Abstract: An immersion-type liquid cooling heat dissipation structure is provided. The immersion-type liquid cooling heat dissipation structure includes a metal heat dissipation substrate layer and a metal film layer. The metal film layer is formed on a surface of the metal heat dissipation substrate layer, and is configured to be immersed in an immersion-type coolant. An effective thickness of the metal film layer is less than 500 ?m. A surface of the metal film layer has a plurality of micropores that facilitate generation of vapor bubbles. An effective width of each of the plurality of micropores is between 1 ?m and 200 ?m, and a depth of each of the plurality of micropores is between 100 nm and 50 ?m.

Abstract: A vehicle water-cooled radiator includes an upper cover and a lower cover. A curved flow channel for a cooling liquid to flow is formed between the upper cover and the lower cover. The curved flow channel has multiple flow channel cavities and at least two water holes communicated with the flow channel cavities. A first laser welding structure surrounding the curved flow channel is formed between the upper cover and the lower cover, and a second laser welding structure is formed between the upper cover and the lower cover and between two adjacent flow channel cavities. The lower cover has a first contact surface and a second contact surface. The first contact surface contacts the cooling liquid flowing through the flow channel cavities. The lower cover has multiple protrusions disposed on the second contact surface, and at least two protrusions are different in shape from the other protrusions.

Abstract: A surface-modified aluminum alloy substrate structure includes a 6000-Series aluminum alloy substrate, a diffusion buffer layer, and a meltable metallic layer. The diffusion buffer layer is formed on the 6000-Series aluminum alloy substrate for buffering magnesium in the 6000-Series aluminum alloy substrate from diffusing to a meltable metallic layer. The meltable metallic layer is formed on the diffusion buffer layer for being melted in a subsequent process.

Abstract: An automobile heat dissipation device having a modified surface includes a metal heat dissipation device and a silver metal layer. The metal heat dissipation device has a first and a second heat dissipation surface. The silver metal layer is formed on the first heat dissipation surface of the metal heat dissipation device by arc ion plating (AIP), so as to form a surface modification layer on the metal heat dissipation device. A surface of the surface modification layer is distributed with a plurality of holes that each have a diameter of from 0.1 ?m to 30 ?m and a plurality of metal particles that each have a size of less than 30 ?m, and the surface of the surface modification layer acts as a subsequent silver sintered interface, so that the silver sintered interface is joined to at least one automobile electronic module by silver sintering.

Abstract: An enclosed liquid-cooling cooler includes a copper heat sink and an aluminum heat sink, and a flow channel is formed therebetween to enable flowing of a coolant. The copper and aluminum heat sinks are bonded by friction stir welding, so as to form one or more bonding surfaces. One or more gaps are formed between the copper and aluminum heat sinks. An electroless-nickel-plating embedding layer is plated within the gap, such that the gap is less than 0.1 mm. A copper surface of the copper heat sink and an aluminum surface of the aluminum heat sink that come into contact with the coolant are each plated with at least one electroless-nickel-plating surface layer having a thickness of between 5 ?m and 13 ?m, such that the electroless-nickel-plating surface layer replaces the copper surface and the aluminum surface for contacting the coolant. Accordingly, potential difference corrosion can be prevented.

Abstract: A closed-loop liquid cooler with pin-fins is provided, which includes a first external cover, a second cover, a plurality of water holes, a liquid channel, and a plurality of pin-fins. The water holes are formed on at least one of the first external cover and the second external cover. The liquid channel is formed between the first external cover and the second external cover, and is in spatial communication with the water holes. The pin-fins are located in the liquid channel. At least a portion of the pin-fins are copper fins made by copper or copper alloy. At least another portion of the pin-fins are aluminum fins made by aluminum or aluminum alloy. At least one of diameters, inscribed circle diameters, width, spacing, heights, shapes and draft angles of the copper fins and the aluminum fins are different.

