Light emitting diode chip with large heat dispensing and illuminating area
A light emitting diode chip has a large area of electricity conducting material applied to each of the P pole and the N pole and the etching process does not reduce the illuminating area so that the areas of illumination and reflection are increased and the efficiency for dispensing heat is increased. The light emitting diode chip needs no encapsulation and includes functions as those flip chips and SMD.
The present invention relates to a light emitting diode chip with large area of heat dispensing and illuminating area.
BACKGROUND OF THE INVENTION A conventional light emitting diode chip is shown in
As shown in
The present invention intends to provide a light emitting diode chip wherein the etching process does not reduce the illuminating area so that the areas of illumination and reflection are increased and the efficiency for dispensing heat is increased.
SUMMARY OF THE INVENTIONThe present invention provides a light emitting diode chip wherein the etching process does not reduce the illuminating area and a large area of electricity conducting area is applied to each of the P pole and the N pole so that the areas of illumination and reflection are increased and the efficiency for dispensing heat is increased. The light emitting diode chip needs no encapsulation and includes functions as those flip chips and SMD.
The present invention will become more obvious from the following description when taken in connection with the accompanying drawings which show, for purposes of illustration only, a preferred embodiment in accordance with the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS
Referring to
As shown in
The conventional chips are compact and the areas of P pole and N pole are limited by the size of the chips so that gold, silver, tine beads or welding lines have to be applied to the two poles and this increases cost or expenses of manufacturing, encapsulation and welding.
The chip of the present invention needs not base board, welding lines or welding processes and can be directly connected to the printed circuit board by conventional welding methods. The chip has all the function that SMD and flip chips without encapsulation. The area lost of the illumination layer by etching is reduced so that the illumination of the chip is increased. The large area of the electricity conductive material has good efficiency of dispensing heat and reflects light so that the chip has good illumination feature. The electricity conductive material can be easily welded to the printed circuit board.
While we have shown and described the embodiment in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.
Claims
1. A chip comprising:
- a P pole and an N pole, each of the a P pole and an N pole having a large area of electricity conductive material connected thereto, an etching area to the area of the electricity conductive material being reduced and the electricity conductive material reflecting light, the chip having function of SMD and flip chip without encapsulation.
2. The chip as claimed in claim 1, wherein the electricity conductive material is gold, silver, copper, aluminum, tin or alloy.
Type: Application
Filed: Nov 23, 2005
Publication Date: Jun 1, 2006
Inventor: Chiu-Chung Yang (Taichung City)
Application Number: 11/285,799
International Classification: H01L 33/00 (20060101);