Abstract: An apparatus for generating at least one particle shield in photolithography includes a first component and a second component. The first component and the second component are operable to form a first particle shield of the at least one particle shield for blocking particles from contacting a proximate surface of an object. The first component includes a first gas injector, and the second component includes a first gas extractor corresponding to the first gas injector. The first gas injector is configured to blow out a gas, thereby forming the first particle shield. The first gas extractor is configured to work with the first gas injector for providing gas pressure gradient for the first particle shield.

Abstract: An apparatus for generating at least one particle shield in photolithography includes a first component and a second component. The first component and the second component are operable to form a first particle shield of the at least one particle shield for blocking particles from contacting a proximate surface of an object. The first component includes a first gas injector, and the second component includes a first gas extractor corresponding to the first gas injector. The first gas injector is configured to blow out a gas, thereby forming the first particle shield. The first gas extractor is configured to work with the first gas injector for providing gas pressure gradient for the first particle shield.

Abstract: An apparatus for generating at least one particle shield. The at least one particle shield includes a first component and a second component. The first component and the second component are usable to form a first particle shield of the at least one particle shield for blocking particles from contacting a proximate surface of an object, the first particle shield is substantially parallel to and physically separated from the proximate surface of the object, and the first particle shield includes an energy gradient force or a velocity gradient force.

Abstract: A method for repairing an attenuated phase shift mask providing an attenuated phase shift mask comprising an etched opening and at least one underlying light attenuating layer to reveal a quartz substrate the opening including an unetched portion comprising the at least one light attenuating layer; blanket depositing a negative photoresist layer over the at least one light blocking layer to include filling at a portion of the opening; exposing the negative photoresist layer through the quartz substrate and developing the negative photoresist layer to form a negative photoresist layer portion filling a portion of the opening; and carrying out a dry etching process to remove the unetched portion.

Abstract: A new method of provided for the creation of a rim-type phase-shift mask. Layers of phase shifter material, chrome and an etch resist mask having an opening having a first width are created. The layer of chrome is etched, the etch resist mask is removed. The layer of MoSiON is isotropically etched using the patterned and etched layer of chrome as a mask, partially removing the layer of MoSiON from under the chrome mask. A second layer of etch resist is deposited over the surface of the chrome mask, into the opening created through the layer of chrome and further over the surface of the rim of the mask. The second etch resist layer is exposed and developed, whereby the patterned and etched layer of chrome serves as a mask, thereby shielding from exposure and therefore leaving in place the second layer of etch resist where this second layer of photoresist overlies the rim of the phase shift mask. The remaining second layer of photoresist forms a protective layer for the layer of MoSiON.

Abstract: A method for repairing an attenuated phase shift mask providing an attenuated phase shift mask comprising an etched opening and at least one underlying light attenuating layer to reveal a quartz substrate the opening including an unetched portion comprising the at least one light attenuating layer; blanket depositing a negative photoresist layer over the at least one light blocking layer to include filling at a portion of the opening; exposing the negative photoresist layer through the quartz substrate and developing the negative photoresist layer to form a negative photoresist layer portion filling a portion of the opening; and carrying out a dry etching process to remove the unetched portion.