Patents by Inventor Ching Hsueh

Ching Hsueh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120319292
    Abstract: Structure and fabricating method of a wafer level substrate for carrying light emitting devices are provided in present invention. The wafer level silicon substrate structure includes a first substrate and a second substrate. A metal line is constructed on a surface of the first substrate according to a predetermined pattern. The predetermined pattern is divided into a plurality of first portions and a plurality of second portions. The second substrate is adhered to the surface of the first substrate. The second substrate has a plurality of through holes. Each of the through holes is respectively corresponding to the first portions. Each of the first portions is adapted to electrically connect with a light emitting device. The provided wafer level substrate structure configured with light emitting devices is capable of providing uniform light output, having better light extraction property, improving process yield, higher production yield and achieving product uniformity.
    Type: Application
    Filed: June 15, 2011
    Publication date: December 20, 2012
    Applicant: HIMAX TECHNOLOGIES LIMITED
    Inventors: Sin-Hua Ho, Nai-Yuan Tang, Chuan-Ching Hsueh
  • Publication number: 20120273752
    Abstract: The present invention discloses a lateral-epitaxial-overgrowth thin-film LED with a nanoscale-roughened structure and a method for fabricating the same. The lateral-epitaxial-overgrowth thin-film LED with a nanoscale-roughened structure comprises a substrate, a metal bonding layer formed on the substrate, a first electrode formed on the metal bonding layer, a semiconductor structure formed on the first electrode with a lateral-epitaxial-growth technology, and a second electrode formed on the semiconductor structure, wherein a nanoscale-roughened structure is formed on the semiconductor structure except the region covered by the second electrode. The present invention uses lateral epitaxial growth to effectively inhibit the stacking faults and reduce the thread dislocation density in the semiconductor structure to improve the crystallization quality of the light-emitting layer and reduce leakage current.
    Type: Application
    Filed: June 23, 2011
    Publication date: November 1, 2012
    Inventors: Chia-Yu LEE, Chao-Hsun Wang, Ching-Hsueh Chiu, Hao-Chung Kuo
  • Patent number: 8194335
    Abstract: An optical lens on wafer level consists of a first optical component, a first spacer, a second optical component, at least a first via plug, and an adhesion material. The first spacer includes at least a first via plug passing through the first spacer, wherein the first optical component and the second optical component are separated by the first spacer. The adhesion material is coated in between the first optical component and the first spacer and coated in between the first spacer and the second optical component, and is filled in at least a portion of the first via plug.
    Type: Grant
    Filed: April 13, 2010
    Date of Patent: June 5, 2012
    Assignee: Himax Technologies Limited
    Inventor: Chuan-Ching Hsueh
  • Publication number: 20110249176
    Abstract: A wafer level lens module includes a first optical layer, a spacer layer and a second optical layer. The spacer layer is disposed upon the first optical layer, having a hole through the spacer layer for light passage, wherein a surface of the hole substantially avoids light reflection. And the second optical layer is disposed upon the spacer layer.
    Type: Application
    Filed: April 13, 2010
    Publication date: October 13, 2011
    Inventor: Chuan-Ching Hsueh
  • Publication number: 20110249350
    Abstract: An optical lens on wafer level consists of a first optical component, a first spacer, a second optical component, at least a first via plug, and an adhesion material. The first spacer includes at least a first via plug passing through the first spacer, wherein the first optical component and the second optical component are separated by the first spacer. The adhesion material is coated in between the first optical component and the first spacer and coated in between the first spacer and the second optical component, and is filled in at least a portion of the first via plug.
    Type: Application
    Filed: April 13, 2010
    Publication date: October 13, 2011
    Inventor: Chuan-Ching Hsueh
  • Patent number: 7517187
    Abstract: The invention provides a high-speed rotor assembly for an overhung centrifugal compressor comprising a housing, a rotor component, an oil film damper and an impeller, which is adapted for connecting to a power output mechanism, wherein the rotor component is arranged inside the housing, and the oil film damper is disposed between the impeller and the rotor component, and the impeller is coupled to the rotor component. The rotor component further comprises a sleeve, a first bearing, a second bearing, a transmission shaft, a plurality of resilient elements and a spacer, wherein an end of the sleeve is connected to one of the circular rib by a screw while another end thereof is handing freely, and a oil film damper is disposed between the sleeve and another circular rib.
