Abstract: An active alignment machine includes a base, a first pillar, a second pillar, a distribution module, a first alignment module, a second alignment module and a third alignment module. The first pillar has a first pillar top surface. The second pillar has a second pillar top surface. The first pillar top surface and the second pillar top surface cooperatively support plural assembling specifications. The distribution module is installed on the base and arranged between the first pillar and the second pillar. The first alignment module, the second alignment module and third alignment module are replaceable to be assembled with or dissembled from the first pillar top surface and the second pillar top surface. The first alignment module, the second alignment module and third alignment module work with the distribution module to perform the active alignment on a first-type product, a second-type product and a third-type product, respectively.

Abstract: A method of manufacturing a bump structure includes forming a passivation layer over a substrate. A metal pad structure is formed over the substrate, wherein the passivation layer surrounds the metal pad structure. A polyimide layer including a polyimide is formed over the passivation layer and the metal pad structure. A metal bump is formed over the metal pad structure and the polyimide layer. The polyimide is a reaction product of a dianhydride and a diamine, wherein at least one of the dianhydride and the diamine comprises one selected from the group consisting of a cycloalkane, a fused ring, a bicycloalkane, a tricycloalkane, a bicycloalkene, a tricycloalkene, a spiroalkane, and a heterocyclic ring.

Abstract: A lens module and a manufacturing method of the lens module are provided. The manufacturing method includes the following steps. Firstly, a circuit substrate is provided. Then, an image sensor chip is placed on a top surface of the circuit substrate. Then, plural electrical connection paths are formed between the image sensor chip and the circuit substrate. Then, plural stacking spacer structures are formed on a top surface of the image sensor chip by a stacking process. Then, plural protective sidewalls are formed to cover the electrical connection paths. Then, a glass substrate is placed over the stacking spacer structures. Then, a lens holder structure is placed on a substrate top surface of the glass substrate directly. The glass substrate is supported by the stacking spacer structures. Consequently, the glass substrate can be maintained at the position over the image sensor chip.

Abstract: A lens module and a manufacturing method of the lens module are provided. The manufacturing method includes the following steps. Firstly, a circuit substrate is provided. Then, an image sensor chip is placed on a top surface of the circuit substrate. Then, plural electrical connection paths are formed between the image sensor chip and the circuit substrate. Then, plural stacking spacer structures are formed on a top surface of the image sensor chip by a stacking process. Then, plural protective sidewalls are formed to cover the electrical connection paths. Then, a glass substrate is placed over the stacking spacer structures. Then, a lens holder structure is placed on a substrate top surface of the glass substrate directly. The glass substrate is supported by the stacking spacer structures. Consequently, the glass substrate can be maintained at the position over the image sensor chip.

Abstract: An active alignment machine includes a base, a first pillar, a second pillar, a distribution module, a first alignment module, a second alignment module and a third alignment module. The first pillar has a first pillar top surface. The second pillar has a second pillar top surface. The first pillar top surface and the second pillar top surface cooperatively support plural assembling specifications. The distribution module is installed on the base and arranged between the first pillar and the second pillar. The first alignment module, the second alignment module and third alignment module are replaceable to be assembled with or dissembled from the first pillar top surface and the second pillar top surface. The first alignment module, the second alignment module and third alignment module work with the distribution module to perform the active alignment on a first-type product, a second-type product and a third-type product, respectively.

Abstract: A miniature image pickup module and a manufacturing method are provided. The manufacturing method includes the following steps. In a step (a), a substrate with two vertical conductor lines is provided. In a step (b), a photosensitive element is provided. The photosensitive element is fixed on the substrate. The two vertical conductor lines are penetrated through two openings of the photosensitive element. Moreover, first ends of the vertical conductor lines are located away from the substrate and partially exposed to a top surface of the photosensitive element. In a step (c), the first ends of the vertical conductor lines are electrically connected with the corresponding bonding pads. In a step (d), a lens module is fixed on the substrate to cover a top side of the photosensitive element, so that the miniature image pickup module is manufactured.

Abstract: A fingerprint identification module includes a substrate, a fingerprint sensor die, a covering adhesive layer, a cover plate and a mold compound layer. The fingerprint sensor die is attached on the substrate for sensing a fingerprint image. The covering adhesive layer is formed on a top surface of the fingerprint sensor die. The cover plate is attached on the covering adhesive layer. The mold compound layer is formed over the substrate. The fingerprint sensor die, the covering adhesive layer and the cover plate over the substrate are molded together through the mold compound layer, and the cover plate is exposed. The fingerprint identification module has small thickness and enhanced sensing accuracy.

Abstract: A fingerprint identification module includes a substrate, a sensing die, a mold compound layer and a circuit board. The substrate includes plural electrical contacts. The plural electrical contacts are exposed outside the substrate. The sensing die is attached on the substrate and electrically connected with the substrate so as to sense a fingerprint image. The mold compound layer is formed on the substrate to encapsulate the sensing die. The circuit board includes plural connection pads. The circuit board and the substrate are electrically connected with each other through the plural connection pads and the plural electrical contacts. The substrate and the circuit board are not integrally formed with each other.

Abstract: A fingerprint identification module includes a substrate, a sensing die, a mold compound layer and a circuit board. The substrate includes plural electrical contacts. The plural electrical contacts are exposed outside the substrate. The sensing die is attached on the substrate and electrically connected with the substrate so as to sense a fingerprint image. The mold compound layer is formed on the substrate to encapsulate the sensing die. The circuit board includes plural connection pads. The circuit board and the substrate are electrically connected with each other through the plural connection pads and the plural electrical contacts. The substrate and the circuit board are not integrally formed with each other.

