Patents by Inventor Ching Shen

Ching Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153842
    Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 9, 2024
    Inventors: Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang, Chih-Wei Lin, Hsiu-Jen Lin, Ching-Hua Hsieh, Chung-Shi Liu
  • Patent number: 11971565
    Abstract: An absorption type near-infrared filter comprising a first multilayer film, a second multilayer film, and an absorption film, wherein in the ultraviolet band, the difference of between the wavelength with the transmittance at 80% of the absorbing film and the wavelength with the reflectivity at 80% of the first multilayer film falls in the range between 25 nm and 37 nm, the difference of between the wavelength with the transmittance at 50% of the absorbing film and the wavelength with the reflectivity at 50% of the first multilayer film falls in the range between 6 nm and 14 nm, and the difference of between the wavelength with the transmittance at 20% of the absorbing film and the wavelength with the reflectivity at 20% of the first multilayer film falls in the range between ?6 nm and 2.5 nm.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: April 30, 2024
    Assignees: PTOT (SUZHOU) INC., PLATINUM OPTICS TECHNOLOGY INC.
    Inventors: Chung-Han Lu, Hsiao-Ching Shen, Chun-Cheng Hsieh, Ming-Zhan Wang
  • Patent number: 11967546
    Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen, Szu-Wei Lu, Ying-Ching Shih, Wen-Chih Chiou, Chi-Hsi Wu, Chen-Hua Yu
  • Patent number: 11960681
    Abstract: A method of capacitive sensing includes obtaining a capacitive touch profile from multiple receiver electrodes disposed in a sensing region of an input device and obtaining an active pen profile, different from the capacitive touch profile, from the multiple receiver electrodes. The method also includes adjusting, using the capacitive touch profile, the active pen profile to obtain a corrected active pen profile and determining a position of an active pen in the sensing region, using the corrected active pen profile.
    Type: Grant
    Filed: May 20, 2022
    Date of Patent: April 16, 2024
    Assignee: Synaptics Incorporated
    Inventors: Tom Vandermeijden, Guozhong Shen, Ching-Hsung Wang
  • Publication number: 20240105642
    Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 28, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu, Cheng-Shiuan Wong
  • Publication number: 20240106307
    Abstract: A motor with a plurality of stator modules and a driving method of the motor are provided. The motor includes a plurality of stator modules, a control unit, and a rotor. The plurality of stator modules is detachably assembled into a motor stator. Each of the plurality of stator modules includes a driving circuit. Each driving circuit is electrically connected to a plurality of coils of an associated one of the plurality of stator modules. The control unit is coupled to the driving circuits. The control unit designates one of the plurality of stator modules as a starting unit and designates remaining stator modules as relay units. The rotor includes at least one magnetic member corresponding to the plurality of coils of the plurality of stator modules. The starting unit drives the rotor to rotate. The relay units drive the rotor according to a phase change of the starting unit.
    Type: Application
    Filed: January 17, 2023
    Publication date: March 28, 2024
    Inventors: Wei-Qian Jian, Ching-Shen Hong
  • Patent number: 11942464
    Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20240088062
    Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.
    Type: Application
    Filed: November 23, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu, Cheng-Shiuan Wong
  • Publication number: 20230275474
    Abstract: A motor includes a plurality of stator modules, a plurality of circuit boards, a rotor, and a sensing module coupled to the circuit boards. The stator modules are detachably assembled into a stator assembly. Each stator module includes pole posts and coils of different phases wound around the pole posts. Each circuit board is electrically connected to the coils of an associated stator module. Each circuit board independently switches the associated stator module between the different phases. A power source supplies power to the coils via the circuit boards. The rotor includes at least one magnetic member which has magnetic poles corresponding to the coils of the stator modules. The sensing module detects a magnetic field change of the at least one magnetic member responsive to a movement of the rotor, determines a rotational position of the rotor, and informs each circuit board about the rotational position of the rotor.
    Type: Application
    Filed: January 9, 2023
    Publication date: August 31, 2023
    Inventors: Ching-Shen Hong, Wei-Qian Jian
  • Publication number: 20230234459
    Abstract: A male plug and a female receptacle of a charger extension cable for electric vehicles is configured to be connected between a home electric circuit and a charging gun of a respective one electric vehicle, and the male plug and the female receptacle of the charger extension cable contains: a body of the charger extension cable. The body of the charger extension cable includes a first extension cord connected with a first male plug, and the first male plug is electrically connected with the home electric circuit having an incoming terminal electrically connected with a current output end of a main power switch of the home electric circuit in a power outgoing direction. The incoming terminal has a first female receptacle connected, and the first female receptacle is electrically connected with the first male plug of the first extension cord.