Abstract: A liquid-cooling heat dissipating plate with sparsely arranged pin-fins and densely arranged pin-fins includes a heat dissipating plate body and a plurality of pin-fins. The heat dissipating plate body has a first heat dissipating face and a second heat dissipating face being opposite to each other. The first heat dissipating face is for contacting a plurality of chips, and an angle between a chip arrangement direction and a cooling liquid flowing direction is between 65° to 115°. The second heat dissipating face is for contacting the cooling liquid, with the plurality of pin-fins being formed thereon. A plurality of sparse regions with lower fin density and a plurality of dense regions with higher fin density are configured on the heat dissipating plate body, such that a flow speed of the cooling liquid along the cooling liquid flowing direction increases when the cooling liquid flows through each sparse region.

Abstract: A liquid-cooling cooler having a nickel multilayer structure includes a liquid-cooling cooler body and the nickel multilayer structure. The nickel multilayer structure is formed on the liquid-cooling cooler body for bonding with at least one heat source. A topmost layer of the nickel multilayer structure is a pure nickel electroplating layer, and a nickel content of the pure nickel electroplating layer is greater than 99 wt %. An electroless nickel-phosphorus plating layer is disposed beneath the pure nickel electroplating layer, and a phosphorus content of the electroless nickel-phosphorus plating layer ranges between 6 wt % and 13 wt %. The liquid-cooling cooler body is made of a non-nickel metal. A thickness of the pure nickel electroplating layer is less than or equal to 2 ?m, and a thickness of the electroless nickel-phosphorus plating layer ranges between 3 ?m and 12 ?m.

Abstract: A liquid-cooling heat dissipation plate having an uneven fin density and an unequal fin height includes a heat dissipation plate body having first and second heat dissipation surfaces opposite to each other, and multiple full-height fins and non-full-height fins formed on the second heat dissipation surface. The heat dissipation plate body is divided into a first to an N-th heat dissipation region along a cooling-liquid flowing direction. Multiple chips correspond in position respectively to the first to the N-th heat dissipation region. Each heat dissipation region is divided into a front region, a heat source region, and a rear region according to the cooling-liquid flowing direction. In each heat dissipation region, a fin density of the heat source region is greater than or equal to that of the rear region, and the fin density of the heat source region is greater than that of the front region.

Abstract: A method for manufacturing a patterned surface coating of an automobile heat dissipation device and an automobile heat dissipation device having a patterned surface coating. The method for manufacturing the patterned surface coating of the automobile heat dissipation device includes providing a metal heat dissipation device, and forming a sputtered metal layer that is patterned on an upper surface of the metal heat dissipation device by sputtering, allowing a thickness of the sputtered metal layer to be between 1 ?m and 3 ?m, and allowing the sputtered metal layer to cover an area less than 90% of an area of the upper surface of the metal heat dissipation device.

Abstract: A liquid-cooling cooler for an electric vehicle power module includes a liquid-cooling plate and a plurality of fin regions. A first rectangular region formed by outward extension of four sides of a projection of a heat source is defined as a heat source fin region among the plurality of fin regions. A second rectangular region extending outward from the heat source fin region in a counter flow direction of the coolant is defined as an upstream fin region. A third rectangular region extending outward from the heat source fin region in a flow direction of the coolant is defined as a downstream fin region. A fin density of the heat source fin region is greater than that of the downstream fin region, and the fin density of the downstream fin region is greater than or equal to that of the upstream fin region.

Abstract: A liquid-cooling cooler for an electric vehicle power module includes an inlet end, an outlet end, and a chamber connected to the inlet end and the outlet end. A plurality of fin regions arranged in a water flow direction are located within the chamber. The plurality of fin regions include at least one high-density fin region, such that at least one low-density and inlet-end-adjacent fin region is more adjacent to the inlet end and is of lower density than the at least one high-density fin region, and at least one low-density and outlet-end-adjacent fin region is more adjacent to the outlet end and is of lower density than the at least one high-density fin region. The plurality of fin regions include at least one low-density fin region.

Abstract: A two-phase immersion-cooling heat-dissipation structure having skived fins includes an immersion-cooling substrate and a plurality of immersion-cooling fins. The immersion-cooling substrate has a top surface and a bottom surface that are opposite to each other, the bottom surface is used for contacting a heat-generating component immersed in a two-phase coolant, the top surface is connected with the plurality of immersion-cooling fins, the plurality of immersion-cooling fins include at least one skived fin integrally formed on the top surface of the immersion-cooling substrate, and the plurality of immersion-cooling fins are non-linearly arranged. A thickness of any one of the plurality of immersion-cooling fins ranges from 0.1 mm to 0.35 mm, a height of any one of the plurality of immersion-cooling fins ranges from 5 mm to 10 mm, and a gap between any two of the plurality of immersion-cooling fins ranges from 0.1 mm to 0.35 mm.

