Abstract: A fixing structure for a battery positions the battery in a casing of an electronic device. The fixing structure includes at least a connecting portion, at least a locking portion, and a receiving portion. The connecting portion is on one side of the battery and with a waterproof element. The locking portion is on the other side of the battery and is opposite to the connecting portion. The receiving portion is on the casing and with a first inserting portion and a plurality of second inserting portions. The first inserting portion and the second inserting portions correspond in position to the connecting portion and the locking portion respectively. Hence, the fixing structure protects the electronic device against permeation of water and ensures secure positioning of the battery.

Abstract: An electronic device carrier comprising a base and rolling devices. When an electronic device is removed from a receiving chamber of the base, the rolling devices can reduce friction effectively and resilient force of the rolling device can fix the electronic device in the receiving chamber. The electronic device carrier further includes a transmission unit for transmitting data whenever the electronic device is positioned in the receiving chamber.

Abstract: A fixing structure for a battery positions the battery in a casing of an electronic device. The fixing structure includes at least a connecting portion, at least a locking portion, and a receiving portion. The connecting portion is on one side of the battery and with a waterproof element. The locking portion is on the other side of the battery and is opposite to the connecting portion. The receiving portion is on the casing and with a first inserting portion and a plurality of second inserting portions. The first inserting portion and the second inserting portions correspond in position to the connecting portion and the locking portion respectively. Hence, the fixing structure protects the electronic device against permeation of water and ensures secure positioning of the battery.

Abstract: A modular keyboard includes an upper casing, a lower casing corresponding to the upper casing, an electric conduction element and a circuit board. The upper casing includes a first side and a second side opposite to each other, and a plurality of press keys disposed on the first side. The lower casing is set for sealing the second side, and an enclosure space is formed between the upper casing and the lower casing. The electric conduction element is installed on the second side in the enclosure space, and the circuit board is installed between the electric conduction element and the lower casing. With a supersonic welding technique, the upper casing and the lower casing are engaged with each other to seal the enclosure space and isolate the electric conduction element in the enclosure space and the circuit board from the exterior.

Abstract: A liquid crystal module comprises at least a liquid crystal panel with a display side and a liquid crystal side corresponding to each other, wherein at least one portion of the liquid crystal side is a heating portion, such that the heating portion can be driven to heat the liquid crystal side when the temperature of the environmental is under a liquid crystal working temperature. In addition, a liquid crystal anti-freeze method for the liquid crystal module is disclosed.

Abstract: A semiconductor package structure includes a semiconductor component, a substrate, solder bumps, underfill, a buffer means, and solder balls. The substrate is under the semiconductor component. A joint area is formed between the first surface of the semiconductor and the upper surface of the substrate. Several solder bumps are disposed in the joint area, for electrically connecting the semiconductor component and the substrate. The underfill is filled in the joint area, for coating the solder bumps and tightly jointing the semiconductor component and the substrate. The buffer means is situated in the jointing area, for buffering the underfill to be confined in the joint area. Several solder balls are disposed on the lower surface of the substrate.

Abstract: A semiconductor package structure includes a semiconductor component, a substrate, solder bumps, underfill, a buffer means, and solder balls. The substrate is under the semiconductor component. A joint area is formed between the first surface of the semiconductor and the upper surface of the substrate. Several solder bumps are disposed in the joint area, for electrically connecting the semiconductor component and the substrate. The underfill is filled in the joint area, for coating the solder bumps and tightly jointing the semiconductor component and the substrate. The buffer means is situated in the jointing area, for buffering the underfill to be confined in the joint area. Several solder balls are disposed on the lower surface of the substrate.

Abstract: A system in package structure includes a first substrate, a first chip, a first heat-dissipating component, a second substrate, and a second chip. In this case, the first chip is formed on and electrically connected to the first substrate, and the first heat-dissipating component having a heat-conducting portion is formed above the first chip. The second chip is formed on and electrically connected to the second substrate. The second substrate is set above the first heat-dissipating component and electrically connected to the first substrate.

Abstract: Equipment and process for fluid purification and recovery for separating at least two matters contained in a gas or fluid including cooling a fluid to a low temperature range by use of a cooling system so that the matters in the fluid exhibit at least two phases, and filtering at least one of the matters using a filter device. The fluid may be distilled using a heating system prior to its entrance into the cooling system so as to help separate and purify the matters.