Abstract: A package structure and method for manufacturing the same are provided. The package structure includes a package component and a protruding feature attached to the package component. The package structure further includes a lid disposed over the package component and the protruding feature and a first thermal interface material under a bottom surface of the lid and at a first side of the protruding feature. The package structure includes a second thermal interface material. In addition, the second thermal interface material includes a first portion under the bottom surface of the lid and at a second side of the protruding feature, a second portion over a bottom portion of the lid, and a third portion through the bottom portion of the lid and connecting with the first portion and the second portion.

Abstract: A package structure and method for forming the same are provided. The package structure includes a first die formed over a substrate, and a first package layer surrounding the first die. The package structure includes a lid structure formed over the first die and package layer and a first thermal interface material (TIM) formed between the first die and the lid structure. The first thermal interface material includes liquid metal. The package structure includes a second TIM formed between the first package layer and the lid structure, and a top surface of the second TIM is higher than a top surface of the first TIM.

Abstract: A package substrate according to the present disclosure includes a package substrate, a package component bonded to the package substrate and including a plurality of dies, a lid disposed over the package component and the package substrate, and a thermal interface material (TIM) layer sandwiched between the package component and the lid. The lid includes a plurality of heat spreader patterns that extend from a bottom surface of the lid into the TIM layer.

Abstract: A method includes forming a package component, including forming a thermal via extending through a substrate; and bonding a die to the thermal via; attaching the thermal via of the package component to a first conductive pad of a package substrate, wherein the package substrate includes a heat pipe underneath the first conductive pad; and attaching a support structure to a second conductive pad of the package substrate, wherein the heat pipe is underneath the second conductive pad, wherein the support structure includes a first thermoelectric cooler.

Abstract: The present disclosure is directed to a structure of a semiconductor package with a heat spreader structure and a method of forming the structure. The method includes providing a substrate with first and second dies on the substrate, dispensing a first thermal interface material (TIM) on the first die, and mounting a heat spreader structure on the first and second dies. A porous metal of the heat spreader structure can be aligned between the first and second dies. The method further includes forming a first thermal contact between the first die and the heat spreader structure via the first TIM, injecting a second TIM on the second die through a perforated hole in the heat spreader structure, and forming a second thermal contact between the second die and the heat spreader structure via the second TIM.

Abstract: A chip package structure is provided. The chip package structure includes a carrier substrate. The chip package structure includes a chip structure over the carrier substrate. The chip structure includes a semiconductor substrate and a device layer, the semiconductor substrate has a front surface and a back surface opposite to the front surface, the front surface faces the carrier substrate, and the device layer is between the front surface and the carrier substrate. The chip package structure includes a heat dissipation lid over the back surface of the semiconductor substrate. The heat dissipation lid has a plate portion and a first protruding portion under the plate portion, and the first protruding portion extends into the semiconductor substrate from the back surface.

Abstract: An integrated circuit package and the method of forming the same are provided. An integrated circuit package may include a first die having a first substrate over a package substrate and a lid. A first channel may extend through the first substrate from a first sidewall of the first die to a second sidewall of the first die. The lid may include a top portion over the first die and a first bottom portion extending along the first sidewall of the first die. The first bottom portion may include a second channel connected to the first channel.

Abstract: A package structure and a formation method of a package structure are provided. The package structure includes a chip-containing structure over a substrate and a heat-spreading lid over the chip-containing structure. The package structure also includes a closed chamber embedded in or positioned over the heat-spreading lid. The package structure further includes a cooling pipe partially or completely surrounded by the closed chamber.

Abstract: A package structure includes a high-power package attached to a substrate; a first low-power package attached to the substrate; a first heat dissipation device attached to the first low-power package; a liquid cooling system attached to the high-power package; and a thermoelectric system sandwiched between the high-power package and the liquid cooling system, wherein the thermoelectric system is electrically connected to the first heat dissipation device, wherein the thermoelectric system provides the first heat dissipation device with electrical power during operation of the high-power package.

Abstract: A multi-phase circuit control method includes following steps: generating a first control signal and a second control signal to a first phase circuit respectively by a controller; generating a third control signal and a fourth control signal to a second phase circuit respectively by controller; outputting a two-phase voltage to a output terminal of a power conversion device by first phase circuit and second phase circuit; changing a duty cycle of third control signal to turn off a first switch of a primary side circuit and a rectifier side circuit of second phase circuit by controller when controller is configured to detect that output voltage is lower than a first preset voltage; changing a duty cycle of fourth control signal to conduct a second switch of a primary side circuit and a rectifier side circuit of second phase circuit; and outputting a single-phase voltage to output terminal.

Abstract: A liquid cooling system includes a thermoelectric cooler (TEC) between a radiator plate and a radiator, and a thermoelectric generator (TEG) at a location where the TEG is driven by heat from a chip package. The chip package is cooled by a cold plate of the liquid cooling system and the TEC is controlled by the TEG. The TEG may be between the chip package and the cold plate or elsewhere in or adjacent to the chip package. The TEG may control the TEC through a relay. The TEG automatically activates the TEC when the chip package is under peak load.

