Abstract: A method is disclosed to divide a wafer into chips. In the method, a substrate is provided. The substrate is made of an isolating material. An epitaxial laminate is provided on the substrate. At least one slit is made through the epitaxial laminate completely to form at least two chips connected to each other by the substrate only so that each of the chips includes a portion of the substrate and a portion of the epitaxial laminate. Positive and negative electrodes are formed in each of the chips. An upper protective film is provided to cover an upper side of each of the chips except the electrodes. A peripheral protective film is provided into the slit to cover the periphery of the portion of the epitaxial laminate of each of the chips. Finally, the chips are separated from each other.

Abstract: A flip chip LED die is provided and includes a first type doped layer, a second type doped layer, a first electrode layer, a second electrode layer and an insulation layer. The second type doped layer is disposed under the first type doped layer. The first electrode layer is disposed under the first type doped layer without contacting the second type doped layer. The first electrode layer has an exposed area for directly coating an electrically conductive adhesive thereon. The second metal/electrode layer is disposed under the second type doped layer, and also has an exposed area for directly coating the electrically conductive adhesive thereon. The insulation layer is disposed between the first electrode layer and the second electrode layer for electrically insulating and supporting the first electrode layer and the second electrode layer.

Abstract: A flip chip LED die is provided and includes a first type doped layer, a second type doped layer, a first electrode layer, a second electrode layer and an insulation layer. The second type doped layer is disposed under the first type doped layer. The first electrode layer is disposed under the first type doped layer without contacting the second type doped layer. The first electrode layer has an exposed area for directly coating an electrically conductive adhesive thereon. The second metal/electrode layer is disposed under the second type doped layer, and also has an exposed area for directly coating the electrically conductive adhesive thereon. The insulation layer is disposed between the first electrode layer and the second electrode layer for electrically insulating and supporting the first electrode layer and the second electrode layer.

Abstract: A white-light LED device is disclosed. The white-light LED device includes a base, at least one purple light source and at least one yellow light source. The purple light source and the yellow light source are disposed on the base, and they are adjacent to each other such that the illuminations are mixed to produce white light. An illumination method is also disclosed. The illumination method includes the following steps: At least one purple light source and at least one yellow light source are disposed on a base. The illuminations of the yellow light source and the purple light source are mixed to produce white light.

Abstract: A method is disclosed to divide a wafer into chips. In the method, a substrate is provided. The substrate is made of an isolating material. An epitaxial laminate is provided on the substrate. At least one slit is made through the epitaxial laminate completely to form at least two chips connected to each other by the substrate only so that each of the chips includes a portion of the substrate and a portion of the epitaxial laminate. Positive and negative electrodes are formed in each of the chips. An upper protective film is provided to cover an upper side of each of the chips except the electrodes. A peripheral protective film is provided into the slit to cover the periphery of the portion of the epitaxial laminate of each of the chips. Finally, the chips are separated from each other.

Abstract: A method for forming chips on a wafer includes forming one or more spaces in a substrate to form and to space two or more chips from each other, forming a positive electrode and a negative electrode in each of the chips, cutting one or more cut-off portions through the substrate and communicating with the space of the substrate. A protective layer is applied onto the outer peripheral portion of the substrate and the chips and includes a covering portion engaged into the cut-off portion of the substrate for allowing the substrate and the chips to be completely shielded and protected by the protective layer without further sealing or packaging operations.

Abstract: A light emitting diode chip has a large area of electricity conducting layer applied to each of the P pole and the N pole. The etching process does not reduce the illuminating area so that the areas of illumination and reflection are increased and the efficiency for dispensing heat is increased. The light emitting diode chip needs no encapsulation and includes functions as those flip chips and SMD.

Abstract: A light emitting diode chip has a large area of electricity conducting material applied to each of the P pole and the N pole and the etching process does not reduce the illuminating area so that the areas of illumination and reflection are increased and the efficiency for dispensing heat is increased. The light emitting diode chip needs no encapsulation and includes functions as those flip chips and SMD.

Abstract: The indicator light collector includes a body, a first reflecting portion, a second reflecting portion, a lighting device, a circuit unit, a third reflecting portion, and a pattern portion. The body is formed by a transparent material. The first reflecting portion and second reflecting portion are installed at two lateral side of the body. The lighting device is received in a hollow receiving space being formed between the body and the first reflecting portion. The circuit unit is connected to a power source and the lighting device. The third reflecting portion is disposed on the surface of the body for reflecting the light refracted from the surface of the body. By the first, second and third reflecting portions, the indicator is more bright and is easily sensed the pattern portion disposed at the indicator by human eyes.