Abstract: Light-emitting diode (LED) packages with improved heat transfer paths for LED dies encased therein when compared to conventional LED packages are provided. For some embodiments, the LED package includes a ceramic substrate having a top cavity with one or more LED dies disposed within and having a bottom cavity for receiving a metallic insert to dissipate heat away from the LED dies. For other embodiments, an LED package is provided that includes a ceramic substrate having a heat spreader coupled to thermal vias filled with a highly thermally conductive composite.

Abstract: A thermal interface material is for being applied to the contact surfaces to eliminate the air interstices between the heat dissipating apparatus and the electronic component in order to improve heat dissipation of the electronic component. The thermal interface material includes pentaerythritol oleate as base oil and fillers filled in the pentaerythritol oleate for improving the heat conductivity of the thermal interface material. The pentaerythritol oleate is used for holding the fillers therein and filling the air interstices to achieve an intimate contact between the heat dissipating apparatus and the electronic component. The fillers include aluminum powders, zinc oxide powders and zinc oxide nano-particles.

Abstract: A white light source using solid state technology, as well as general backlight units and liquid crystal displays (LCDs) that may incorporate such a white light source, are provided. The white light source described herein utilizes a monochrome light-emitting diode (LED) and a wavelength-converting layer having fluorescent materials to produce a substantially uniform broadband optical spectrum visible as white light. Being constructed on a metal substrate, the white light source may also provide for an improved heat transfer path over conventional solid state white light sources.

Abstract: A heat conductive silicone grease composition is provided. The heat conductive silicone grease composition comprises: (A) a hydroxyl group-containing organopolysiloxane, and (B) a thermoconductive inorganic filler having an average particle size of 0.1˜10 micrometers.

Abstract: A semiconductor device (10) includes a heat source (12), a heat-dissipating component (13) for dissipating heat generated by the heat source, and a thermal interface material (14) filled in spaces formed between the heat source and the heat-dissipating component. The thermal interface material includes 30% to 60% by weight of bismuth, up to 40% by weight of tin, and the rest indium.

Abstract: A thermal interface material (10) includes 100 parts by weight of a silicone oil (11) and 800˜1200 parts by weight of a metal powder (12) mixed into the silicone oil. An outer surface of each metal particle (121) of the metal powder is coated with a metal oxide layer (122). A method of producing the thermal interface material includes steps of: (1) applying a layer of organo coupling agent on the metal powder; (2) heating the metal powder at a temperature between 200 to 300° C. to coat a metal oxide layer on an outer surface of the metal powder; and (3) adding the metal powder with the coated metal oxide layer to a silicone oil. The thermal interface material has an excellent thermal conductivity and an excellent electrical insulating property.

Abstract: A heat conductive silicone composition comprises: (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having at least two Si—H groups therein, (C) a filler of aluminum powder or metal oxide powder, and (D) a coupling agent selected from titanate-based or aluminate-based coupling agent.

Abstract: A thermal interface material includes 100 parts by weight of base oil including amino-modified silicone fluid and at least one of methylphenylsilicone fluid and fluorosilicone fluid, and 800 to 1200 parts by weight of fillers filled in the base oil. The fillers have an average particle size of 0.1 to 5 um and are selected from the group consisting of zinc oxide powder, alumina powder and metallic aluminum powder.

Abstract: A silicone grease composition includes approximately 5 to 50% by weight of liquid organopolysiloxane, 45 to 94.9% by weight of a thermally conductive filler, and 0.1 to 5% by weight of a coupling agent chosen from at least one of a titanate-based coupling agent and an aluminate-based coupling agent. Due to the presence of the coupling agent, the silicone grease composition has a relatively lower viscosity and thus is capable of containing a larger amount of the filler whereby the thermally conductive efficiency of the composition is accordingly improved.

Abstract: A semiconductor device (10) includes a heat source (12), a heat-dissipating component (13) for dissipating heat generated by the heat source, and thermal interface material (14) filled in spaces formed between the heat source and the heat-dissipating component. The thermal interface material includes 100 parts by weight of alkenyl groups-containing organopolysiloxane, and Si—H groups-containing compound selected from the group consisting of organo-hydrogenpolysiloxane and polyorganohydrogensiloxane, and 800 to 1200 parts by weight of fillers consisting of aluminum powder having a mean particle size of 0.1 to 1 um and zinc oxide powder having a mean particle size of 1 to 5 um in a weight ratio of from 1/1 to 10/1 .

Abstract: A thermal interface material (13) and a semiconductor device (10) using the thermal interface material are provided. The thermal interface material is formed as a sheet, comprising a pair of cured sheets (131) and a reinforcement member (132) arranged between the cured sheets. The reinforcement member, which improves the physical strength of the thermal interface material, is made of a material chosen from the group consisting of woven copper fabric, woven copper cloth, woven stainless fabric, woven stainless cloth, and any appropriate combination of the aforementioned materials.