    Type: Grant
    Filed: September 13, 2004
    Date of Patent: April 14, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Li-Chieh Hsu, Chien-Ching Hsueh, Jia-Ruey Wu, Hung-Ying Jan
  • Publication number: 20070127269
    Abstract: A frame structure for backlight modules is provided herein. A backlight module according to the present invention mainly contains a frame structure, a reflection plate, a light guide plate, optical films, and a light source unit. The frame structure contains a plate member and a frame member. There are a number of hook elements and clasp elements configured at corresponding locations along the edges of the plate member and the frame member respectively. Also along the edges of the plate member and frame member, there are a number of grooves and stopping blades configured at corresponding locations on the plate member and frame member respectively. When the frame member is joined to the plate member, their corresponding clasp elements and hook elements would interact to fixedly join together, and the stopping blades would stick into the corresponding grooves to prevent the frame member from deformation and escape under heavy pressure or strong impact.
    Type: Application
    Filed: December 2, 2005
    Publication date: June 7, 2007
    Inventors: Chun-Hsien Li, Ying Wang, Hui-Ching Hsueh
  • Patent number: 7226201
    Abstract: A frame structure for backlight modules is provided herein. A backlight module according to the present invention mainly contains a frame structure, a reflection plate, a light guide plate, optical films, and a light source unit. The frame structure contains a plate member and a frame member. There are a number of hook elements and clasp elements configured at corresponding locations along the edges of the plate member and the frame member respectively. Also along the edges of the plate member and frame member, there are a number of grooves and stopping blades configured at corresponding locations on the plate member and frame member respectively. When the frame member is joined to the plate member, their corresponding clasp elements and hook elements would interact to fixedly join together, and the stopping blades would stick into the corresponding grooves to prevent the frame member from deformation and escape under heavy pressure or strong impact.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: June 5, 2007
    Assignee: Radiant Opto-Electronics Corporation
    Inventors: Chun-Hsien Li, Ying Fu Wang, Hui-Ching Hsueh
  • Patent number: 7093968
    Abstract: A light guide plate (LGP) and LGP-based flat fluorescent panel (FFP) provides consistent light source for FFP to output consistent and high luminance light source for upgrading general light emitting efficacy to facilitate subsequent use of the light source by expanding incident angle for creating a scattering belt to destroy the total reflection of the light source passing through the scattering belt thus to avail better deflection to reduce light and shade stripes created in subsequent reflection.
    Type: Grant
    Filed: August 19, 2004
    Date of Patent: August 22, 2006
    Assignee: Radiant Opto-Electronics Corporation
    Inventors: Hui-Ching Hsueh, Yen-Chuan Chu, Ying-Fu Wang
  • Publication number: 20060039167
    Abstract: A light guide plate (LGP) and LGP-based flat fluorescent panel (FFP) provides consistent light source for FFP to output consistent and high luminance light source for upgrading general light emitting efficacy to facilitate subsequent use of the light source by expanding incident angle for creating a scattering belt to destroy the total reflection of the light source passing through the scattering belt thus to avail better deflection to reduce light and shade stripes created in subsequent reflection.
    Type: Application
    Filed: August 19, 2004
    Publication date: February 23, 2006
    Inventors: Hui-Ching Hsueh, Yen-Chuan Chu, Ying-Fu Wang
  • Publication number: 20050129538
    Abstract: The invention provides a high-speed rotor assembly for an overhung centrifugal compressor comprising a housing, a rotor component, an oil film damper and an impeller, which is adapted for connecting to a power output mechanism, wherein the rotor component is arranged inside the housing, and the oil film damper is disposed between the impeller and the rotor component, and the impeller is coupled to the rotor component. The rotor component further comprises a sleeve, a first bearing, a second bearing, a transmission shaft, a plurality of resilient elements and a spacer, wherein an end of the sleeve is connected to one of the circular rib by a screw while another end thereof is handing freely, and a oil film damper is disposed between the sleeve and another circular rib.
    Type: Application
    Filed: September 13, 2004
    Publication date: June 16, 2005
    Inventors: Li-Chieh Hsu, Chien-Ching Hsueh, Jia-Ruey Wu, Hung-Ying Jan