Abstract: A package structure includes a first substrate and a first device disposed on the first substrate. The first device includes at least one anchor structure, a film structure anchored by the anchor structure and an actuator configured to control the film structure to form a first vent temporarily. The film structure partitions a space into a first volume to be connected to an ear canal and a second volume connected to an ambient of a wearable sound device. The ear canal and the ambient are connected via the first vent when the first vent is opened. The first vent is opened by controlling a first membrane portion and a second membrane portion of the film structure, such that a difference between a first displacement of the first membrane portion and a second displacement of the second membrane portion is larger than a thickness of the film structure.

Abstract: An acoustic transducer is configured to perform an acoustic transformation. The acoustic transducer is disposed within a wearable sound device or to be disposed within the wearable sound device. The acoustic transducer includes at least one anchor structure, a film structure and an actuator. The film structure is disposed within a first layer and anchored by the anchor structure disposed within a second layer. The actuator is disposed on the film structure, and the actuator is configured to actuate the film structure to form a vent temporarily. The film structure partitions a space into a first volume to be connected to an ear canal of a wearable sound device user and a second volume to be connected to an ambient of the wearable sound device. The ear canal and the ambient are to be connected via the vent temporarily opened when the film structure is actuated.

Abstract: An acoustic testing method includes providing an electrical signal to a wafer, receiving a sound wave generated by the acoustic transducer according to the electrical signal, and generating a sensing result for determining an acoustic functionality of the acoustic transducer. The wafer includes a plurality of acoustic transducers, and the electrical signal is provided to an acoustic transducer within the wafer.

Abstract: A sound producing package structure configured to produce sound includes a substrate, a sound producing component and a conductive adhesive layer. The sound producing component is disposed on the substrate, and the sound producing component is configured to generate an acoustic wave corresponding to an input audio signal. The conductive adhesive layer is disposed between the substrate and the sound producing component by a surface mount technology.

Abstract: An acoustic transducer is disposed within a wearable sound device or to be disposed within the wearable sound device. The acoustic transducer includes a first anchor structure and a first flap. The first flap includes a first end and a second end. The first end is anchored by the first anchor structure, and the second end is configured to perform a first up-and-down movement to form a vent temporarily. The first flap partitions a space into a first volume to be connected to an ear canal and a second volume to be connected to an ambient of the wearable sound device. The ear canal and the ambient are connected via the vent temporarily opened.

Abstract: A crossover circuit, disposed within a sound producing device including a first sound producing cell driven by a first driving signal and a second sound producing cell driven by a second driving signal, includes a first filter receiving an input signal at an input terminal of the first filter, a first subtraction circuit, and a second filter coupled between the output terminal of the first filter and the second input terminal of the first subtraction circuit. A first input terminal of the first subtraction circuit is coupled to the input terminal of the first filter; a second input terminal of the first subtraction circuit is coupled to an output terminal of the first filter. The crossover circuit produces the first driving signal and the second driving signal according to a first output signal of the first subtraction circuit and a second output signal of the first filter respectively.

Abstract: A package structure includes a housing and a sound producing chip. The sound producing chip is disposed within the housing. The sound producing chip includes a membrane and an actuator. The membrane includes a coupling plate and a spring structure connected to the coupling plate. The actuator is configured to receive a driving signal to actuate the membrane. The spring structure is situated between the coupling plate and the actuator. The coupling plate is actuated to move by the actuator via the spring structure.

Abstract: A sound producing package structure includes a plurality of chips disposed within a cavity. The chips includes a first chip and a second chip, the first chip includes a first sound producing membrane and a first actuator attached to the first sound producing membrane, and a second chip includes a second sound producing membrane and a second actuator attached to the second sound producing membrane. The first sound producing membrane and the second sound producing membrane are actuated toward a center of the cavity in a synchronous fashion so as to produce a sound pressure.

Abstract: An acoustic transducer is disposed within a wearable sound device or to be disposed within the wearable sound device. The acoustic transducer includes a first anchor structure and a first flap. The first flap includes a first end and a second end. The first end is anchored by the first anchor structure, and the second end is configured to perform a first up-and-down movement to form a vent temporarily. The first flap partitions a space into a first volume to be connected to an ear canal and a second volume to be connected to an ambient of the wearable sound device. The ear canal and the ambient are connected via the vent temporarily opened.

Abstract: An acoustic transducer is configured to perform an acoustic transformation. The acoustic transducer is disposed within a wearable sound device or to be disposed within the wearable sound device. The acoustic transducer includes at least one anchor structure, a film structure and an actuator. The film structure is disposed within a first layer and anchored by the anchor structure disposed within a second layer. The actuator is disposed on the film structure, and the actuator is configured to actuate the film structure to form a vent temporarily. The film structure partitions a space into a first volume to be connected to an ear canal of a wearable sound device user and a second volume to be connected to an ambient of the wearable sound device. The ear canal and the ambient are to be connected via the vent temporarily opened when the film structure is actuated.

