Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.

Abstract: A device substrate includes a first substrate, an active device array, a data line pad, a gate drive circuit test line, and a first barrier structure. The active device array is located on the first substrate. The data line pad is electrically connected to the active device array. The gate drive circuit test line is located on the first substrate. The first barrier structure is located on the first substrate. The first barrier structure is located between the gate drive circuit test line and the data line pad. The barrier structure includes a first blocking wall.

Abstract: A device substrate includes a first substrate, an active device array, a data line pad, a gate drive circuit test line, and a first barrier structure. The active device array is located on the first substrate. The data line pad is electrically connected to the active device array. The gate drive circuit test line is located on the first substrate. The first barrier structure is located on the first substrate. The first barrier structure is located between the gate drive circuit test line and the data line pad. The barrier structure includes a first blocking wall.

Abstract: The present invention provides a display device and a backlight module used therein. The backlight module includes a support frame, an optical plate, a load-bearing pin, and an optical film. The support frame encloses an accommodating space. The optical plate is disposed in the accommodating space and has a light-emitting surface and a first end. The load-bearing pin is connected to the support frame and disposed across the light-emitting surface in a position close to the first end. The optical film is disposed corresponding to the light-emitting surface and has a support end and a load-bearing end opposite to each other. The support end is supported by the support frame and the load-bearing end is connected to the first end. The load-bearing pin is located between the optical film and the optical plate and the optical film is held up by the load-bearing pin so that the direction of extension of the optical film is changed.

Abstract: The present invention provides a display device and a backlight module used therein. The backlight module includes a support frame, an optical plate, a load-bearing pin, and an optical film. The support frame encloses an accommodating space. The optical plate is disposed in the accommodating space and has a light-emitting surface and a first end. The load-bearing pin is connected to the support frame and disposed across the light-emitting surface in a position close to the first end. The optical film is disposed corresponding to the light-emitting surface and has a support end and a load-bearing end opposite to each other. The support end is supported by the support frame and the load-bearing end is connected to the first end. The load-bearing pin is located between the optical film and the optical plate and the optical film is held up by the load-bearing pin so that the direction of extension of the optical film is changed.

Abstract: A method for manufacturing a printed circuit board is disclosed, which comprises the following steps. A basic board having an upper surface and a bottom surface opposite to the upper surface is provided. A plurality of the electronic components temporarily disposed on the basic board is provided. At least one locating pin temporarily disposed on a place of the basic board is provided, in which the electronic components are not temporarily disposed on the place. Surface mount technology is used simultaneously to joint at least one locating pin and the electronic components on the basic board.

Abstract: A display device includes a first substrate, at least one trace, a hydrophobic protective layer, a flexible printed circuit board (FPCB), a second substrate and a sealant. The first substrate has a display region and a peripheral region having an outer lead bonding (OLB) portion. The trace and the hydrophobic protective layer are disposed on the first substrate and extend from the display region to the OLB portion. The hydrophobic protective layer covers the trace and has at least one opening exposing a portion of the trace to define at least one lead and a surface microstructure. The lead and the surface microstructure are located in the OLB portion, and the surface microstructure is located on a surface of the hydrophobic protective layer away from the trace. One end of the FPCB leans against the surface microstructure and the FPCB is electrically connected to the lead.

Abstract: A backlight structure includes a light guide plate, at least one light source module, and a reflective cover. The light guide plate has a light incident side and a light-exiting surface, wherein the light-exiting surface is formed at an edge of the light incident side. The light source module includes a substrate and at least one light emitting element, wherein the light emitting element disposed on the substrate emits light to the light incident side. The reflective cover has a first reflecting portion and a second reflecting portion, wherein the second reflecting portion extends from the first reflecting portion disposed between a surface of the substrate and the light incident side of the light guide plate and covers a part of the light-exiting surface, so that the reflective cover reflects light emitted from the light emitting element to the light guide plate.

Abstract: A film support includes a pillar and a supporting unit. The pillar has an outer wall which encloses an accommodation space. The supporting unit has a supporting end and an assembly portion connected to each other, wherein the assembly portion is disposed in the accommodation space whereas the supporting end protrudes outside the pillar. The assembly portion of the supporting unit has a degree of freedom of rotation within the accommodation space and when the assembly portion rotates with respect to the pillar, the supporting end is driven to rotate with respect to the pillar.

Abstract: A display device and a light source block used therein are provided. The display device includes the light source block, a film set, and a display panel. The light source block has a reflective surface, a film supporter intersecting the reflective surface at an edge, and a panel supporting surface. The film supporter connects an end of an extremity surface, and the panel supporting surface connects the other end of the extremity surface. The film set is disposed on the film supporter, and the display panel is disposed on the panel supporting surface. The display panel has a display area and a light-shielding unit disposed outside the display area. The edge between the reflective surface and the film supporter falls into a vertical projection of the light-shielding unit.