Abstract: A fingerprint identification module includes a substrate, a fingerprint sensor die, a covering adhesive layer, a cover plate and a mold compound layer. The fingerprint sensor die is attached on the substrate for sensing a fingerprint image. The covering adhesive layer is formed on a top surface of the fingerprint sensor die. The cover plate is attached on the covering adhesive layer. The mold compound layer is formed over the substrate. The fingerprint sensor die, the covering adhesive layer and the cover plate over the substrate are molded together through the mold compound layer, and the cover plate is exposed. The fingerprint identification module has small thickness and enhanced sensing accuracy.

Abstract: A fingerprint identification module includes a substrate, a fingerprint sensor die, a cover plate and a mold compound layer. The fingerprint sensor die is attached on the substrate for sensing a fingerprint image. The mold compound layer is formed over the substrate. The fingerprint sensor die and the cover plate over the substrate are molded together through the mold compound layer, and the cover plate is exposed. The fingerprint identification module has small thickness and enhanced sensing accuracy.

Abstract: A shift register of a gate driving circuit includes a pull-up unit for pulling up a first output signal and a first gate signal to a high voltage level according to a driving voltage and a high-frequency clock signal, a start-up unit for transmitting a second gate signal, an energy-store unit for providing the driving voltage to the pull-up unit according to the second gate signal, a first discharging unit for pulling down the driving voltage to a first voltage level according to a first control signal, a first leakage-preventing unit for turning off the first discharging unit when the first gate signal reaches the high voltage level, a first pull-down unit for respectively pulling down the first output and first gate signals to the first and a second voltage levels according to the first control signal, and a first control unit for generating the first control signal.

Abstract: A shift register of a gate driving circuit includes a pull-up unit for pulling up a first output signal and a first gate signal to a high voltage level according to a driving voltage and a high-frequency clock signal, a start-up unit for transmitting a second gate signal, an energy-store unit for providing the driving voltage to the pull-up unit according to the second gate signal, a first discharging unit for pulling down the driving voltage to a first voltage level according to a first control signal, a first leakage-preventing unit for turning off the first discharging unit when the first gate signal reaches the high voltage level, a first pull-down unit for respectively pulling down the first output and first gate signals to the first and a second voltage levels according to the first control signal, and a first control unit for generating the first control signal.

Abstract: The embodiment of invention provides a method for producing ?-aminobutyric acid, including the steps of providing a medium including Saccharomyces cerevisiae, adding an extract of Rhinacanthus nasutus into the medium and fermentating Saccharomyces cerevisiae in the medium added with the extract of Rhinacanthus nasutus to produce ?-aminobutyric acid.

Abstract: Film-on-wire (FOW) based IC devices and FOW based methods for IC packaging are described. In an embodiment, a method for packaging an IC dies involves applying a film layer to IC dies and bond wires that are attached to a substrate or a leadframe to form a film-on-wire layer, where the IC dies and the bond wires are enclosed by the film-on-wire layer, and cutting the substrate or the leadframe into IC devices. Other embodiments are also described. The FOW based method for IC packaging can eliminate the need for molding in the IC packaging process and consequently, can reduce the cost of IC packaging and the dimensions of packaged IC devices.

Abstract: The embodiment of invention provides a method for producing ?-aminobutyric acid, including the steps of providing a medium including Saccharomyces cerevisiae, adding an extract of Rhinacanthus nasutus into the medium and fermentating Saccharomyces cerevisiae in the medium added with the extract of Rhinacanthus nasutus to produce ?-aminobutyric acid.

Abstract: An electronic device carrier comprising a base and rolling devices. When an electronic device is removed from a receiving chamber of the base, the rolling devices can reduce friction effectively and resilient force of the rolling device can fix the electronic device in the receiving chamber. The electronic device carrier further includes a transmission unit for transmitting data whenever the electronic device is positioned in the receiving chamber.

Abstract: A modular keyboard includes an upper casing, a lower casing corresponding to the upper casing, an electric conduction element and a circuit board. The upper casing includes a first side and a second side opposite to each other, and a plurality of press keys disposed on the first side. The lower casing is set for sealing the second side, and an enclosure space is formed between the upper casing and the lower casing. The electric conduction element is installed on the second side in the enclosure space, and the circuit board is installed between the electric conduction element and the lower casing. With a supersonic welding technique, the upper casing and the lower casing are engaged with each other to seal the enclosure space and isolate the electric conduction element in the enclosure space and the circuit board from the exterior.

Abstract: PCB or similar material is used for stiffener rings supporting heat sinks in Flip Chip Ball Grid Array (FCBGA) packages. The substrate material of the package and the stiffener ring share the same or similar Coefficient of Thermal Expansion. Stiffener rings may be manufactured from PCB or similar material using a router.

Abstract: A fixing structure for a battery positions the battery in a casing of an electronic device. The fixing structure includes at least a connecting portion, at least a locking portion, and a receiving portion. The connecting portion is on one side of the battery and with a waterproof element. The locking portion is on the other side of the battery and is opposite to the connecting portion. The receiving portion is on the casing and with a first inserting portion and a plurality of second inserting portions. The first inserting portion and the second inserting portions correspond in position to the connecting portion and the locking portion respectively. Hence, the fixing structure protects the electronic device against permeation of water and ensures secure positioning of the battery.