between the front end assembly and the front segment. The rotation mechanism is disposed between the front segment and the rear segment.

Abstract: A semiconductor package includes a first die having a first surface, a first conductive bump over the first surface and having first height and a first width, a second conductive bump over the first surface and having a second height and a second width. The first width is greater than the second width and the first height is substantially identical to the second height. A method for manufacturing the semiconductor package is also provided.

Abstract: A driver is configured to provide an output voltage and an output current to a load according to an input voltage. The driver includes a power converter, first and second detecting devices and a controller. The power converter is configured to receive and convert the input voltage to the output voltage and the output current. The first detecting device is configured to detect the input voltage to generate a first signal. The second detecting device is configured to detect the output voltage to generate a second signal, and detect the output current to generate a third signal. The controller is configured to perform a calculation to the second signal and the third signal according to one of lookup tables corresponding to the first signal to generate a power value. An operation method of a driver and a light source system are also disclosed herein.

Abstract: In some examples, a device can include a display coupled to a locking mechanism, wherein the locking mechanism applies a first force in a first direction, an enclosure coupled to the display with the locking mechanism, and a spring mechanism coupled to the enclosure and the locking mechanism to prevent a tension level between the display and the enclosure from exceeding a tension threshold, wherein the spring mechanism applies a second force in a second direction.

Abstract: An optical fingerprint sensing apparatus is provided. A control circuit controls a first selection circuit to output at least one of fingerprint sensing signals on sensing signal lines, and controls a second selection circuit to output at least one of background noise signals on dummy sensing signal lines, so that the first selection circuit and the second selection circuit simultaneously output the fingerprint sensing signal and the background noise signal, respectively. The signal processing circuit cancels background noise of the fingerprint sensing signals according to the background noise signal.

Abstract: A projection apparatus includes a light valve, a projection lens, and a light source device. The light source device provides an illumination beam and includes a casing, a light source, and a wavelength-converting module. The casing has an opening portion. The light source device is disposed in the casing and provides an excitation beam. The wavelength-converting module is disposed at the opening portion and includes a bracket, a motor, and a wavelength-converting wheel. Heat-dissipating fin set of the bracket is exposed out of the casing via the opening portion. The motor is disposed on a carrying portion of the bracket. The wavelength-converting wheel is driven to rotate by the motor. The wavelength-converting wheel converts the excitation beam into a conversion beam. The illumination beam includes the conversion beam. The light valve is disposed on a transmissive path of the illumination beam to convert the illumination beam into an image beam.

Abstract: A semiconductor package includes a first die having a first surface, a first conductive bump over the first surface and having first height and a first width, a second conductive bump over the first surface and having a second height and a second width. The first width is greater than the second width and the first height is substantially identical to the second height. A method for manufacturing the semiconductor package is also provided.

Abstract: The invention describes a natural fungicide which comprises gallnut and myrobalan extracts which exhibit a synergistic effect against Alternaria brassicicola, and can be used to control crop fungal diseases.

Abstract: A semiconductor device includes a semiconductor substrate, a Schottky layer, a plurality of first doped regions, a plurality of second doped regions, a first conductive layer and a second conductive layer. The semiconductor substrate includes a first conductive type, and the Schottky layer is disposed on the semiconductor substrate. The first doped regions and the second doped regions include a second conductive type, and which are disposed within the semiconductor substrate. The first doped regions are in parallel and extended along a first direction, and the second doped regions are in parallel and extended along a second direction to cross the first doped regions, thereby to define a plurality of grid areas. The first conductive layer is disposed on the Schottky layer, and the second conductive layer is disposed under the semiconductor substrate.

Abstract: A waterproof casing for packaging a circuit board is provided. The circuit board comprises an antenna. The waterproof casing comprises a metallic casing, a non-metallic end cover and a sealing gasket. The metallic casing comprises an accommodation space and a side opening in communication with each other. The accommodation space is configured to accommodate the circuit board. The antenna is adjacent to the side opening. The non-metallic end cover covers the side opening and combined with the metallic casing to form a sealed box. The non-metallic end cover comprises a ring-shaped install portion disposed on a surface thereof and extending outwardly from the surface. The ring-shaped install portion is disposed in the accommodation space as the non-metallic end cover covers the side opening. The sealing gasket is disposed around the ring-shaped install portion. A joint between the metallic casing and the non-metallic end cover is sealed by the sealing gasket.

Abstract: A toner cartridge is adapted for being connected with an image-forming cartridge of an electronic image-forming, which includes a toner inlet and a step portion located by the toner inlet. The toner cartridge includes a housing having an internal accommodation for storage of toners, a toner outlet communicated with the internal accommodation and an outside of the housing, and a position-limiting hook located by the toner outlet. When the toner cartridge is connected with the image-forming cartridge, the position-limiting hook is engaged with the step portion such that the toner outlet is communicated with the toner inlet. As such, the toner cartridge can be positively positioned with the image-forming cartridge, and the toner outlet can be positively sealed to avoid toner leaking before installation and after dismantlement of the toner cartridge.

Abstract: A toner cartridge is adapted for being connected with an image-forming cartridge of an electronic image-forming, which includes a toner inlet and a step portion located by the toner inlet. The toner cartridge includes a housing having an internal accommodation for storage of toners, a toner outlet communicated with the internal accommodation and an outside of the housing, and a position-limiting hook located by the toner outlet. When the toner cartridge is connected with the image-forming cartridge, the position-limiting hook is engaged with the step portion such that the toner outlet is communicated with the toner inlet. As such, the toner cartridge can be positively positioned with the image-forming cartridge, and the toner outlet can he positively sealed to avoid toner leaking before installation and after dismantlement of the toner cartridge.

Abstract: The invention provides a fingerprint sensor including a sensing array. The sensing array includes a plurality of sensing units to form a plurality of sensing regions arranged in an array. Each of the plurality of sensing regions includes at least one column of sensing units. A first part of the plurality of sensing regions receives a power signal to perform fingerprint sensing. A second part of the plurality of sensing regions does not receive a power signal. Therefore, the fingerprint sensor of the invention can provide a fast and energy-saving large-area fingerprint sensing effect.