Abstract: Systems, methods, and computer-readable medium storing instructions for identifying low-quality signals of an electronic listing of a listing entity are described herein. The method, system, or instructions may include ingesting text including listing information of the electronic listing and listing entity information of the listing entity; normalizing the text; parsing the text to identify a plurality of phrases; generating a set of category scores for each of at least one of the plurality of phrases; identifying, based on the on the sets of category scores, one or more low-quality signals each including a low-quality phrase and low-quality categories; and presenting an indication of the one or more low-quality signals with the electronic listing.

Abstract: Systems, methods, and computer-readable medium storing instructions for identifying low-quality signals of an electronic listing of a listing entity are described herein. The method, system, or instructions may include ingesting text including listing information of the electronic listing and listing entity information of the listing entity; normalizing the text; parsing the text to identify a plurality of phrases; generating a set of category scores for each of at least one of the plurality of phrases; identifying, based on the on the sets of category scores, one or more low-quality signals each including a low-quality phrase and low-quality categories; and presenting an indication of the one or more low-quality signals with the electronic listing.

Abstract: Systems and methods for predicting user actions based upon electronic communication between a user and an organization are disclosed. Based upon user interactions with an organization via electronic communication channels (e.g., e-mail, electronic chat, or voice/video calls), a trained predictive model is used to predict a probability of a future user action relating to the organization. Such user electronic communication is processed to generate message features from message content and metadata, which message features are then combined with other user data features associated with the user or with user interaction with an electronic data system of the organization. The combined data set of message features and user data features is analyzed by the predictive model to generate an output value indicative of a predication of a future user action.

Abstract: Systems and methods for guided vehicle matching are disclosed. In order to generate vehicle recommendations for a user of an electronic vehicle listing service, a plurality of vehicle-related lifestyle options are presented to the user, and a user selection received. Additional data regarding the user's vehicle preferences, requirements, or usage may be obtained. Based upon such information, a set of example vehicles is generated and presented to the user. Each example vehicle has characteristics representing a plurality of other vehicles. Based upon user ratings or selections of at least some of the example vehicles, a plurality of vehicle recommendations for specific available vehicles are generated and presented to the user. In some embodiments, further user interaction with such recommendations is used to refine the vehicle recommendations and identify additional vehicle recommendations.

Abstract: Systems and methods for guided vehicle matching are disclosed. In order to generate vehicle recommendations for a user of an electronic vehicle listing service, a plurality of vehicle-related lifestyle options are presented to the user, and a user selection received. Additional data regarding the user's vehicle preferences, requirements, or usage may be obtained. Based upon such information, a set of example vehicles is generated and presented to the user. Each example vehicle has characteristics representing a plurality of other vehicles. Based upon user ratings or selections of at least some of the example vehicles, a plurality of vehicle recommendations for specific available vehicles are generated and presented to the user. In some embodiments, further user interaction with such recommendations is used to refine the vehicle recommendations and identify additional vehicle recommendations.

Abstract: Systems and methods for guided vehicle matching are disclosed. In order to generate vehicle recommendations for a user of an electronic vehicle listing service, a plurality of vehicle-related lifestyle options are presented to the user, and a user selection received. Additional data regarding the user's vehicle preferences, requirements, or usage may be obtained. Based upon such information, a set of example vehicles is generated and presented to the user. Each example vehicle has characteristics representing a plurality of other vehicles. Based upon user ratings or selections of at least some of the example vehicles, a plurality of vehicle recommendations for specific available vehicles are generated and presented to the user. In some embodiments, further user interaction with such recommendations is used to refine the vehicle recommendations and identify additional vehicle recommendations.

Abstract: Systems and methods for providing information regarding vehicle inventory availability to users of an information system are disclosed. When generating a vehicle data page for a particular vehicle at a particular location, the information system may generate an expected duration of availability of the vehicle as a prediction of the time between listing and sale of the vehicle. When the expected duration of availability is below a threshold, a status indicator may be generated and added to the vehicle data page to alert users that the vehicle is expected to remain available for only a short period of time. An estimate of time remaining for the vehicle may also be generated and presented to users as part of the vehicle data page.

Abstract: A silicon carrier space transformer assembly includes one or more silicon structures, which provide space transformer scaling to permit interconnection for fine pitch input/output interconnections with a semiconductor die or wafer, and fine pitch test probe tips connected to the one or more silicon structures.