    Type: Application
    Filed: January 26, 2022
    Publication date: July 27, 2023
    Inventor: A-Ching SHEN
  • Publication number: 20220283347
    Abstract: An absorption type near-infrared filter comprising a first multilayer film, a second multilayer film, and an absorption film, wherein in the ultraviolet band, the difference of between the wavelength with the transmittance at 80% of the absorbing film and the wavelength with the reflectivity at 80% of the first multilayer film falls in the range between 25 nm and 37 nm, the difference of between the wavelength with the transmittance at 50% of the absorbing film and the wavelength with the reflectivity at 50% of the first multilayer film falls in the range between 6 nm and 14 nm, and the difference of between the wavelength with the transmittance at 20% of the absorbing film and the wavelength with the reflectivity at 20% of the first multilayer film falls in the range between ?6 nm and 2.5 nm.
    Type: Application
    Filed: May 26, 2022
    Publication date: September 8, 2022
    Applicants: PTOT (SUZHOU) INC., PLATINUM OPTICS TECHNOLOGY INC.
    Inventors: Chung-Han LU, Hsiao-Ching SHEN, Chun-Cheng HSIEH, Ming-Zhan WANG
  • Patent number: 11378727
    Abstract: An absorption type near-infrared filter comprising a first multilayer film, a second multilayer film, and an absorption film comprising an infrared absorbing dye with a weight percentage between 1% and 3%, wherein in the infrared band, the difference between the wavelength with the transmittance at 80% of the absorption film and the wavelength with the reflectivity at 80% of the first multilayer film ranges between 130 nm and 145 nm; the difference between the wavelength with the transmittance at 50% of the absorption film and the wavelength with the reflectivity at 50% of the first multilayer film ranges between 75 nm and 90 nm; the difference between the wavelength with the transmittance at 20% of the absorption film and the wavelength with the reflectivity at 20% of the first multilayer film ranges between 25 nm and 45 nm.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: July 5, 2022
    Assignees: PTOT (SUZHOU) INC., PLATINUM OPTICS TECHNOLOGY INC.
    Inventors: Chung-Han Lu, Hsiao-Ching Shen, Chun-Cheng Hsieh, Ming-Zhan Wang
  • Publication number: 20210176518
    Abstract: A digital set-top box with a custom channel function has a central processing unit, including a composite channel table that has a channel list storing more than one channel number and more than one channel, wherein each of the channel numbers has a corresponding channel, and each of the channels is a video stream channel provided by a video streaming application installed in the central processing unit by the user; a memory unit, electrically connected to the central processing unit for storing the channels in the composite channel table; and an input/output unit, electrically connected to the central processing unit for receiving a control command sent from a remote control. When the remote control sends a number command, the central processing unit displays the channel corresponding to the channel in the number command on a display screen.
    Type: Application
    Filed: December 4, 2019
    Publication date: June 10, 2021
    Inventor: Ching Shen Hsiao
  • Patent number: 10967019
    Abstract: A use of an emblica extract in preparing a pharmaceutical composition for protecting mitochondria in retina is provided. When the pharmaceutical composition, which comprises the emblica extract, is provided to retinal cells, a use of the pharmaceutical composition comprises improvement of the ability of performing the oxidative phosphorylation for the synthesis of the adenosine triphosphate (ATP) by the mitochondria in the retinal cells under or exposed to ultraviolet light, and improvement of the coupling efficiency of the synthesis of the adenosine triphosphate by the mitochondria.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: April 6, 2021
    Assignee: TAIWAN MITOCHONDRION APPLIED TECHNOLOGY CO., LTD.
