Abstract: Redistribution circuit structures and methods of forming the same are disclosed. One of the redistribution circuit structures includes a first conductive structure, a dielectric layer and a second conductive structure. The dielectric layer is disposed over and exposes a portion of the first conductive structure. The second conductive structure is disposed in the dielectric layer to electrically connect to the first conductive structure, and includes a first conductive layer and a second conductive layer disposed on and electrically connected to the first conductive layer. The first conductive layer includes a main portion and a conductive protrusion, the conductive protrusion is disposed on an entire edge of an upper surface of the main portion, and a top of the conductive protrusion is higher than the upper surface of the main portion.

Abstract: A quick release pedal for a bicycle essentially includes a pedal body, a shaft and an outer nut. By lengthening the assembling portion of the shaft, the assembling portion can extend out of the shaft hole of the pedal body, and the outer nut is added and disposed on the assembling portion and can be assembled and disassembled with a pneumatic tool to accelerate assembling or disassembling of the pedal, effectively shortening the assembling man-hour and reducing labor cost. The pedal is assembled from another end of the pedal body, which improves the defects of the conventional operation space being narrow and small, significantly expands the operation space to enable the assembler to perform assembling in a more ergonomic manner, therefore, the assembler will not be fatigued during the assembling process, and the assembling will be smooth, convenient and safe.

Abstract: A method performed by an electronic device is described. The method includes receiving a set of images. The method also includes determining a motion region and a static region based on the set of images. The method further includes extracting, at a first rate, first features from the motion region. The method additionally includes extracting, at a second rate that is different from the first rate, second features from the static region. The method also includes caching the second features. The method further includes detecting at least one object based on at least a portion of the first features.

Abstract: A semiconductor device comprises a semiconductor substrate, a conductive pad over the semiconductor substrate, a conductive bump over the conductive pad, a conductive cap over the conductive bump, and a passivation layer over the semiconductor substrate and surrounding the conductive bump. A combination of the conductive bump and the conductive cap has a stepped sidewall profile. The passivation layer has an inner sidewall at least partially facing and spaced apart from an outer sidewall of the conductive bump.

Abstract: Semiconductor devices are provided. The semiconductor device includes a first dielectric layer, a bump, an etching stop layer and a spacer. The first dielectric layer is disposed over and exposes a conductive structure. The bump is partially disposed in the first dielectric layer to electrically connect the conductive structure. The etching stop layer is disposed over the first dielectric layer aside the bump. The spacer surrounds the bump and disposed between the etching stop layer and the bump.

Abstract: A semiconductor device includes a semiconductor substrate. A pad region is disposed on the semiconductor substrate. A micro bump is disposed on the pad region. The micro bump has a first portion on the pad region and a second portion on the first portion. The first portion and the second portion have different widths. The first portion has a first width and the second portion has a second width. The first width is larger or smaller than the second width. The micro bump includes nickel and gold. The semiconductor device also includes a passivation layer overlying a portion of the pad region.

Abstract: The present invention discloses a lamp, which comprises a lamp seat installed in a base. The lamp seat is electrically connected with a circuit board. At least one USB interface includes a cartridge disposed in the base and a USB socket module disposed inside the cartridge. A wall of the cartridge, which is corresponding to the socket of the USB socket module, has at least one opening. The interface of an external USB data line can be passed through the opening and inserted into the socket of the USB socket module. The USB socket module is separated from the circuit board and electrically connected with the circuit board through cables. Therefore, the USB interface is reduced to a smaller size and requires less space for installation. Thus, the position for installing the USB interface has higher selectivity, and the overall esthetics of the base is improved.

Abstract: Semiconductor packages and methods of forming the same are disclosed. The semiconductor package includes a plurality of chips, a first molding compound, a first redistribution structure, a second molding compound and a second redistribution structure. The first molding compound encapsulates the chips. The first redistribution structure is disposed over the plurality of chips and the first molding compound. The second molding compound surrounds the first molding compound. The second redistribution structure is disposed over the first redistribution structure, the first molding compound and the second molding compound.

Abstract: A semiconductor device and a manufacturing method for the semiconductor device are provided. The semiconductor device includes a first dielectric layer, a bump, an etching stop layer and a spacer. The first dielectric layer is disposed over and exposes a conductive structure. The bump is partially disposed in the first dielectric layer to electrically connect the conductive structure. The etching stop layer is disposed over the first dielectric layer aside the bump a spacer and surrounds the bump and disposed between the etching stop layer and the bump.

Abstract: The present invention discloses a lamp device, which comprises a base, a lamp seat installed in the base and electrically connected with a circuit board, at least one USB interface, and a lamp shade hooding the lamp seat thereinside. The USB interface includes a cartridge disposed in the base and a USB socket module disposed inside the cartridge. The USB socket module is separated from the circuit board and electrically connected with the circuit board through cables. A wall of the cartridge has at least one opening. The interface of an external USB data line can be passed through the opening and inserted into the socket of the USB socket module. The USB interface is reduced to a smaller size and requires less space for installation. Therefore, the position for installing the USB interface has higher selectivity, and the overall esthetics of the base is improved.

