Abstract: Phase change material (PCM) switches and methods of fabrication thereof that provide improved thermal confinement within a phase change material layer. A PCM switch may include a dielectric capping layer between a heater pad and the phase change material layer of the PCM switch that is laterally-confined such opposing sides of the dielectric capping layer the heater pad may form continuous surfaces extending transverse to the signal transmission pathway across the PCM switch. Heat transfer from the heater pad through the dielectric capping layer to the phase change material layer may be predominantly vertical, with minimal thermal dissipation along a lateral direction. The localized heating of the phase change material may improve the efficiency of the PCM switch enabling lower bias voltages, minimize the formation of regions of intermediate resistivity in the PCM switch, and improve the parasitic capacitance characteristics of the PCM switch.

Abstract: A semiconductor structure includes a semiconductor-on-insulator (SOI) substrate including a handle substrate, a buried insulating layer, and a top semiconductor layer; a first deep trench isolation structure that vertically extends through the top semiconductor layer and the buried insulating layer, and includes a first inner insulating liner laterally surrounding a first portion of the top semiconductor layer that is located in a first device region in a plan view, a first non-insulating moat structure laterally surrounding the first inner insulating liner, and a first outer insulating liner that laterally surrounds the first non-insulating moat structure; and a resistive memory array located on the first portion of the top semiconductor layer, and located entirely within the first device region in the plan view.

Abstract: One embodiment of the present disclosure provides an optical device which includes a waveguide and a light modulator. The light modulator comprising a bridge segment positioned on the waveguide, wherein the bridge segment comprises a phase-change material. The optical device also includes a heating member. The heating member includes an intermediate segment and two electric contact segments. The intermediate segment is in direct contact with the bridge segment of the light modulator. The two electric contact segments are connected to two ends of the intermediate segment, wherein heat produced from the heating member is directly transferred to the bridge segment of the light modulator thereby inducing a phase transition thereof.

Abstract: A package structure includes a die, an encapsulation layer, a redistribution layer structure and an adhesive material. The die includes a semiconductor substrate, conductive pads disposed over the semiconductor substrate and a passivation layer disposed over the semiconductor substrate and around the conductive pads. The encapsulation layer laterally encapsulates the die. the redistribution layer structure is disposed on the die and the encapsulation layer, and includes at least one redistribution layer embedded in at least one polymer layer, and the polymer layer contacts a portion of the passivation layer. The adhesive material is disposed on the die and covers an interface between the polymer layer and the passivation layer.

Abstract: Optical devices and methods of manufacture are presented in which a mirror structure is utilized to transmit and receive optical signals to and from an optical device. In embodiments the mirror structure receives optical signals from outside of an optical device and directs the optical signals through at least one mirror to an optical component of the optical device.

Abstract: A projection lens includes a first and a second optical lens assembly. The first optical lens assembly is configured to transmit an image beam to the second optical lens assembly, which projects out the image beam from the projection lens. The second optical lens assembly includes a first and a second reflective element, and an optical member disposed between the first and the second reflective element and including a translucent region and a reflective region. The first reflective element is configured to reflect the image beam from the first optical lens assembly and transmit to the translucent region, which allows the image beam from the first reflective element to pass through and transmit to the second reflective element. The second reflective element is configured to reflect the image beam from the translucent region and transmit to the reflective region, which reflects the image beam from the second reflective element.

Abstract: An LED driver, an LED lighting system and an operating method thereof are provided. The LED driver is for driving an LED light source and includes a strobe circuit and a DC-DC converter. The strobe circuit generates a low-frequency modulation signal. The DC-DC converter is coupled to the strobe circuit and is configured to provide an adjustable operating current to the LED light source according to a DC signal and the low-frequency modulation signal. The operating current includes a DC current signal and a low-frequency AC current signal corresponding to the DC signal and the low-frequency modulation signal respectively. A frequency of the low-frequency AC current signal is between 25 Hz and 100 Hz, and a current ripple factor, equaling a difference of a maximum value and a minimum value of the operating current divided by a sum of the maximum value and the minimum value, is less than 8%.

Abstract: A method for fabricating a semiconductor device includes the steps of forming a metal gate on a substrate, a contact etch stop layer (CESL) adjacent to the metal gate, and an interlayer dielectric (ILD) layer around the gate structure, performing a first etching process to remove the ILD layer, performing a second etching process to remove the CESL for forming a first contact hole, and then forming a first contact plug in the first contact hole. Preferably, a width of the first contact plug adjacent to the CESL is less than a width of the first contact plug under the CESL.

Abstract: An electronic device includes a casing, an exterior button, a sliding assembly and an internal button. The casing includes an outer surface and an opening at the outer surface. The exterior button has a first side and a second side opposite to each other, the first side is pivotally connected to the casing so that the exterior button is rotatably disposed at the casing. The sliding assembly is movably disposed on the casing, and includes a sliding body, a toggle and a pusher, the sliding body is located in the casing, the toggle is fixed to the sliding body and exposed to the casing, and the pusher is linked with the sliding body in a first direction, and is movably disposed at the sliding body in a second direction. The inner button is located in the casing, and the sliding assembly is located between the outer button and the inner button.

