Patents by Inventor Ching-Wen Chiang

Ching-Wen Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250110307
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Application
    Filed: December 12, 2024
    Publication date: April 3, 2025
    Inventors: Chao-Chang HU, Chih-Wei WENG, Chia-Che WU, Chien-Yu KAO, Hsiao-Hsin HU, He-Ling CHANG, Chao-Hsi WANG, Chen-Hsien FAN, Che-Wei CHANG, Mao-Gen JIAN, Sung-Mao TSAI, Wei-Jhe SHEN, Yung-Ping YANG, Sin-Hong LIN, Tzu-Yu CHANG, Sin-Jhong SONG, Shang-Yu HSU, Meng-Ting LIN, Shih-Wei HUNG, Yu-Huai LIAO, Mao-Kuo HSU, Hsueh-Ju LU, Ching-Chieh HUANG, Chih-Wen CHIANG, Yu-Chiao LO, Ying-Jen WANG, Shu-Shan CHEN, Che-Hsiang CHIU
  • Publication number: 20250105512
    Abstract: An antenna structure and an electronic device are provided. The antenna structure includes a feeding source, a main radiation portion, a metal portion, and a grounding portion. The main radiation portion is signally connected to the feeding source. There is a first gap between the metal portion and the main radiation portion. There is a second gap between the grounding portion and the metal portion, and there is a third gap between the grounding portion and the main radiation portion. The main radiation portion couples with the metal portion via the first gap, and the grounding portion couples with the metal portion via the second gap.
    Type: Application
    Filed: September 18, 2024
    Publication date: March 27, 2025
    Inventors: Jia-Le ZHU, Ching-Wen CHEN, Cheng-Wei CHIANG, Wen-Pin HO
  • Publication number: 20250080756
    Abstract: A method and apparatus for inter prediction in video coding system are disclosed. According to the method, one or more model parameters of one or more cross-color models for the second-color block are determined. Then, cross-color predictors for the second-color block are determined, wherein one cross-color predictor value for the second-color block is generated for each second-color pixel of the second-color block by applying said one or more cross-color models to corresponding reconstructed or predicted first-color pixels. The input data associated with the second-color block is encoded using prediction data comprising the cross-color predictors for the second-color block at the encoder side, or the input data associated with the second-color block is decoded using the prediction data comprising the cross-color predictors for the second-color block at the decoder side.
    Type: Application
    Filed: December 20, 2022
    Publication date: March 6, 2025
    Inventors: Man-Shu CHIANG, Olena CHUBACH, Yu-Ling HSIAO, Chia-Ming TSAI, Chun-Chia CHEN, Chih-Wei HSU, Tzu-Der CHUANG, Ching-Yeh CHEN, Yu-Wen HUANG
  • Publication number: 20250081594
    Abstract: A semiconductor device structure, along with methods of forming such, are described. The structure includes a first and second gate electrode layers, and a dielectric feature disposed between the first and second gate electrode layers. The dielectric feature has a first surface. The structure further includes a first conductive layer disposed on the first gate electrode layer. The first conductive layer has a second surface. The structure further includes a second conductive layer disposed on the second gate electrode layer. The second conductive layer has a third surface, and the first, second, and third surfaces are coplanar. The structure further includes a third conductive layer disposed over the first conductive layer, a fourth conductive layer disposed over the second conductive layer, and a dielectric layer disposed on the first surface of the dielectric feature. The dielectric layer is disposed between the third conductive layer and the fourth conductive layer.
    Type: Application
    Filed: November 20, 2024
    Publication date: March 6, 2025
    Inventors: Kuan-Ting PAN, Kuo-Cheng CHIANG, Shang-Wen CHANG, Ching-Wei TSAI, Kuan-Lun CHENG, Chih-Hao WANG
  • Publication number: 20250063155
    Abstract: A method and apparatus for inter prediction in video coding system are disclosed. According to the method, input data associated with a current block comprising at least one colour block are received. A blending predictor is determined according to a weighted sum of at least two candidate predictions generated based on one or more first hypotheses of prediction, one or more second hypotheses of prediction, or both. The first hypotheses of prediction are generated based on one or more intra prediction modes comprising a DC mode, a planar mode or at least one angular modes. The second hypotheses of prediction are generated based on one or more cross-component modes and a collocated block of said at least one colour block. The input data associated with the colour block is encoded or decoded using the blending predictor.