    Inventors: Han-Chung Cheng, Chi-Tang Tu, Shun-Chieh Yang, Man-Ching Shen
  • Patent number: 10606103
    Abstract: A concave display including a first substrate, a second substrate, a display medium, a color filter layer, an optical film and an active device layer is provided. The second substrate is disposed opposite to the first substrate. The display medium is disposed between the first substrate and the second substrate. The color filter layer is disposed on the first substrate. The active device layer is disposed on the first substrate or the second substrate. The optical film is disposed on the first substrate. The optical film is further away from the display medium than the color filter. The optical film includes a base material and optical microstructures embedded in the base material, wherein a refractive index of each of the optical microstructures is smaller than a refractive index of the base material.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: March 31, 2020
    Assignee: GIANTPLUS TECHNOLOGY CO., LTD
    Inventors: Chih-Teng Huang, Hsin-Yu Han, He-Guei Chen, Hsiao-Ching Shen
  • Patent number: 10408475
    Abstract: A purification structure is located beside an inlet segment of a heat dissipator and contains: a casing, a water mesh, a water distribution seat, and a water collection device. The casing includes an air inlet and an air outlet. The water mesh includes multiple orifices and is accommodated between the air inlet and the air outlet of the casing. The water distribution seat is secured on a top of the water mesh and includes an aperture and multiple passages. The water collection device communicates with a bottom of the water mesh, and the water collection device includes a water accommodation chamber and a pump, wherein the pump has a water output segment connecting with a guide tube which communicates with the aperture of the water distribution seat, such that the water is outputted by the pump to flow toward the aperture via the guide tube.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: September 10, 2019
    Assignee: LEADING STAND
    Inventor: A-Ching Shen
  • Publication number: 20190187348
    Abstract: An absorption type near-infrared filter comprising a first multilayer film, a second multilayer film, and an absorption film comprising an infrared absorbing dye with a weight percentage between 1% and 3%, wherein in the infrared band, the difference between the wavelength with the transmittance at 80% of the absorption film and the wavelength with the reflectivity at 80% of the first multilayer film ranges between 130 nm and 145 nm; the difference between the wavelength with the transmittance at 50% of the absorption film and the wavelength with the reflectivity at 50% of the first multilayer film ranges between 75 nm and 90 nm; the difference between the wavelength with the transmittance at 20% of the absorption film and the wavelength with the reflectivity at 20% of the first multilayer film ranges between 25 nm and 45 nm.
    Type: Application
    Filed: December 18, 2018
    Publication date: June 20, 2019
    Inventors: Chung-Han LU, Hsiao-Ching SHEN, Chun-Cheng HSIEH, Ming-Zhan WANG
  • Publication number: 20190056124
    Abstract: A purification structure is located beside an inlet segment of a heat dissipator and contains: a casing, a water mesh, a water distribution seat, and a water collection device. The casing includes an air inlet and an air outlet. The water mesh includes multiple orifices and is accommodated between the air inlet and the air outlet of the casing. The water distribution seat is secured on a top of the water mesh and includes an aperture and multiple passages. The water collection device communicates with a bottom of the water mesh, and the water collection device includes a water accommodation chamber and a pump, wherein the pump has a water output segment connecting with a guide tube which communicates with the aperture of the water distribution seat, such that the water is outputted by the pump to flow toward the aperture via the guide tube.
    Type: Application
    Filed: August 21, 2017
    Publication date: February 21, 2019
    Inventor: A-Ching SHEN
  • Patent number: 10139653
    Abstract: A convex display including a first substrate, a second substrate, a display medium, a color filter layer, an optical film and an active device layer is provided. The second substrate is disposed opposite to the first substrate. The display medium is disposed between the first substrate and the second substrate. The color filter layer is disposed on the first substrate. The active device layer is disposed on the first substrate or the second substrate. The optical film is disposed on the first substrate. The optical film is farther away from the display medium than the color filter. The optical film includes a base material and optical microstructures embedded in the base material, wherein a refractive index of each of the optical microstructures is larger than a refractive index of the base material.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: November 27, 2018
    Assignee: GIANTPLUS TECHNOLOGY CO., LTD.
    Inventors: Chih-Teng Huang, Hsin-Yu Han, He-Guei Chen, Hsiao-Ching Shen
  • Publication number: 20180259118
    Abstract: An adapter device for easily and effectively mounting an optical device to a mobile device. The adapter device includes a housing body, a magnetic attachment mechanism, and a lens-attachment mechanism. The lens-attachment mechanism includes an annular body to receive the optical device. The magnetic attachment mechanism includes a metallic plate and at least one magnet. The metallic plate is attached to the mobile device and the magnet is mounted within the housing body. The metallic plate is positioned adjacent to a front panel of the housing body in order to attach the mobile device to the housing body. The lens-attachment mechanism being mounted to the housing body with the annular body is positioned adjacent to a rear panel of the housing body. The annular body receives and holds the optical device in order to optically couple the mobile device and the optical device.
    Type: Application
    Filed: August 29, 2017
    Publication date: September 13, 2018
    Inventor: Ching Shen