Abstract: A metric based performance monitoring A process control system is disclosed in which diagnostics are performed at multiple levels of the plant, results of the diagnostics converted into Key Performance Indicators and compared to predetermined benchmarks such that an integrated and overall determination of the plants' performance may be displayed.

Abstract: The invention is a system for assessing and diagnosing performance of a control loop, comprising a Data Collection Section which collects data of two parameters of the control loop for an installed valve. The data collected is processed in a Linear Regression Section to generate a linear regression. A User Setting Port is provided to define the tolerance band and the boundary points. The generated linear regression, together with the defined tolerance band and boundary points are processed in a Linear Approximation Section to generate an acceptable reference region.

Abstract: The present invention is a wafer level integrating method for bonding an un-sliced wafer including image sensors and a wafer-sized substrate including optical components thereon. A zeroth order light reflective substrate is provided between the un-sliced wafer and the wafer-sized substrate. The image sensors are either CMOS or CCD image sensors. The wafer-sized substrate is a transparent plate and the optical components thereon include a blazed grating, a two-dimensional microlens array or other optical-functional elements. The wafer-sized substrate is bonded onto the zeroth order light reflective substrate by an appropriate optical adhesive to form a composite substrate. Bonding pads and bumps are provided at corresponding positions on the bonding surface of the un-sliced wafer and the composite substrate respectively so that the composite substrate and the un-sliced wafer can be bonded together through a reflow process.

Abstract: An optical apparatus made for either imaging or light-blurring application is disclosed. The optical apparatus has two arrays of one-dimensional optical elements. Each of the two arrays has a number of elongated cylindrical optical elements arrayed consecutively in parallel and spreading along a first extension-profiling direction generally orthogonal to their longitudinal axes. The two arrays are superposed together with their general direction extension profile twisted with respect to each other at a selected angle. The superposition spreads an extended layer of optical system having a number of lens units formed from the superposition. All the lens units are arrayed in a two-dimensional matrix of moire fringe. More than two arrays of one-dimensional optical elements can be used to construct an optical apparatus.

Abstract: The present invention is a wafer level integrating method for bonding an un-sliced wafer including image sensors and a wafer-sized substrate including optical components thereon. A zeroth order light reflective substrate is provided between the un-sliced wafer and the wafer-sized substrate. The image sensors are either CMOS or CCD image sensors. The wafer-sized substrate is a transparent plate and the optical components thereon include a blazed grating, a two-dimensional microlens array or other optical-functional elements. The wafer-sized substrate is bonded onto the zeroth order light reflective substrate by an appropriate optical adhesive to form a composite substrate. Bonding pads and bumps are provided at corresponding positions on the bonding surface of the un-sliced wafer and the composite substrate respectively so that the composite substrate and the un-sliced wafer can be bonded together through a reflow process.

Abstract: An image sensor apparatus for converting an incident light into electric signal is disclosed. The apparatus has a color separation layer that comprises a body layer for receiving incident light. A surface of the body layer is covered by a two-dimensional microlens array of lenslets, and the other surface of the body layer is covered by a blazed diffraction grating layer. A zeroth-order reflection layer is disposed behind the color separation layer along the path of the incident light for reflecting away zeroth-order component of the incident light. An image sensor array is disposed further behind the zeroth-order reflection layer along the path of the incident light and comprises a two-dimensional array of light-sensing cells.