Abstract: A ring focus spectacle lens (1) for controlling the progression of myopia, and a manufacturing method therefor. The ring focus spectacle lens (1) can provide clear vision for a patient, and also has a plurality of ring-shaped defocusing zones to provide an optical defocusing effect. Since there is no joint between successive concentric rings of different optical powers that are tangent to each other, the ring focus spectacle lens (1) is as aesthetic as a common spectacle lens. In the manufacturing method, three front mold cores (71), a rear mold core (72), and a planar rear mold core are used to manufacture a series of ring focus spectacle lenses (1) having different powers, thereby reducing the number of mold cores and the production cost.

Abstract: A manufacturing method for mixed polymer body plates includes: prefabricating at least one polymer material selected from a plastic material, a rubber material or combination thereof; prefabricating at least one solvent selected from a single solvent or a mixed solvent; at room temperature mixing and stirring the polymer material with the solvent to obtain a mixed polymer material which contains no cross linker, extrusion forming hardening the mixed polymer material to obtain a polymer colloidal plate.

Abstract: The present invention provides a method for preparing an activated carbon, which includes impregnating a carbonaceous material with carbonated water; and exposing the carbonaceous material to microwave radiation to produce the activated carbon.

Abstract: A semiconductor device structure, along with methods of forming such, are described. The structure includes a first and second gate electrode layers, and a dielectric feature disposed between the first and second gate electrode layers. The dielectric feature has a first surface. The structure further includes a first conductive layer disposed on the first gate electrode layer. The first conductive layer has a second surface. The structure further includes a second conductive layer disposed on the second gate electrode layer. The second conductive layer has a third surface, and the first, second, and third surfaces are coplanar. The structure further includes a third conductive layer disposed over the first conductive layer, a fourth conductive layer disposed over the second conductive layer, and a dielectric layer disposed on the first surface of the dielectric feature. The dielectric layer is disposed between the third conductive layer and the fourth conductive layer.

Abstract: A gait evaluating system including a processor is provided. The processor identifies whether a gait type of the user belongs to a normal gait, a non-neuropathic gait or a neuropathic gait based on step feature values of a user and walking limb feature values of the user. In response to that the gait type of the user belongs to the non-neuropathic gait, the processor controls the display panel to display a first auxiliary information, a second auxiliary information, and a third auxiliary information. The first auxiliary information indicates a potential sarcopenia of the user. The second auxiliary information indicates a dietary guideline for muscle building and muscle strengthening. The third auxiliary information shows a motion instruction video for regaining or maintaining muscle strength of the user.

Abstract: A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.

Abstract: A method includes depositing a first metal layer on a package component, wherein the package component comprises a first device die, forming a dielectric layer on the package component, and plating a metal thermal interface material on the first metal layer. The dielectric layer includes portions on opposing sides of the metal thermal interface material. A heat sink is bonded on the metal thermal interface material. The heat sink includes a second metal layer physically joined to the metal thermal interface material.

Abstract: A tripod-head structure includes a first clamping plate, a second clamping plate, a rotating base, a tightening element, and an adjustment component. The first clamping plate includes a first arc-shaped groove, and the second clamping plate includes a second arc-shaped groove. A portion of a slide rail of the rotating base is placed between the first arc-shaped groove and the second arc-shaped groove. The tightening element passes through the first clamping plate and the second clamping plate. The adjustment component is connected to the tightening element and switchable between an unlocked position and a locked position. In the unlocked position, the slide rail is slidable to adjust an angle of the rotating base. In the locked position, the tightening element presses the first clamping plate and the second clamping plate to tightly secure the slide rail for rapid adjustment of the angle of the rotating base.

Abstract: A semiconductor device is disclosed. The semiconductor device includes a semiconductor substrate, and a heater element on the semiconductor substrate, the heater element configured to generate heat in response to a current flowing therethrough. The semiconductor device also includes a conductor material having a programmable conductivity, and an insulator layer between the heater element and the conductor material, where the conductor material is configured to be programmed by applying one or more voltage differences to one or more of the heater element and the conductor material, and where a capacitance between the conductor material and the heater element is configured to be controlled by the voltage differences such that the capacitance is lower while the conductor material is being programmed than while the conductor material is not being programmed.

Abstract: A semiconductor device includes a substrate having a fin element extending therefrom. In some embodiments, a gate structure is formed over the fin element, where the gate structure includes a dielectric layer on the fin element, a metal capping layer disposed over the dielectric layer, and a metal electrode formed over the metal capping layer. In some cases, first sidewall spacers are formed on opposing sidewalls of the metal capping layer and the metal electrode. In various embodiments, the dielectric layer extends laterally underneath the first sidewall spacers to form a dielectric footing region.