    Type: Application
    Filed: December 20, 2022
    Publication date: February 20, 2025
    Inventors: Man-Shu CHIANG, Olena CHUBACH, Chia-Ming TSAI, Yu-Ling HSIAO, Chun-Chia CHEN, Chih-Wei HSU, Tzu-Der CHUANG, Ching-Yeh CHEN, Yu-Wen HUANG
  • Publication number: 20250055190
    Abstract: An antenna-in-package construction includes a chip layer, a second dielectric layer, and a first dielectric layer stacked in order. The first dielectric layer has a dielectric constant more than 3.5. The antenna-in-package construction includes a transmitting antenna array, a receiving antenna array, and metal isolated pillars. The transmitting antenna array extends from the chip layer to the first dielectric layer through the second dielectric layer. The receiving antenna array extends from the chip layer to the second dielectric layer. The transmitting antenna array and the receiving antenna array are arranged in an alternating interleaved sequence. The metal isolated pillars surround each transmitting antenna and each receiving antenna. The chip layer includes at least one transmitting chip and at least one receiving chip. The transmitting chip and the receiving chip are electrically connected to the transmitting antenna array and the receiving antenna array, respectively.
    Type: Application
    Filed: September 18, 2023
    Publication date: February 13, 2025
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ching-Wen CHIANG, Huan-Ta Chen, Chung-Lien Ho, Chin Pin Chen
  • Publication number: 20250056008
    Abstract: A video coding system that uses multiple models to predict chroma samples is provided. The video coding system receives data for a block of pixels to be encoded or decoded as a current block of a current picture of a video. The system constructs two or more chroma prediction models based on luma and chroma samples neighboring the current block. The system applies the two or more chroma prediction models to incoming or reconstructed luma samples of the current block to produce two or more model predictions. The system computes predicted chroma samples by combining the two or more model predictions. The system uses the predicted chroma samples to reconstruct chroma samples of the current block or to encode the current block.
    Type: Application
    Filed: December 20, 2022
    Publication date: February 13, 2025
    Inventors: Yu-Ling HSIAO, Olena CHUBACH, Chun-Chia CHEN, Chia-Ming TSAI, Man-Shu CHIANG, Chih-Wei HSU, Tzu-Der CHUANG, Ching-Yeh CHEN, Yu-Wen HUANG
  • Publication number: 20250039356
    Abstract: A video coding system that uses multiple models to predict chroma samples is provided. The video coding system receives data for a block of pixels to be encoded or decoded as a current block of a current picture of a video. The video coding system derives multiple prediction linear models based on luma and chroma samples neighboring the current block. The video coding system constructs a composite linear model based on the multiple prediction linear models. The video coding system applies the composite linear model to incoming or reconstructed luma samples of the current block to generate a chroma predictor of the current block. The video coding system uses the chroma predictor to reconstruct chroma samples of the current block or to encode the current block.
    Type: Application
    Filed: December 29, 2022
    Publication date: January 30, 2025
    Inventors: Chia-Ming TSAI, Chun-Chia CHEN, Yu-Ling HSIAO, Man-Shu CHIANG, Chih-Wei HSU, Olena CHUBACH, Tzu-Der CHUANG, Ching-Yeh CHEN, Yu-Wen HUANG
  • Patent number: 12204163
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: February 5, 2024
    Date of Patent: January 21, 2025
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 12205888
    Abstract: Semiconductor packages and methods of forming the same are disclosed. An semiconductor package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.
