Abstract: A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.

Abstract: A method and apparatus of Inter prediction for video coding using Multi-hypothesis (MH) are disclosed. If an MH mode is used for the current block: at least one MH candidate is derived using reduced reference data by adjusting at least one coding-control setting; an Inter candidate list is generated, where the Inter candidate list comprises said at least one MH candidate; and current motion information associated with the current block is encoded using the Inter candidate list at the video encoder side or the current motion information associated with the current block is decoded at the video decoder side using the Merge candidate list. The coding control setting may correspond to prediction direction setting, filter tap setting, block size of reference block to be fetched, reference picture setting or motion limitation setting.

Abstract: A method for producing ?-aminobutyric acid includes cultivating, in a culture medium containing glutamic acid or a salt thereof, a probiotic composition including at least one lactic acid bacterial strain selected from the group consisting of Bifidobacterium breve CCFM1025 which is deposited at the Guangdong Microbial Culture Collection Center under an accession number GDMCC 60386, Lactobacillus acidophilus TYCA06, Lactobacillus plantarum LPL28, and Bifidobacterium longum subsp. infantis BLI-02 which are deposited at the China General Microbiological Culture Collection Center respectively under accession numbers CGMCC 15210, CGMCC 17954, and CGMCC 15212, Lactobacillus salivarius subsp. salicinius AP-32 which is deposited at the China Center for Type Culture Collection under an accession number CCTCC M 2011127, and combinations thereof.

Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.

Abstract: A method for manufacturing a semiconductor device is provided. The method comprises steps as follows. At least one trench is provided in a low-k dielectric layer on a substrate. The trench is filled with a copper (Cu) film. Pure cobalt (Co) is deposited on a surface of the Cu film by introducing a flow of a carrier gas carrying a Co-containing precursor and a reducing agent onto the surface of the Cu film. The flowrate of the flow is within a range from 5 to 19 sccm.

Abstract: A through silicon via structure is located in a recess of a substrate. The through silicon via structure includes a barrier layer, a buffer layer and a conductive layer. The barrier layer covers a surface of the recess. The buffer layer covers the barrier layer. The conductive layer is located on the buffer layer and fills the recess, wherein the contact surface between the conductive layer and the buffer layer is smoother than the contact surface between the buffer layer and the barrier layer. Moreover, a through silicon via process forming said through silicon via structure is also provided.

Abstract: A through silicon via structure is located in a recess of a substrate. The through silicon via structure includes a barrier layer, a buffer layer and a conductive layer. The barrier layer covers a surface of the recess. The buffer layer covers the barrier layer. The conductive layer is located on the buffer layer and fills the recess, wherein the contact surface between the conductive layer and the buffer layer is smoother than the contact surface between the buffer layer and the barrier layer. Moreover, a through silicon via process forming said through silicon via structure is also provided.

Abstract: A through silicon via structure is located in a recess of a substrate. The through silicon via structure includes a barrier layer, a buffer layer and a conductive layer. The barrier layer covers a surface of the recess. The buffer layer covers the barrier layer. The conductive layer is located on the buffer layer and fills the recess, wherein the contact surface between the conductive layer and the buffer layer is smoother than the contact surface between the buffer layer and the barrier layer. Moreover, a through silicon via process forming said through silicon via structure is also provided.

Abstract: A through silicon via process includes the following steps. A substrate having a front side and a back side is provided. A passivation layer is formed on the back side of the substrate. An oxide layer is formed on the passivation layer.

Abstract: In a process of forming a seed layer, particularly in a vertical trench or via, a semiconductor substrate having a dielectric structure and a hard mask structure thereon is provided. An opening is formed in the hard mask structure, and a trench or via is formed in the dielectric structure in communication with the opening, wherein an area of the opening is greater than that of an entrance of the trench or via. A seed layer is then deposited in the trench or via through the opening, and then subjected to a reflow process.

Abstract: A through silicon via process includes the following steps. A substrate having a front side and a back side is provided. A passivation layer is formed on the back side of the substrate. An oxide layer is formed on the passivation layer.

Abstract: A through silicon via structure is located in a recess of a substrate. The through silicon via structure includes a barrier layer, a buffer layer and a conductive layer. The barrier layer covers a surface of the recess. The buffer layer covers the barrier layer. The conductive layer is located on the buffer layer and fills the recess, wherein the contact surface between the conductive layer and the buffer layer is smoother than the contact surface between the buffer layer and the barrier layer. Moreover, a through silicon via process forming said through silicon via structure is also provided.

