Patents by Inventor Ching-hsiang Tsai
Ching-hsiang Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955460Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.Type: GrantFiled: October 5, 2020Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
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Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Publication number: 20240071954Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.Type: ApplicationFiled: November 9, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Publication number: 20240071953Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Publication number: 20230219188Abstract: A method of performing a chemical mechanical planarization (CMP) process includes holding a wafer by a retainer ring attached to a carrier, pressing the wafer against a first surface of a polishing pad, the polishing pad rotating at a first speed, dispensing a slurry on the first surface of the polishing pad, and generating vibrations at the polishing pad.Type: ApplicationFiled: February 24, 2023Publication date: July 13, 2023Inventors: Chun-Hao Kung, Shang-Yu Wang, Ching-Hsiang Tsai, Hui-Chi Huang, Kei-Wei Chen
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Publication number: 20230078573Abstract: A planarization method includes: providing a substrate, wherein the substrate includes a first region and a second region having different degrees of hydrophobicity or hydrophilicity, the second region covering an upper surface of the first region; polishing the substrate with a polishing slurry until the upper surface of the first region is exposed; and continuing polishing and performing a surface treatment by the polishing slurry to adjust the degree of hydrophobicity or hydrophilicity of at least one of the first region and the second region. The polishing slurry and the upper surface of the second region have a first contact angle, and the polishing slurry and the upper surface of the first region have a second contact angle. The surface treatment keeps a contact angle difference between the first contact angle and the second contact angle being equal to or less than 30 degrees during the polishing.Type: ApplicationFiled: June 23, 2022Publication date: March 16, 2023Inventors: TUNG-KAI CHEN, CHING-HSIANG TSAI, KAO-FENG LIAO, CHIH-CHIEH CHANG, CHUN-HAO KUNG, FANG-I CHIH, HSIN-YING HO, CHIA-JUNG HSU, HUI-CHI HUANG, KEI-WEI CHEN
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Patent number: 11590627Abstract: A method of performing a chemical mechanical planarization (CMP) process includes holding a wafer by a retainer ring attached to a carrier, pressing the wafer against a first surface of a polishing pad, the polishing pad rotating at a first speed, dispensing a slurry on the first surface of the polishing pad, and generating vibrations at the polishing pad.Type: GrantFiled: July 18, 2019Date of Patent: February 28, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chun-Hao Kung, Shang-Yu Wang, Ching-Hsiang Tsai, Hui-Chi Huang, Kei-Wei Chen
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Publication number: 20220350476Abstract: An electronic device, a method, and a computer-readable recording medium are provided for deactivating a chat room of a messenger application. The electronic device is configured for: receiving a deactivation request for one or more chat rooms, in which the deactivation request is associated with a chat room configuration, and the chat room configuration includes a deactivation condition for the one or more chat rooms; storing the chat room configuration including the deactivation condition for the one or more chat rooms based on the deactivation request; and deactivating the one or more chat rooms based on determining whether or not the deactivation condition for the one or more chat rooms is satisfied.Type: ApplicationFiled: July 13, 2022Publication date: November 3, 2022Applicants: LINE CORPORATION, LINE Plus CorporationInventors: Ching-hsiang TSAI, Chien-ju LIN, Man-chen WU, Kuan-wei LIN
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Patent number: 11373879Abstract: A planarization method and a CMP method are provided. The planarization method includes providing a substrate with a first region and a second region having different degrees of hydrophobicity or hydrophilicity and performing a surface treatment to the first region to render the degrees of hydrophobicity or hydrophilicity in proximity to that of the second region. The CMP method includes providing a substrate with a first region and a second region; providing a polishing slurry on the substrate, wherein the polishing slurry and the surface of the first region have a first contact angle, and the polishing slurry and the surface of the first region have a second contact angle; modifying the surface of the first region to make a contact angle difference between the first contact angle and the second contact angle equal to or less than 30 degrees.Type: GrantFiled: September 12, 2020Date of Patent: June 28, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Tung-Kai Chen, Ching-Hsiang Tsai, Kao-Feng Liao, Chih-Chieh Chang, Chun-Hao Kung, Fang-I Chih, Hsin-Ying Ho, Chia-Jung Hsu, Hui-Chi Huang, Kei-Wei Chen