    Type: Grant
    Filed: August 1, 2023
    Date of Patent: January 21, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd
    Inventors: Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh
  • Publication number: 20250024072
    Abstract: A method and apparatus for video coding system that uses intra prediction based on cross-colour linear model are disclosed. According to the method, model parameters for a first-colour predictor model are determined and the first-colour predictor model provides a predicted first-colour pixel value according to a combination of at least two corresponding reconstructed second-colour pixel values. According to another method, the first-colour predictor model provides a predicted first-colour pixel value based on a second degree model or higher of one or more corresponding reconstructed second-colour pixel values. First-colour predictors for the current first-colour block are determined according to the first-colour prediction model. The input data are then encoded at the encoder side or decoded at the decoder side using the first-colour predictors.
    Type: Application
    Filed: October 26, 2022
    Publication date: January 16, 2025
    Inventors: Olena CHUBACH, Ching-Yeh CHEN, Tzu-Der CHUANG, Chun-Chia CHEN, Man-Shu CHIANG, Chia-Ming TSAI, Yu-Ling HSIAO, Chih-Wei HSU, Yu-Wen HUANG
  • Patent number: 10886593
    Abstract: An antenna package structure comprises a substrate with a first surface and a second surface; a dielectric layer, disposed on the first surface of the substrate comprises at least a impedance matching structure and an interconnection structure; a molding layer, disposed on the dielectric layer comprises a plurality of chips wherein a control chip electrically connects to the impedance matching structure and a plurality of conducting structures; an antenna layer, disposed on the second surface of the substrate comprising at least an antenna electrically connects to the substrate; and a protection layer covers the antenna layer.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: January 5, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ching-Wen Chiang, Yen-Cheng Kuan, Chia-Jen Liang
  • Patent number: 10707835
    Abstract: A wireless receiving device is provided. The wireless receiving device includes a first passive mixer and a common gate amplifier. The first passive mixer receives an oscillation signal. The common gate amplifier is coupled to the first passive mixer, and automatically adjusts the input impedance of the common gate amplifier according to the oscillation frequency of the oscillation signal.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: July 7, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chia-Jen Liang, Yen-Cheng Kuan, Ching-Wen Chiang, Mau-Chung Chang
  • Publication number: 20200203817
    Abstract: An antenna package structure comprises a substrate with a first surface and a second surface; a dielectric layer, disposed on the first surface of the substrate comprises at least a impedance matching structure and an interconnection structure; a molding layer, disposed on the dielectric layer comprises a plurality of chips wherein a control chip electrically connects to the impedance matching structure and a plurality of conducting structures; an antenna layer, disposed on the second surface of the substrate comprising at least an antenna electrically connects to the substrate; and a protection layer covers the antenna layer.
    Type: Application
    Filed: December 26, 2018
    Publication date: June 25, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ching-Wen CHIANG, Yen-Cheng KUAN, Chia-Jen LIANG
  • Publication number: 20200195231
    Abstract: A wireless receiving device is provided. The wireless receiving device includes a first passive mixer and a common gate amplifier. The first passive mixer receives an oscillation signal. The common gate amplifier is coupled to the first passive mixer, and automatically adjusts the input impedance of the common gate amplifier according to the oscillation frequency of the oscillation signal.