Abstract: A thermal interface material is for being applied to the contact surfaces to eliminate the air interstices between the heat dissipating apparatus and the electronic component in order to improve heat dissipation of the electronic component. The thermal interface material includes pentaerythritol oleate as base oil and fillers filled in the pentaerythritol oleate for improving the heat conductivity of the thermal interface material. The pentaerythritol oleate is used for holding the fillers therein and filling the air interstices to achieve an intimate contact between the heat dissipating apparatus and the electronic component. The fillers include aluminum powders, zinc oxide powders and zinc oxide nano-particles.

Abstract: A semiconductor device (10) includes a heat source (12), a heat-dissipating component (13) for dissipating heat generated by the heat source, and a thermal interface material (14) filled in a space formed between the heat source and the heat-dissipating component. The thermal interface material includes a mixture of first copper powders having an average particle size of 2 um and second copper powders having an average particle size of 5 um, a silicone oil having a viscosity from 50 to 50,000 cs at 25° C., and at least one oxide powder selected from the group consisting of zinc oxide and alumina powders. The mixture of copper powders is 50% to 90% in weight, the silicone oil is 5% to 15% in weight and the at least one oxide powder is 0% to 35% in weight of the thermal interface material.

Abstract: A semiconductor device includes a heat source, a heat-dissipating component for dissipating heat generated by the heat source, and thermal interface material filled in a space formed between the heat source and the heat-dissipating component. The thermal interface material includes 50% to 90% in weight of at least one metal powders having an average particle size of 2 to 20 ?m and selected from the group consisting of spherical tin powders and powders of memory alloy, and 5% to 15% in weight of silicone oil having a viscosity from 50 tO 50,000 cs at 25° C.

Abstract: A heat pipe (10) includes a casing (12) and a sintered powder wick (14) arranged at an inner surface of the casing. The sintered powder wick is in the form of a multi-layer structure in a radial direction of the casing and at least one layer is divided into multiple sections in a longitudinal direction of the casing, and the multiple sections have powder sizes different from each other. The sections with large-sized powders are capable of reducing the flow resistance to the condensed liquid to flow back while the sections with small-sized powders are capable of providing a satisfactory capillary force for moving the condensed liquid.

Abstract: A method (50) for making a heat pipe (10) includes the following steps: a) providing a screen mesh (30) in the form of a multi-portion structure with at least one portion having an average pore size different from that of the other portions; b) rolling the screen mesh into a hollow column form; c) inserting the screen mesh into a hollow pipe body (22) of the heat pipe; d) sintering the screen mesh received therein at a predetermined temperature; and e) filling a working fluid into the pipe body and sealing the pipe body. The portion with large-sized pores is capable of reducing the flow resistance to a condensed fluid to flow back, whereas the portion with small-size pores is capable of providing a relatively large capillary pressure for drawing the condensed fluid from the condensing section to the evaporating section of the heat pipe.

Abstract: A heat pipe includes a hollow tube, a working medium filled in the tube, and a wick structure disposed in and contacting with the tube. The wick structure is formed by weaving first wires and second wires together. The second wires each have two opposite major surfaces. A portion of one of the two major surfaces contacts with an interior wall of the tube.

Abstract: A mesh-type heat pipe (10) includes a casing (12), a tube (14) located inside the casing and a screen mesh wick (16) located between the casing and the tube. The tube defines therein a plurality of through holes (142) and at least one cutout (144). The wick is held against the casing by the tube. Under the support of the tube, the wick as a whole engages closely an inner surface of the casing, thereby establishing an effective heat transfer path between the casing and a working fluid that is saturated in the wick. Meanwhile, with the cutout in the tube presented, the heat pipe incorporating such tube is easily to be bent or flattened so as to enable the heat pipe to be applicable in electronic devices with a limited mounting space for a cooling device, such as notebook computers.

Abstract: A screen mesh wick (14) and a method of making the same are disclosed. The wick is made separately and is adaptive for inserting into a heat pipe as a wick structure. The wick includes a plurality of elongated wires (141, 142) woven together and a plurality of protruding portions (145) formed on the wires. The protruding portions may be small metal powders attached to outer surfaces of the wires. The method includes the steps of weaving a plurality of wires to form a mesh (14?) firstly and then forming a plurality of protruding portions on the mesh, for example, by spreading the metal powders onto the mesh while the mesh is subject to heating. With these protruding portions formed on the wires, the effective pore size defined between the wires is reduced and therefore the wick is capable of providing a larger capillary pressure.

Abstract: A method is disclosed to produce a heat pipe with a sintered powder wick formed inside the heat pipe. The method employs tape-casting technology to firstly produce thin sheets of powder and then these sheets are sintered to form the wick. In the tape casting procedure, a slurry of the powders necessary to construct said wick is cast onto a moving surface to form a slurry layer and then the slurry layer is dried to form a green tape. The green tape is rolled onto a mandrel and then is inserted into a hollow casing and sintered to cause the powders in the green tape to diffusion-bond together. Thus, the sintered powder wick is constructed.