Abstract: A device including a substrate, a front-end module circuit situated over the substrate and configured to provide radio frequency communications, and a wafer-level chip-scale package circuit situated over the front-end module circuit and connected to the front-end module circuit and configured to provide passive components for radio frequency communications.

Abstract: The present utility model discloses a shelf with lighting effect, which vertically spaces a plurality of mounting frames, connects them respectively among a plurality of upright columns; the said mounting frames are installed with support plates to form a vertical shelf with a plurality of compartments, each of which can be used to hold objects; on the side of the mounting frames is arranged with at least one lamp groove, and in the lamp grooves are arranged with LED light strips electrically connected with the power supply subassembly to provide lighting effect for the objects placed on the support plates.

Abstract: A semiconductor device includes a semiconductor substrate, a conductive pad over the semiconductor substrate, a conductive bump, a conductive cap over the conductive bump, and a passivation layer. The conductive pad is over the semiconductor substrate. The conductive bump is over the conductive pad, wherein the conductive bump has a stepped sidewall structure including a lower sidewall, an upper sidewall laterally offset from the lower sidewall, and an intermediary surface laterally extending from a bottom edge of the upper sidewall to a top edge of the lower sidewall. The conductive cap is over the conductive bump. The passivation layer is over the semiconductor substrate and laterally surrounds the conductive bump, wherein the passivation layer has a top surface higher than the intermediary surface of the stepped sidewall structure of the conductive bump and lower than a top surface of conductive cap.

Abstract: A method includes depositing a plurality of layers on a substrate, patterning a first mask overlying the plurality of layers, and performing a first etching process on the plurality of layers using the first mask. The method also includes forming a polymer material along sidewalls of the first mask and sidewalls of the plurality of layers, and removing the polymer material. The method also includes performing a second etching process on the plurality of layers using the remaining first mask, where after the second etching process terminates a combined sidewall profile of the plurality of layers comprises a first portion and a second portion, and a first angle of the first portion and a second angle of the second portion are different to each other.

Abstract: The present disclosure provides systems, methods, and computer program products for modeling dependencies throughout a network using a global-self attention model with a content attention layer and a positional attention layer that operate in parallel. The model receives input data comprising content values and context positions. The content attention layer generates one or more output features for each context position based on a global attention operation applied to the content values independent of the context positions. The positional attention layer generates an attention map for each of the context positions based on one or more content values of the respective context position and associated neighboring positions. Output is determined based on the output features generated by the content attention layer and the attention map generated for each context position by the positional attention layer. The model improves efficiency and can be used throughout a deep network.

Abstract: A display device includes a semiconductor substrate, an isolation layer, a light-emitting layer and a second electrode. The semiconductor substrate has a pixel region and a peripheral region located around the pixel region. The semiconductor substrate includes first electrodes and a driving element layer. The first electrodes are disposed in the pixel region and the first electrodes are electrically connected to the driving element layer. The isolation layer is disposed on the semiconductor substrate. The isolation layer includes a first isolation pattern disposed in the peripheral region, and the first isolation pattern has a first side surface and a second side surface opposite to the first side surface. The light-emitting layer is disposed on the isolation layer and the first electrodes, and covers the first side surface and the second side surface of the first isolation pattern. The second electrode is disposed on the light-emitting layer.

Abstract: Systems and methods of the present disclosure are directed to a method for training a machine-learned visual attention model. The method can include obtaining image data that depicts a head of a person and an additional entity. The method can include processing the image data with an encoder portion of the visual attention model to obtain latent head and entity encodings. The method can include processing the latent encodings with the visual attention model to obtain a visual attention value and processing the latent encodings with a machine-learned visual location model to obtain a visual location estimation. The method can include training the models by evaluating a loss function that evaluates differences between the visual location estimation and a pseudo visual location label derived from the image data and between the visual attention value and a ground truth visual attention label.

Abstract: A method includes depositing a plurality of layers on a substrate, patterning a first mask overlying the plurality of layers, and performing a first etching process on the plurality of layers using the first mask. The method also includes forming a polymer material along sidewalls of the first mask and sidewalls of the plurality of layers, and removing the polymer material. The method also includes performing a second etching process on the plurality of layers using the remaining first mask, where after the second etching process terminates a combined sidewall profile of the plurality of layers comprises a first portion and a second portion, and a first angle of the first portion and a second angle of the second portion are different to each other.

Abstract: The present utility model discloses a column and a combined lamp equipped with the column, the column in the present utility model can be formed by a single column body or formed by a plurality of columns which are connected in a vertically adjacent manner; the LED light strips on two adjacent columns can be connected via the conductive subassembly; when the column is used to form the frame of the combined lamp, the LED light strip(s) arranged on the column body can be used for lighting to increase the illumination intensity of the combined lamp and the diversity of the frame of the combined lamp and thus improve the practicability of the combined lamp.

Abstract: At training time, a base neural network can be trained to perform each of a plurality of basis subtasks included in a total set of basis subtasks (e.g., individually or some combination thereof). Next, a description of a desired combined subtask can be obtained. Based on the description of the combined subtask, a mask generator can produce a pruning mask which is used to prune the base neural network into a smaller combined-subtask-specific network that performs only the two or more basis subtasks included in the combined subtask.

Abstract: A method includes forming a first dielectric layer over a conductive pad, forming a second dielectric layer over the first dielectric layer, and etching the second dielectric layer to form a first opening, with a top surface of the first dielectric layer exposed to the first opening. A template layer is formed to fill the first opening. A second opening is then formed in the template layer and the first dielectric layer, with a top surface of the conductive pad exposed to the second opening. A conductive pillar is formed in the second opening.

Abstract: The present utility model discloses a lampshade comprising fasteners, a lampshade body and support frames; the lampshade body comprises a light transmitting sheet and a piece of lampshade cloth; the bottom and/or top of the lampshade body are/is designed with soft band-shaped reinforcing ribs which extend in the length direction of the side wall surface and cover the lampshade body and prop up against at least one fastener; in the present utility model, the bottom and/or top of the lampshade body are/is designed with soft band-shaped reinforcing ribs which extend in the length direction of the side wall surface, the integration of the reinforcing ribs and the matching fasteners with the flexibility of the soft material makes the lampshade easy to be packaged and reduce the volume of its package and finally lower the transportation cost.

Abstract: A method of manufacturing a semiconductor device including operations including the operations of forming a ground plane over a substrate, forming a first conductive pillar in contact with the ground plane and attaching a die to the substrate, electrically isolating the die from the first conductive pillar with a dielectric fill material, forming a dielectric pad of a high-? dielectric material (having a ? of at least 7 Farads/meter) at an end of the first conductive pillar opposite the ground plane, forming an antenna pad over the dielectric pad, and establishing an electrical connection between the antenna pad and the die.

Abstract: A device includes a ground plane electrically connected to a proximal end of at least one conductive pillar and an antenna pad substantially parallel to the ground plane, wherein the antenna pad is separated from a distal end of the at least one conductive pillar by a dielectric pad having a first dielectric constant, wherein the ground plane, the at least one conductive pillar, and the dielectric pad surround an antenna cavity filled with a dielectric fill material having a second dielectric constant different from the first dielectric constant.