Abstract: A two-phase immersion-cooling heat-dissipation structure having skived fins with high surface roughness includes an immersion-cooling substrate and a plurality of skived fins. The immersion-cooling substrate has a top surface and a bottom surface that are opposite to each other, the bottom surface is used for contacting a heat source immersed in a two-phase coolant, the top surface is connected with the plurality of skived fins, a center line average roughness Ra of a surface of the plurality of skived fins is greater than 10 ?m, and a ten point average roughness Rz of the surface of the plurality of skived fins is greater than 20 ?m.

Abstract: A two-phase immersion-type heat dissipation structure having acute-angle notched structures is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate, and a plurality of fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other, the non-fin surface is configured to be in contact with a heat source immersed in a two-phase coolant, and the fin surface is connected with the fins. More than half of the fins are functional fins, and at least one side surface of each of the functional fins has first and second surfaces defined thereon and connected to each other. An angle between the first surface and the fin surface is from 80 degrees to 100 degrees, and an angle between the second surface and the fin surface is less than 75 degrees.

Abstract: A two-phase immersion-cooling heat-dissipation structure having shortened evacuation route for vapor bubbles includes an immersion-cooling substrate having a first surface and a second surface that are opposite to each other and immersion-cooling fins. The second surface contacts a heat source immersed in a two-phase coolant, and the first surface connects to the immersion-cooling fins. The immersion-cooling fins include at least one skived fin integrally formed on the first surface of the immersion-cooling substrate by skiving, and further include at least one functional fin. The functional fin is a single continuous fin extends lengthwise in a vapor bubbles evacuation direction, has a central portion corresponding in position to the heat source and upper and lower end portions located away from the heat source, and a height of the central portion is greater than at least one of a height of the upper and lower end portions.

Abstract: A surface modification and joint method for an automobile heat dissipation device and an automobile heat dissipation device having a modified surface. The surface modification and joint method includes providing a metal heat dissipation device, forming a sputtered metal layer that is patterned on a surface of the metal heat dissipation device by sputtering to form a modification area of the metal heat dissipation device so as to modify the surface of the metal heat dissipation device, and jointing a surface of the sputtered metal layer to at least one automobile electronic module by sintering, so that the metal heat dissipation device is thermally coupled to the at least one automobile electronic module.

Abstract: A heat dissipation structure includes a heat dissipation base, at least one heat pipe, and a first heat dissipation contact material and a second heat dissipation contact material that are different from one another. The heat dissipation base has a first and a second heat dissipation surface opposite to each other. At least one recessed trough is concavely formed on the first heat dissipation surface. The at least one heat pipe is located in the at least one recessed trough. The first and the second heat dissipation contact material are filled in the at least one recessed trough. At least one cooling fin is joined to the second heat dissipation surface of the heat dissipation base, and at least one internal coolant passage is defined between the heat dissipation base and the at least one cooling fin.

Abstract: A surface-modified aluminum alloy substrate structure includes a 6000-Series aluminum alloy substrate, a diffusion buffer layer, and a meltable metallic layer. The diffusion buffer layer is formed on the 6000-Series aluminum alloy substrate for buffering magnesium in the 6000-Series aluminum alloy substrate from diffusing to a meltable metallic layer. The meltable metallic layer is formed on the diffusion buffer layer for being melted in a subsequent process.

Abstract: A liquid cooler having an aluminum brazing bead structure includes a first outer cover, a second outer cover, a plurality of water holes formed on at least one of the first outer cover and the second outer cover, a liquid flow channel formed between the first outer cover and the second outer cover and in spatial communication with the water holes, at least one divider island integrally formed on the second outer cover and dividing the liquid flow channel into a plurality of sub-flow channels, and one or more open holes formed between the at least one divider island and the first outer cover. An upper surface of the at least one divider island and a lower surface of the first outer cover are brazed together, so that the one or more open holes are formed into one or more blind holes.