Abstract: An access point generates beacons at different power levels at different times to provide an acceptable tradeoff between coverage area associated with the beacons and outage experienced at nearby access terminals. For example, a femto access point may transmit beacons at a relatively low power for a relatively long period of time to reduce interference at nearby access terminals that are being served by a macro access point. The femto access point may then transmit beacons at a relatively high power for a relatively short period of time to enable nearby access terminals to receive the beacons. Also, a given transmit chain may be used to provide frequency hopping of high and low power beacons.

Abstract: A method for reducing interference to wireless communication devices is disclosed. A proximity of a wireless communication device to a base station is determined. The proximity of the wireless communication device is compared with a proximity threshold and based on the comparison, access to a femtocell may be granted to a restricted/non-CSG (closed subscriber group) wireless communication device. The method also includes causing a registration response to be sent to the wireless communication device based on the comparison.

Abstract: A silicon carrier space transformer assembly includes one or more silicon structures, which provide space transformer scaling to permit interconnection for fine pitch input/output interconnections with a semiconductor die or wafer, and fine pitch test probe tips connected to the one or more silicon structures.

Abstract: Method of fabricating a semiconductor die with a microlens associated therewith. More particularly, a method for fabricating a vertical channel guide optical via through a silicon substrate wherein the optical via can contain lens elements, a discrete index gradient guiding pillar and other embodiments. Also disclosed are means for transferring, coupling and or focusing light from an electronic-optical device on the top of a semiconductor substrate through the substrate to a waveguiding medium below the substrate. The high alignment accuracies afforded by standard semiconductor fabrication processes are exploited so as to obviate the need for active alignment of the optical coupling or light guiding elements.

Abstract: A method of fabricating a semiconductor device including forming a micro-chip comprising a thinned-wafer having one or more components fabricated thereon disposed between a carrier and a semiconductor chip, the micro-chip being electrically connected to the semiconductor chip under a higher consumption macro of the semiconductor chip and including a thickness which is less than a thickness of the semiconductor chip, forming an interconnect between the semiconductor chip and the carrier, forming an interconnect between the micro-chip and the semiconductor chip, and forming an interconnect between the micro-chip and the carrier. The micro-chip includes a thinned micro-chip having a thickness of less than 20 microns and the semiconductor chip includes plural semiconductor chips formed as a chip stack. The micro-chip includes a plurality of micro-chips formed on the plural semiconductor chips, such that the semiconductor device is a three-dimensional integrated circuit.

Abstract: Interconnects are formed on attachment points of a wafer by performing several steps. A plurality of cavities having a predetermined shape is formed in a semiconductor substrate. These cavities are then filled with an interconnect material to form the interconnects. The interconnects are subsequently attached to the attachment points of the wafer.

Abstract: A silicon carrier structure for electronic packaging includes a base substrate, a silicon carrier substrate disposed on the base substrate, a memory chip disposed on the silicon carrier substrate, a microprocessor chip disposed on the silicon carrier substrate, an input/output chip disposed on the silicon carrier substrate, and a clocking chip disposed on the silicon carrier substrate.

Abstract: A silicon carrier space transformer assembly includes one or more silicon structures, which provide space transformer scaling to permit interconnection for fine pitch input/output interconnections with a semiconductor die or wafer, and fine pitch test probe tips connected to the one or more silicon structures.

Abstract: A silicon carrier structure for electronic packaging includes a base substrate, a silicon carrier substrate disposed on the base substrate, a memory chip disposed on the silicon carrier substrate, a microprocessor chip disposed on the silicon carrier substrate, an input/output chip disposed on the silicon carrier substrate, and a clocking chip disposed on the silicon carrier substrate.

Abstract: An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board.

Abstract: A silicon carrier space transformer assembly includes one or more silicon structures, which provide space transformer scaling to permit interconnection for fine pitch input/output interconnections with a semiconductor die or wafer, and fine pitch test probe tips connected to the one or more silicon structures.

Abstract: A method of fabricating a semiconductor device including forming a micro-chip comprising a thinned-wafer having one or more components fabricated thereon disposed between a carrier and a semiconductor chip, the micro-chip being electrically connected to the semiconductor chip under a higher consumption macro of the semiconductor chip and including a thickness which is less than a thickness of the semiconductor chip, forming an interconnect between the semiconductor chip and the carrier, forming an interconnect between the micro-chip and the semiconductor chip, and forming an interconnect between the micro-chip and the carrier. The micro-chip includes a thinned micro-chip having a thickness of less than 20 microns and the semiconductor chip includes plural semiconductor chips formed as a chip stack. The micro-chip includes a plurality of micro-chips formed on the plural semiconductor chips, such that the semiconductor device is a three-dimensional integrated circuit.