Abstract: A mounting apparatus includes a mounting bracket, a mounting piece adapted to mount a PCI card to the mounting bracket, and a securing member. The mounting bracket includes a base and a blocking plate. The mounting piece includes an elongated body and a mounting end. The securing member includes a first pivoting portion pivotably attached to the mounting bracket, a pressing portion, and a mounting portion. The mounting portion includes a securing portion. The securing portion includes a handling portion and a second engaging portion extending from the handling portion. The second engaging portion engages the first engaging portion. The handling portion is configured to drive the second engaging portion to disengage the first engaging portion by pressing the handling portion.

Abstract: An electronic device includes a chassis having a bottom wall, a rear wall, and a sidewall perpendicular to each other. A motherboard is secured on the chassis bottom wall. A first socket is disposed on the motherboard. A mounting bracket is secured in the chassis above the motherboard. The mounting bracket includes a first mounting wall and a second mounting wall. The first mounting wall is parallel to and spaced from the sidewall of the chassis, and the second mounting wall is parallel to and spaced from the rear wall. A first riser card is coupled to the first socket on the motherboard, and is secured to the first mounting wall of the mounting bracket. An expansion card module is accommodated in the mounting bracket and parallel to the bottom wall of the chassis.

Abstract: A mounting apparatus for a PCI card includes a mounting bracket, a mounting piece for attaching the PCI card to the mounting bracket, and a securing member. The mounting bracket has a base and a blocking plate bent from the base. The mounting piece includes an elongated body and a mounting end bent from the elongated body. The elongated body adjoins the base and the mounting end abuts on the blocking plate. The securing member includes a first pivoting portion pivotably attached to the mounting bracket, a pressing portion extending from the pivoting portion, and a securing portion extending from the pressing portion. The pressing portion elastically abuts against the mounting end, thereby sandwiching the mounting end between the blocking plate and the pressing portion. The securing portion is for driving the pressing portion to move away from the mounting end by handling the securing portion.

Abstract: A computer system includes a chassis, a motherboard, an isolation component, and a block. The chassis includes a bottom wall, and a sidewall connected to the bottom wall. The motherboard is secured to the chassis. A heat sink is secured to the motherboard for cooling a chip mounted on the motherboard. An isolation component is secured to the chassis between the bottom wall and the motherboard. The isolation component includes a bent piece attached to the side wall and positioned between the heat sink and the sidewall. A distance is defined between the bent piece and the heat sink. The block is attached to the bent piece and positioned between the heat sink and the sidewall to span the distance.

Abstract: An electronic device includes a chassis having a bottom wall, a rear wall, and a sidewall perpendicular to each other. A motherboard is secured on the chassis bottom wall. A first socket is disposed on the motherboard. A mounting bracket is secured in the chassis above the motherboard. The mounting bracket includes a first mounting wall and a second mounting wall. The first mounting wall is parallel to and spaced from the sidewall of the chassis, and the second mounting wall is parallel to and spaced from the rear wall. A first riser card is coupled to the first socket on the motherboard, and is secured to the first mounting wall of the mounting bracket. An expansion card module is accommodated in the mounting bracket and parallel to the bottom wall of the chassis.

Abstract: A computer system includes a chassis, a motherboard, an isolation component, and a block. The chassis includes a bottom wall, and a sidewall connected to the bottom wall. The motherboard is secured to the chassis. A heat sink is secured to the motherboard for cooling a chip mounted on the motherboard. An isolation component is secured to the chassis between the bottom wall and the motherboard. The isolation component includes a bent piece attached to the side wall and positioned between the heat sink and the sidewall. A distance is defined between the bent piece and the heat sink. The block is attached to the bent piece and positioned between the heat sink and the sidewall to span the distance.

Abstract: A mounting apparatus includes a mounting bracket, a mounting piece adapted to mount a PCI card to the mounting bracket, and a securing member. The mounting bracket includes a base and a blocking plate. The mounting piece includes an elongated body and a mounting end. The securing member includes a first pivoting portion pivotably attached to the mounting bracket, a pressing portion, and a mounting portion. The mounting portion includes a securing portion. The securing portion includes a handling portion and a second engaging portion extending from the handling portion. The second engaging portion engages the first engaging portion. The handling portion is configured to drive the second engaging portion to disengage the first engaging portion by pressing the handling portion.

Abstract: A mounting apparatus for a PCI card includes a mounting bracket, a mounting piece for attaching the PCI card to the mounting bracket, and a securing member. The mounting bracket has a base and a blocking plate bent from the base. The mounting piece includes an elongated body and a mounting end bent from the elongated body. The elongated body adjoins the base and the mounting end abuts on the blocking plate. The securing member includes a first pivoting portion pivotably attached to the mounting bracket, a pressing portion extending from the pivoting portion, and a securing portion extending from the pressing portion. The pressing portion elastically abuts against the mounting end, thereby sandwiching the mounting end between the blocking plate and the pressing portion. The securing portion is for driving the pressing portion to move away from the mounting end by handling the securing portion.