Patents by Inventor Ching Hsueh

Ching Hsueh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11043579
    Abstract: A method for manufacturing a semiconductor device includes forming a semiconductor fin on a substrate. A dummy gate structure is formed crossing the semiconductor fin. The dummy gate structure is replaced with a metal gate structure. An epitaxial structure is formed in the semiconductor fin after replacing the dummy gate structure with the metal gate structure.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: June 22, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Hao Wang, Wai-Yi Lien, Gwan-Sin Chang, Yu-Ming Lin, Ching Hsueh, Jia-Chuan You, Chia-Hao Chang
  • Publication number: 20200350422
    Abstract: A method for manufacturing a semiconductor device includes forming a semiconductor fin on a substrate. A dummy gate structure is formed crossing the semiconductor fin. The dummy gate structure is replaced with a metal gate structure. An epitaxial structure is formed in the semiconductor fin after replacing the dummy gate structure with the metal gate structure.
    Type: Application
    Filed: July 20, 2020
    Publication date: November 5, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Hao WANG, Wai-Yi LIEN, Gwan-Sin CHANG, Yu-Ming LIN, Ching HSUEH, Jia-Chuan YOU, Chia-Hao CHANG
  • Patent number: 10720514
    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a semiconductor fin, a first gate stack, and a first metal element-containing dielectric mask. The semiconductor fin protrudes from the substrate. The first gate stack is over the semiconductor fin. The first metal element-containing dielectric mask is over the first gate stack.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: July 21, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Hao Wang, Wai-Yi Lien, Gwan-Sin Chang, Yu-Ming Lin, Ching Hsueh, Jia-Chuan You, Chia-Hao Chang
  • Publication number: 20190013396
    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a semiconductor fin, a first gate stack, and a first metal element-containing dielectric mask. The semiconductor fin protrudes from the substrate. The first gate stack is over the semiconductor fin. The first metal element-containing dielectric mask is over the first gate stack.
    Type: Application
    Filed: August 17, 2018
    Publication date: January 10, 2019
    Inventors: Chih-Hao WANG, Wai-Yi LIEN, Gwan-Sin CHANG, Yu-Ming LIN, Ching HSUEH, Jia-Chuan YOU, Chia-Hao CHANG
  • Patent number: 10056473
    Abstract: A method for manufacturing a semiconductor device, including forming a dummy gate structure on a substrate, in which the substrate has a source/drain portion and a channel portion adjacent to the source/drain region, and the dummy gate structure is formed on the channel portion of the substrate; recessing at least a part of the source/drain portion to form a recess in the source/drain portion of the substrate; forming a stress material in the recess; replacing the dummy gate structure with a gate stack; removing the stress material in the recess after the replacing the dummy gate structure with the gate stack; and forming an epitaxy structure in the recess.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: August 21, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Hao Wang, Wai-Yi Lien, Gwan-Sin Chang, Yu-Ming Lin, Ching Hsueh, Jia-Chuan You, Chia-Hao Chang