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Publication number: 20210205950Abstract: A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.Type: ApplicationFiled: March 19, 2021Publication date: July 8, 2021Inventors: Shang-Yu Wang, Chun-Hao Kung, Ching-Hsiang Tsai, Kei-Wei Chen, Hui-Chi Huang
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Patent number: 10953514Abstract: A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.Type: GrantFiled: September 17, 2019Date of Patent: March 23, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shang-Yu Wang, Chun-Hao Kung, Ching-Hsiang Tsai, Kei-Wei Chen, Hui-Chi Huang
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Publication number: 20210078130Abstract: A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.Type: ApplicationFiled: September 17, 2019Publication date: March 18, 2021Inventors: Shang-Yu Wang, Chun-Hao Kung, Ching-Hsiang Tsai, Kei-Wei Chen, Hui-Chi Huang
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Publication number: 20210016415Abstract: A method of performing a chemical mechanical planarization (CMP) process includes holding a wafer by a retainer ring attached to a carrier, pressing the wafer against a first surface of a polishing pad, the polishing pad rotating at a first speed, dispensing a slurry on the first surface of the polishing pad, and generating vibrations at the polishing pad.Type: ApplicationFiled: July 18, 2019Publication date: January 21, 2021Inventors: Chun-Hao Kung, Shang-Yu Wang, Ching-Hsiang Tsai, Hui-Chi Huang, Kei-Wei Chen
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Publication number: 20200411329Abstract: A planarization method and a CMP method are provided. The planarization method includes providing a substrate with a first region and a second region having different degrees of hydrophobicity or hydrophilicity and performing a surface treatment to the first region to render the degrees of hydrophobicity or hydrophilicity in proximity to that of the second region. The CMP method includes providing a substrate with a first region and a second region; providing a polishing slurry on the substrate, wherein the polishing slurry and the surface of the first region have a first contact angle, and the polishing slurry and the surface of the first region have a second contact angle; modifying the surface of the first region to make a contact angle difference between the first contact angle and the second contact angle equal to or less than 30 degrees.Type: ApplicationFiled: September 12, 2020Publication date: December 31, 2020Inventors: TUNG-KAI CHEN, CHING-HSIANG TSAI, KAO-FENG LIAO, CHIH-CHIEH CHANG, CHUN-HAO KUNG, FANG-I CHIH, HSIN-YING HO, CHIA-JUNG HSU, HUI-CHI HUANG, KEI-WEI CHEN
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Patent number: 10783527Abstract: A computer-implemented method of providing seamless online video advertisements includes rendering a video advertisement on a first web page in a first tab. The computer-implemented method also includes recording current time of play constantly during the rendering of the video advertisement and receiving a request for a second web page in the first tab from the user. Further, the computer-implemented method includes unloading the first web page and loading the second web page in the first tab. Moreover, the computer-implemented method includes retrieving current time of play stored corresponding to the unloading and resume the rendering the video advertisement on the second web page based on the current time of play retrieved.Type: GrantFiled: November 20, 2011Date of Patent: September 22, 2020Assignee: Oath Inc.Inventors: Shawn Ching-Hsiang Tsai, Adam Chi-En Wang, Young Chung-Hau Yahg