Abstract: A package structure includes a high-power package attached to a substrate; a first low-power package attached to the substrate; a first heat dissipation device attached to the first low-power package; a liquid cooling system attached to the high-power package; and a thermoelectric system sandwiched between the high-power package and the liquid cooling system, wherein the thermoelectric system is electrically connected to the first heat dissipation device, wherein the thermoelectric system provides the first heat dissipation device with electrical power during operation of the high-power package.

Abstract: An integrated circuit package and the method of forming the same are provided. An integrated circuit package may include a first die having a first substrate over a package substrate and a lid. A first channel may extend through the first substrate from a first sidewall of the first die to a second sidewall of the first die. The lid may include a top portion over the first die and a first bottom portion extending along the first sidewall of the first die. The first bottom portion may include a second channel connected to the first channel.

Abstract: A chip package structure is provided. The chip package structure includes a carrier substrate. The chip package structure includes a chip structure over the carrier substrate. The chip structure includes a semiconductor substrate and a device layer, the semiconductor substrate has a front surface and a back surface opposite to the front surface, the front surface faces the carrier substrate, and the device layer is between the front surface and the carrier substrate. The chip package structure includes a heat dissipation lid over the back surface of the semiconductor substrate. The heat dissipation lid has a plate portion and a first protruding portion under the plate portion, and the first protruding portion extends into the semiconductor substrate from the back surface.

Abstract: A package structure and a formation method of a package structure are provided. The package structure includes a chip-containing structure over a substrate and a heat-spreading lid over the chip-containing structure. The package structure also includes a closed chamber embedded in or positioned over the heat-spreading lid. The package structure further includes a cooling pipe partially or completely surrounded by the closed chamber.

Abstract: A hybrid mode control method includes steps of: controlling an LLC resonant converter to operate in a burst mode when the LLC resonant converter is in a light load. Afterward, controlling the LLC resonant converter operating in a PWM mode as a load of the LLC resonant converter increases or an output voltage increases in a charging control, or controlling the LLC resonant converter operating in a PFM mode as the load increases or the input voltage decreases in a discharging control. Afterward, controlling the LLC resonant converter to operate in the PFM mode as the load of the LLC resonant converter further increases or the output voltage further increases in the charging control, or controlling the LLC resonant converter operating in a PSM mode as the load further increases or the input voltage further decreases in the discharging control.

Abstract: The present invention relates to a suction device, including a body. A cavity is disposed in the body. The cavity has a closed end face and an open end face. The open end face forms an end face to suck a workpiece. A tangential nozzle is disposed on a sidewall surface of the cavity. An external fluid enters the cavity through the tangential nozzle along a tangential direction of the cavity. A suction hole is disposed on the closed end face. The suction hole is connected to a suction unit. The suction unit sucks the fluid in the cavity through the suction hole. The suction device can suck a workpiece by using both a rotational flow negative pressure and a negative suction pressure of a fluid in the cavity, and therefore can suppress impact of a workpiece surface on a suction force and generate a larger suction force.

Abstract: The present invention relates to a suction device, including a body. A cavity is disposed in the body. The cavity has a closed end face and an open end face. The open end face forms an end face to suck a workpiece. A tangential nozzle is disposed on a sidewall surface of the cavity. An external fluid enters the cavity through the tangential nozzle along a tangential direction of the cavity. A suction hole is disposed on the closed end face. The suction hole is connected to a suction unit. The suction unit sucks the fluid in the cavity through the suction hole. The suction device can suck a workpiece by using both a rotational flow negative pressure and a negative suction pressure of a fluid in the cavity, and therefore can suppress impact of a workpiece surface on a suction force and generate a larger suction force.

Abstract: A light-emitting warning rope is provided with one end connected to a tent and other end connected to an anchoring point. The light-emitting warning rope is disposed between the anchoring point and the tent to provide a tension to set the tent upright. The rope comprises a light-emitting core and a structural rope. The structural rope comprises a plurality of bearing yarns which is knitted into a strip body with the light-emitting core as an axis, and the strip body knitted by each bearing yarn is knitted in a mesh shape on the radial side and has a plurality of gaps through which light from the light-emitting core is transmitted. In any segment of the rope, the light-emitting core has a stretching length less than that of each bearing yarn, so that the axial tension acts substantially on the bearing yarns when the rope suffers an axial tension.

Abstract: A light-emitting warning rope is provided with one end integrated to a tent and other end integrated to an anchoring point. The light-emitting warning rope is disposed between the anchoring point and the tent to provide a tension to set the tent upright. The rope comprises a light-emitting core and a structural rope. The structural rope comprises a plurality of bearing yarns which is knitted into a strip body with the light-emitting core as an axis, and the strip body knitted by each bearing yarn is knitted in a mesh shape on the radial side and has a plurality of gaps through which light from the light-emitting core is transmitted. In any segment of the rope, the light-emitting core has a stretching length less than that of each bearing yarn, so that the axial tension acts substantially on the bearing yarns when the rope suffers an axial tension.