    Type: Application
    Filed: December 26, 2018
    Publication date: June 18, 2020
    Inventors: Chia-Jen LIANG, Yen-Cheng KUAN, Ching-Wen CHIANG, Mau-Chung CHANG
  • Patent number: 10566299
    Abstract: Method for manufacturing a multi-band antenna package structure includes providing a first temporary substrate; forming a first dielectric material layer, and first metal patterns; forming at least one metal via; forming at least one metal pillar, and disposing an integrated circuit chip; forming a molding layer; thinning down the molding layer thus forming an integrated circuit chip layer; forming a first redistribution layer; forming a first antenna unit layer; forming a first protection layer, thus a first stacked structure formed; removing the first temporary substrate, and facing down the first stacked structure to adhere it on a second temporary substrate with a second glue layer; forming a second redistribution layer; forming a second protection layer; forming bump balls, thus a second stacked structure formed; removing the second temporary substrate with the second glue layer, facing down and mounting the second stacked structure on a substrate through the bump balls.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: February 18, 2020
    Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Ching-Wen Chiang, Yen-Cheng Kuan, Chia-Jen Liang, Chien-Te Yu
  • Publication number: 20190333883
    Abstract: Method for manufacturing a multi-band antenna package structure includes providing a first temporary substrate; forming a first dielectric material layer, and first metal patterns; forming at least one metal via; forming at least one metal pillar, and disposing an integrated circuit chip; forming a molding layer; thinning down the molding layer thus forming an integrated circuit chip layer; forming a first redistribution layer; forming a first antenna unit layer; forming a first protection layer, thus a first stacked structure formed; removing the first temporary substrate, and facing down the first stacked structure to adhere it on a second temporary substrate with a second glue layer; forming a second redistribution layer; forming a second protection layer; forming bump balls, thus a second stacked structure formed; removing the second temporary substrate with the second glue layer, facing down and mounting the second stacked structure on a substrate through the bump balls.
    Type: Application
    Filed: July 8, 2019
    Publication date: October 31, 2019
    Inventors: CHING-WEN CHIANG, YEN-CHENG KUAN, CHIA-JEN LIANG, CHIEN-TE YU
  • Patent number: 10424550
    Abstract: A multi-band antenna package structure includes a first redistribution layer; an integrated circuit layer, formed on the first redistribution layer, comprising at least one metal via, at least one metal pillar, an integrated circuit chip, and a molding layer, wherein the molding layer is used to fill openings formed by the metal via, the metal pillar and the integrated circuit chip which are disposed on the first redistribution layer, the metal via is electrically connected to one of the first metal patterns of the first redistribution layer; a second redistribution layer, formed on the integrated circuit layer; and a first antenna unit layer, comprising a first dielectric layer and third metal patterns formed in openings of the first dielectric layer, wherein at least one of the third metal patterns is electrically connected to one of the second metal patterns, and the third metal patterns form a first antenna unit.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: September 24, 2019
    Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Ching-Wen Chiang, Yen-Cheng Kuan, Chia-Jen Liang, Chien-Te Yu
  • Patent number: 10361154
    Abstract: A variable inductor which comprises a primary conductor, first and second secondary conductors and one or more switch. The primary conductor has a first node and a second node, wherein the first node is used to connect a first external component and the second node is used to connect a second external component. The first and second secondary conductors magnetically couple to the primary conductor. The one or more switch has two sides connected to the first or second secondary conductor, respectively. The first and second secondary conductors are formed a single-loop structure with two or more changeable current paths which are operated by the states of the one or more switch. An integrated circuit using the variable inductor is also introduced.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: July 23, 2019
    Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Chia-Jen Liang, Yen-Cheng Kuan, Ching-Wen Chiang, Chien-Te Yu
  • Publication number: 20190189572
    Abstract: A multi-band antenna package structure includes a first redistribution layer; an integrated circuit layer, formed on the first redistribution layer, comprising at least one metal via, at least one metal pillar, an integrated circuit chip, and a molding layer, wherein the molding layer is used to fill openings formed by the metal via, the metal pillar and the integrated circuit chip which are disposed on the first redistribution layer, the metal via is electrically connected to one of the first metal patterns of the first redistribution layer; a second redistribution layer, formed on the integrated circuit layer; and a first antenna unit layer, comprising a first dielectric layer and third metal patterns formed in openings of the first dielectric layer, wherein at least one of the third metal patterns is electrically connected to one of the second metal patterns, and the third metal patterns form a first antenna unit.
    Type: Application
    Filed: December 19, 2017
    Publication date: June 20, 2019
    Inventors: CHING-WEN CHIANG, YEN-CHENG KUAN, CHIA-JEN LIANG, CHIEN-TE YU