Abstract: A semiconductor device and a manufacturing method for the semiconductor device are provided. The semiconductor device includes a first dielectric layer, a bump, an etching stop layer and a spacer. The first dielectric layer is disposed over and exposes a conductive structure. The bump is partially disposed in the first dielectric layer to electrically connect the conductive structure. The etching stop layer is disposed over the first dielectric layer aside the bump a spacer and surrounds the bump and disposed between the etching stop layer and the bump.

Abstract: A semiconductor device includes a semiconductor substrate. A pad region is disposed on the semiconductor substrate. A micro bump is disposed on the pad region. The micro bump has a first portion on the pad region and a second portion on the first portion. The first portion and the second portion have different widths. The first portion has a first width and the second portion has a second width. The first width is larger or smaller than the second width. The micro bump includes nickel and gold. The semiconductor device also includes a passivation layer overlying a portion of the pad region.

Abstract: A semiconductor structure includes an interconnect structure, at least one first metal pad, at least one second metal pad, at least one first bump, at least one second bump, at least one photosensitive material, and a bonding layer. The first metal pad and the second metal pad are disposed on and electrically connected to the interconnect structure. The first bump is disposed on the first metal pad. The second bump is disposed on the second metal pad. The photosensitive material is disposed on the first bump. The bonding layer is in contact with the photosensitive material and the second bump. The photosensitive material is disposed between the first bump and the bonding layer.

Abstract: A semiconductor structure includes an interconnect structure, at least one first metal pad, at least one second metal pad, at least one first bump, at least one second bump, at least one photosensitive material, and a bonding layer. The first metal pad and the second metal pad are disposed on and electrically connected to the interconnect structure. The first bump is disposed on the first metal pad. The second bump is disposed on the second metal pad. The photosensitive material is disposed on the first bump. The bonding layer is in contact with the photosensitive material and the second bump. The photosensitive material is disposed between the first bump and the bonding layer.

Abstract: A method includes forming a first dielectric layer over a conductive pad, forming a second dielectric layer over the first dielectric layer, and etching the second dielectric layer to form a first opening, with a top surface of the first dielectric layer exposed to the first opening. A template layer is formed to fill the first opening. A second opening is then formed in the template layer and the first dielectric layer, with a top surface of the conductive pad exposed to the second opening. A conductive pillar is formed in the second opening.

Abstract: The present invention discloses a standard lamp, which comprises a lamp seat installed in a standard. The lamp seat is electrically connected with a circuit board. At least one USB interface includes a cartridge disposed in the standard and a USB socket module disposed inside the cartridge. A wall of the cartridge, which is corresponding to the socket of the USB socket module, has at least one opening. The interface of an external USB data line can be passed through the opening and inserted into the socket of the USB socket module. The USB socket module is separated from the circuit board and electrically connected with the circuit board through cables. Therefore, the USB interface is reduced to a smaller size and requires less space for installation. Thus, the position for installing the USB interface has higher selectivity, and the overall esthetics of the standard is improved.

Abstract: The present invention discloses a lamp device, which comprises a base, a lamp seat installed in the base and electrically connected with a circuit board, at least one USB interface, and a lamp shade hooding the lamp seat thereinside. The USB interface includes a cartridge disposed in the base and a USB socket module disposed inside the cartridge. The USB socket module is separated from the circuit board and electrically connected with the circuit board through cables. A wall of the cartridge has at least one opening. The interface of an external USB data line can be passed through the opening and inserted into the socket of the USB socket module. The USB interface is reduced to a smaller size and requires less space for installation. Therefore, the position for installing the USB interface has higher selectivity, and the overall esthetics of the base is improved.

Abstract: A method includes forming a first dielectric layer over a conductive pad, forming a second dielectric layer over the first dielectric layer, and etching the second dielectric layer to form a first opening, with a top surface of the first dielectric layer exposed to the first opening. A template layer is formed to fill the first opening. A second opening is then formed in the template layer and the first dielectric layer, with a top surface of the conductive pad exposed to the second opening. A conductive pillar is formed in the second opening.

Abstract: A mobile power pack fixed in a steering pipe of a bicycle includes a housing, a quick lock device, a fixing assembly, a mobile power source and a cover. The quick lock device is mounted on the connecting portion of the housing. The fixing assembly has a first fixing member inserted through the second receiving chamber and exposed out of the connecting portion to lock with the quick lock device, and first fixing member is screwed in the second fixing member. The quick release blocks of the quick lock device are pushed outward by the first fixing member to press against an inner surface of the steering pipe, so that the mobile power pack can be fixed in or released from a first receiving chamber of the steering pipe by the housing.

Abstract: A method includes forming a first dielectric layer over a conductive pad, forming a second dielectric layer over the first dielectric layer, and etching the second dielectric layer to form a first opening, with a top surface of the first dielectric layer exposed to the first opening. A template layer is formed to fill the first opening. A second opening is then formed in the template layer and the first dielectric layer, with a top surface of the conductive pad exposed to the second opening. A conductive pillar is formed in the second opening.