Abstract: A thermally conductive and electrically insulating substrate structure and a method for manufacturing the same are provided. The thermally conductive and electrically insulating substrate structure includes an insulating layer, a plurality of metal layers and a plurality of function layers. The plurality of metal layers and the plurality of function layers are disposed on the insulating layer. A sidewall of the metal layer is in contact with a corresponding one of the function layers, and two of the function layers between any two adjacent ones of the metal layers are not in contact with each other.

Abstract: A power module package structure includes, from top to bottom, a layer of power chips, an upper bonding layer, a thermally-conductive and electrically-insulating composite layer, and a heat dissipation layer. The thermally-conductive and electrically-insulating composite layer contains an insulating layer and an upper copper layer that is formed on the insulating layer. One or more layers of upper packaging materials are covered over the layer of power chips and the upper bonding layer and are in contact with an upper surface of the upper copper layer. One or more layers of lower packaging materials are in contact with the insulating layer and are in contact with sidewalls of the upper copper layer. The lower packaging material has a higher rigidity than the upper packaging material.

Abstract: An enclosed heat sink with a brazed structure is provided. The enclosed heat sink with the brazed structure includes a first brazing plane formed on a top surface of a first brazing body, and a second brazing plane formed on a bottom surface of a second brazing body. The first brazing plane and the second brazing plane are pressed and brazed together, so that the first brazing body and the second brazing body enclose a cavity. A plurality of channels are formed on the first brazing plane, and each of the channels is neither perpendicular nor parallel to the first brazing plane.

Abstract: An enclosed heat sink with a side wall structure is provided. The side wall structure includes a welding body having a first welding plane and a side wall structure having a second welding plane. The first welding plane and the second welding plane are pressured and welded to each other, such that the welding body and the side wall structure encapsulate a cavity. A width of the second welding plane is smaller than a width between two side surfaces of the side wall structure.

Abstract: An alloy structure having a low magnesium content surface includes an alloy layer having an original magnesium content and a magnesium-deficient layer formed on the alloy layer, and the magnesium-deficient layer has a low magnesium content surface.