Abstract: A crossover circuit, disposed within a sound producing device including a first sound producing cell driven by a first driving signal and a second sound producing cell driven by a second driving signal, includes a first filter receiving an input signal at an input terminal of the first filter, a first subtraction circuit, and a second filter coupled between the output terminal of the first filter and the second input terminal of the first subtraction circuit. A first input terminal of the first subtraction circuit is coupled to the input terminal of the first filter; a second input terminal of the first subtraction circuit is coupled to an output terminal of the first filter. The crossover circuit produces the first driving signal and the second driving signal according to a first output signal of the first subtraction circuit and a second output signal of the first filter respectively.

Abstract: An acoustic testing method includes providing an electrical signal to a wafer, receiving a sound wave generated by the acoustic transducer according to the electrical signal, and generating a sensing result for determining an acoustic functionality of the acoustic transducer. The wafer includes a plurality of acoustic transducers, and the electrical signal is provided to an acoustic transducer within the wafer.

Abstract: A sound producing device includes a first sound producing cell, driven by a first driving signal and configured to produce a first acoustic sound on a first audio band, and a second sound producing cell, driven by a second driving signal and configured to produce a second acoustic sound on a second audio band different from the first audio band. A first membrane of the first sound producing cell and a second membrane of the second sound producing cell are Micro Electro Mechanical System fabricated membranes. The first audio band is upper bounded by a first maximum frequency; the second audio band is upper bounded by a second maximum frequency. A first resonance frequency of the first membrane is higher than the first maximum frequency of the first driving signal. A second resonance frequency of the second membrane is higher than the second maximum frequency of the second driving signal.

Abstract: A sound producing package structure configured to produce sound includes a substrate, a sound producing component and a conductive adhesive layer. The sound producing component is disposed on the substrate, and the sound producing component is configured to generate an acoustic wave corresponding to an input audio signal. The conductive adhesive layer is disposed between the substrate and the sound producing component by a surface mount technology.

Abstract: A sound producing package structure includes a shell and a chip. The shell includes a top structure, a bottom structure and a sidewall structure. The chip is disposed inside the shell and configured to produce an acoustic wave, wherein the chip includes a thin film structure and an actuator configured to actuate the thin film structure, and the thin film structure is substantially parallel to the top structure and the bottom structure. A first opening is formed on the sidewall structure, and the acoustic wave propagates outwards through the first opening.

Abstract: A package structure includes a housing and a sound producing chip. The sound producing chip is disposed within the housing. The sound producing chip includes a membrane and an actuator. The membrane includes a coupling plate and a spring structure connected to the coupling plate. The actuator is configured to receive a driving signal to actuate the membrane. The spring structure is situated between the coupling plate and the actuator. The coupling plate is actuated to move by the actuator via the spring structure.

Abstract: A sound producing device includes a first sound producing cell, driven by a first driving signal and configured to produce a first acoustic sound on a first audio band, and a second sound producing cell, driven by a second driving signal and configured to produce a second acoustic sound on a second audio band different from the first audio band. A first membrane of the first sound producing cell and a second membrane of the second sound producing cell are Micro Electro Mechanical System fabricated membranes. The first audio band is upper bounded by a first maximum frequency; the second audio band is upper bounded by a second maximum frequency. A first resonance frequency of the first membrane is higher than the first maximum frequency of the first driving signal. A second resonance frequency of the second membrane is higher than the second maximum frequency of the second driving signal.

Abstract: A sound producing device includes a base and at least one chip disposed on the base. The chip includes at least one membrane and at least one actuator. The membrane includes a coupling plate and at least one spring structure connected to the coupling plate. The actuator is configured to receive a driving signal corresponding to an input audio signal to actuate the membrane, and the input audio signal and the driving signal have an input audio band which has an upper bound at a maximum frequency. The spring structure is situated between the coupling plate and the actuator. The membrane has a first resonance frequency higher than the maximum frequency.

Abstract: A sound producing device includes a base and at least one chip disposed on the base. The chip includes at least one membrane and at least one actuator. The membrane includes a coupling plate and at least one spring structure connected to the coupling plate. The actuator is configured to receive a driving signal corresponding to an input audio signal to actuate the membrane, and the input audio signal and the driving signal have an input audio band which has an upper bound at a maximum frequency. The spring structure is situated between the coupling plate and the actuator. The membrane has a first resonance frequency higher than the maximum frequency.

Abstract: The present invention provides a sound producing device comprising: an air pulse generating element and a control unit. The air pulse generating element comprises an air chamber and an actuator. The control unit, configured to generate a driving voltage applied to the actuator of the air pulse generating element, such that the air pulse generating element generates a plurality of air pulses in response to the driving voltage. The plurality of air pulses are at a pulse rate, and the pulse rate of the plurality of air pulses is higher than a maximum audible frequency.