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Patent number: 10777423Abstract: A planarization method and a CMP method are provided. The planarization method includes providing a substrate with a first region and a second region having different degrees of hydrophobicity or hydrophilicity and performing a surface treatment to the first region to render the degrees of hydrophobicity or hydrophilicity in proximity to that of the second region. The CMP method includes providing a substrate with a first region and a second region; providing a polishing slurry on the substrate, wherein the polishing slurry and the surface of the first region have a first contact angle, and the polishing slurry and the surface of the first region have a second contact angle; modifying the surface of the first region to make a contact angle difference between the first contact angle and the second contact angle equal to or less than 30 degrees.Type: GrantFiled: June 8, 2018Date of Patent: September 15, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Tung-Kai Chen, Ching-Hsiang Tsai, Kao-Feng Liao, Chih-Chieh Chang, Chun-Hao Kung, Fang-I Chih, Hsin-Ying Ho, Chia-Jung Hsu, Hui-Chi Huang, Kei-Wei Chen
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Publication number: 20190157103Abstract: A planarization method and a CMP method are provided. The planarization method includes providing a substrate with a first region and a second region having different degrees of hydrophobicity or hydrophilicity and performing a surface treatment to the first region to render the degrees of hydrophobicity or hydrophilicity in proximity to that of the second region. The CMP method includes providing a substrate with a first region and a second region; providing a polishing slurry on the substrate, wherein the polishing slurry and the surface of the first region have a first contact angle, and the polishing slurry and the surface of the first region have a second contact angle; modifying the surface of the first region to make a contact angle difference between the first contact angle and the second contact angle equal to or less than 30 degrees.Type: ApplicationFiled: June 8, 2018Publication date: May 23, 2019Inventors: TUNG-KAI CHEN, CHING-HSIANG TSAI, KAO-FENG LIAO, CHIH-CHIEH CHANG, CHUN-HAO KUNG, FANG-I CHIH, HSIN-YING HO, CHIA-JUNG HSU, HUI-CHI HUANG, KEI-WEI CHEN
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Patent number: 9172153Abstract: A mounting apparatus is used to mount a hard disk drive to a storage rack. The mounting apparatus includes a supporting frame and two grounding members. The supporting frame includes a handle, and two side brackets extending from opposite ends of the handle, and attached to opposite sides of the hard disk drive. Each grounding member is made of resilient and conductive material, and includes a mounting plate mounted to the side bracket, and two abutting plates extending out from two opposite ends of the mounting plate. A part of each abutting plate is exposed out of the corresponding side bracket. when the mounting apparatus mounting the hard disk drive in a storage rack, the abutting plates are sandwiched between the storage rack and the hard disk drive.Type: GrantFiled: October 17, 2013Date of Patent: October 27, 2015Assignee: ENNOCONN CORPORATIONInventors: Ching-Hsiang Tsai, Shih-Chi Liu
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Publication number: 20150077921Abstract: A mounting apparatus is used to mount a hard disk drive to a storage rack. The mounting apparatus includes a supporting frame and two grounding members. The supporting frame includes a handle, and two side brackets extending from opposite ends of the handle, and attached to opposite sides of the hard disk drive. Each grounding member is made of resilient and conductive material, and includes a mounting plate mounted to the side bracket, and two abutting plates extending out from two opposite ends of the mounting plate. A part of each abutting plate is exposed out of the corresponding side bracket. when the mounting apparatus mounting the hard disk drive in a storage rack, the abutting plates are sandwiched between the storage rack and the hard disk drive.Type: ApplicationFiled: October 17, 2013Publication date: March 19, 2015Applicant: ENNOCONN CORPORATIONInventors: CHING-HSIANG TSAI, SHIH-CHI LIU
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Patent number: 8873232Abstract: A supporting frame is used to mount a hard disk drive to a storage rack. The storage rack forms two protrusions protruding inwards from opposite sides of the storage rack. The supporting frame includes a handle and two side brackets resiliently connected to the handle. The side brackets are fixedly attached to opposite sides of the hard disk drive. The handle defines two locking holes. The protrusions of the storage rack are respectively engaged in the locking holes. When the handle is moved away from the hard disk drive, the handle is deformed to disengage the protrusions of the storage rack from the locking holes of the handle.Type: GrantFiled: September 12, 2012Date of Patent: October 28, 2014Assignee: Ennoconn CorporationInventors: Ching-Hsiang Tsai, Shih-Chi Liu