Abstract: A method for manufacturing PCB, a display module and a method for fabricating a display module is disclosed. The method for fabricating a display module comprises the following steps. A printed circuit board with at least one locating pin formed thereon is provided. The printed circuit board is positioned on a backboard of a display module by means of the locating pin.

Abstract: A method for manufacturing a printed circuit board is disclosed, which comprises the following steps. A basic board having an upper surface and a bottom surface opposite to the upper surface is provided. A plurality of the electronic components temporarily disposed on the basic board is provided. At least one locating pin temporarily disposed on a place of the basic board is provided, in which the electronic components are not temporarily disposed on the place. Surface mount technology is used simultaneously to joint at least one locating pin and the electronic components on the basic board.

Abstract: A flat panel display structure and a manufacturing method thereof are provided. The flat panel display structure includes a light guide plate made of optical glass, an optical film disposed on the light guide plate and glued thereon through a first glue layer, a display panel having a light incident surface facing the optical film and a display surface with an active area located at the central portion thereof, a second glue layer gluing the optical film and the display panel so as to cover the light incident surface including the projection of the display area thereon, and a light module emitting lights toward the light guide plate. The refractive indices of the first glue layer and the second glue layer are smaller than or equal to that of the light guide plate and the optical film.

Abstract: A backlight structure includes a light guide plate, at least one light source module, and a reflective cover. The light guide plate has a light incident side and a light-exiting surface, wherein the light-exiting surface is formed at an edge of the light incident side. The light source module includes a substrate and at least one light emitting element, wherein the light emitting element disposed on the substrate emits light to the light incident side. The reflective cover has a first reflecting portion and a second reflecting portion, wherein the second reflecting portion extends from the first reflecting portion disposed between a surface of the substrate and the light incident side of the light guide plate and covers a part of the light-exiting surface, so that the reflective cover reflects light emitted from the light emitting element to the light guide plate.

Abstract: A film support includes a pillar and a supporting unit. The pillar has an outer wall which encloses an accommodation space. The supporting unit has a supporting end and an assembly portion connected to each other, wherein the assembly portion is disposed in the accommodation space whereas the supporting end protrudes outside the pillar. The assembly portion of the supporting unit has a degree of freedom of rotation within the accommodation space and when the assembly portion rotates with respect to the pillar, the supporting end is driven to rotate with respect to the pillar.

Abstract: In the specification and drawing a display module is disclosed. The display module comprises a backboard, a display component and a printed circuit board with at least one locating pin formed thereon. The backboard has at least one locating hole. The display component is disposed on the backboard. The at least one the locating pin is inserted in the locating hole. Moreover, a method for manufacturing the printed circuit board and a method for fabricating the display module are also disclosed in the specification and drawing.

Abstract: A display device and a light source block used therein are provided. The display device includes the light source block, a film set, and a display panel. The light source block has a reflective surface, a film supporter intersecting the reflective surface at an edge, and a panel supporting surface. The film supporter connects an end of an extremity surface, and the panel supporting surface connects the other end of the extremity surface. The film set is disposed on the film supporter, and the display panel is disposed on the panel supporting surface. The display panel has a display area and a light-shielding unit disposed outside the display area. The edge between the reflective surface and the film supporter falls into a vertical projection of the light-shielding unit.

Abstract: A backlight module structure for use in a liquid crystal display, a back bezel for use in the backlight module structure, and a method of manufacturing the back bezel are disclosed. The backlight module structure comprises the back bezel and a base. The back bezel has a surface and a recessed area formed on the surface. The base has at least one bottom portion and at least one fixing portion. The bottom portion is disposed on the recessed area. The fixing portion is disposed on the bottom portion, extending outwards from the bottom portion and protruding above the surface of the back bezel. Moreover, the back bezel is formed by stamping the surface to form a recessed area extending inwards from the surface.

Abstract: A backlight module is disclosed. The backlight module includes a back plate, a diffuser and a supporter. The diffuser is disposed over the back plate. The supporter is disposed between the back plate and the diffuser and includes a seat and a fixing member. The fixing member has one or more protrusions formed thereon and the seat and fixing member are adapted to fix a light source.

Abstract: A grounding structure of a liquid crystal module is disclosed. The grounding structure is adapted for protecting a control printed circuit board of the liquid crystal module from electro-magnetic interference. In one embodiment, the grounding structure comprises: i) a frame configured to receive the control printed circuit board, ii) a grounding conductive sheet, wherein one end of the grounding conductive sheet is electrically connected to the control printed circuit board, and the other end comprises a first engaging member and iii) a metal bezel configured to lock around the frame, the metal bezel including a second engaging member, wherein the second engaging member engages with the first engaging member.