Abstract: A package structure of a sound producing device includes a base, a cap, a chip and a chamber. The cap is disposed on the base. The chip is disposed on the base, the chip includes a thin film structure and an actuator configured to actuate the thin film structure to generate a plurality of air pulses, and the cap and the chip are on a same side of the base. The chamber is formed by the base and the cap or formed by the base, the cap and the chip; the thin film structure is disposed in the chamber. One of the base or the cap has a sound outlet opening connected to the chamber, and the air pulses propagate outwards through the sound outlet opening.

Abstract: A method for manufacturing an air pulse generating element is provided. First, a thin film layer including a membrane is provided, and then, a plurality of actuators are formed on the thin film layer. After that, a first chamber is formed between the thin film layer and a first plate and followed by patterning the thin film layer to form a plurality of valves, in which the membrane and the valves are formed of the thin film layer. Subsequently, a second chamber is formed between the thin film layer and a second plate, and a plurality of channels are formed in the first plate and the second plate.

Abstract: An air pulse generating element is disclosed. The air pulse generating element includes a front faceplate; a back faceplate; a front supporting element; a back supporting element; a folded membrane, configured to form a front chamber and a back chamber, and comprising a plurality of membrane units; wherein the plurality of membrane units are parallel and sequentially connected and an end of the folded membrane is connected to the back faceplate via the back supporting element and another end of the folded membrane is connected to the front faceplate via the front supporting element; and a plurality of valves controlling a plurality of air flow channels between the front chamber toward either a front space or a back space; wherein the plurality of membrane units are configured to perform horizontal deformation to squeeze air in and out of the front or back chamber with operations of the plurality of valves.

Abstract: A method for manufacturing an air pulse generating element is provided. First, a thin film layer including a membrane is provided, and then, a plurality of actuators are formed on the thin film layer. After that, a first chamber is formed between the thin film layer and a first plate and followed by patterning the thin film layer to form a plurality of valves, in which the membrane and the valves are formed of the thin film layer. Subsequently, a second chamber is formed between the thin film layer and a second plate, and a plurality of channels are formed in the first plate and the second plate.

Abstract: An air pulse generating element, disposed in a sound producing device, includes a membrane, disposed within a chamber; and a plurality of valves, disposed by the membrane within the chamber, configured to seal a plurality of openings of the chamber in response to a plurality of valve control signals; wherein the membrane and the plurality of valves are all fabricated at a first layer.

Abstract: The present invention provides a sound producing device comprising: an air pulse generating element and a control unit. The air pulse generating element comprises an air chamber and an actuator. The control unit, configured to generate a driving voltage applied to the actuator of the air pulse generating element, such that the air pulse generating element generates a plurality of air pulses in response to the driving voltage. The plurality of air pulses are at a pulse rate, and the pulse rate of the plurality of air pulses is higher than a maximum audible frequency.

Abstract: The present invention provides a sound producing device comprising: an air pulse generating element and a control unit. The air pulse generating element comprises an air chamber and an actuator. The control unit, configured to generate a driving voltage applied to the actuator of the air pulse generating element, such that the air pulse generating element generates a plurality of air pulses in response to the driving voltage. The plurality of air pulses are at a pulse rate, and the pulse rate of the plurality of air pulses is higher than a maximum audible frequency.

Abstract: The present invention provides a sound producing device comprising: an air pulse generating element and a control unit. The air pulse generating element comprises an air chamber and an actuator. The control unit, configured to generate a driving voltage applied to the actuator of the air pulse generating element, such that the air pulse generating element generates a plurality of air pulses in response to the driving voltage. The plurality of air pulses are at a pulse rate, and the pulse rate of the plurality of air pulses is higher than a maximum audible frequency.

Abstract: An air pulse generating element, disposed in a sound producing device, includes a membrane, disposed within a chamber; and a plurality of valves, disposed by the membrane within the chamber, configured to seal a plurality of openings of the chamber in response to a plurality of valve control signals; wherein the membrane and the plurality of valves are all fabricated at a first layer.

Abstract: An air pulse generating element, disposed in a sound producing device, includes a membrane, disposed within a chamber; and a plurality of valves, disposed by the membrane within the chamber, configured to seal a plurality of openings of the chamber in response to a plurality of valve control signals; wherein the membrane and the plurality of valves are all fabricated at a first layer.

Abstract: An air pulse generating element, disposed in a sound producing device, includes a membrane, disposed within a chamber; and a plurality of valves, disposed by the membrane within the chamber, configured to seal a plurality of openings of the chamber in response to a plurality of valve control signals; wherein the membrane and the plurality of valves are all fabricated at a first layer.

Abstract: An air pulse generating element is disclosed. The air pulse generating element includes a front faceplate; a back faceplate; a front supporting element; a back supporting element; a folded membrane, configured to form a front chamber and a back chamber, and comprising a plurality of membrane units; wherein the plurality of membrane units are parallel and sequentially connected and an end of the folded membrane is connected to the back faceplate via the back supporting element and another end of the folded membrane is connected to the front faceplate via the front supporting element; and a plurality of valves controlling a plurality of air flow channels between the front chamber toward either a front space or a back space; wherein the plurality of membrane units are configured to perform horizontal deformation to squeeze air in and out of the front or back chamber with operations of the plurality of valves.

Abstract: A MEMS device includes: a fixed structure, a movable structure, and a compensation circuit. The fixed structure includes a fixed electrode and a fixed compensation electrode. The movable structure includes a movable electrode and a movable compensation electrode. The movable electrode and the fixed electrode form a sensing capacitor, and the movable compensation electrode and the fixed compensation electrode form a compensation capacitor. The compensation circuit compensates a sensing signal generated by the sensing capacitor with a compensation signal generated by the compensation capacitor. The sensing capacitor and the compensation capacitor do not form a differential capacitor pair. A proportion of the sensing area of the compensation capacitor to the sensing area of the sensing capacitor is lower than 1.

Abstract: A rotation velocity sensor includes a driving unit, a proof mass, a rotation sensing element, a compensating unit, and a rotation sensing unit. The driving unit generates a vibration driving signal and a reference signal. The proof mass is driven by the vibration driving signal to vibrate in a first direction. The rotation sensing element senses a vibration of the proof mass to generate a charge signal which corresponds to a portion of the vibration of the proof mass in a second direction orthogonal to the first direction. The compensating unit generates a compensation signal according to the reference signal. The rotation sensing unit converts the charge signal to a voltage signal or a current signal, and compensates the voltage signal or the current signal according to the compensation signal to cancel a noise in the second direction.

Abstract: The present invention discloses a MEMS chip which includes a device wafer and a cap wafer. The device wafer includes a first substrate and a MEMS device. The MEMS device includes a movable structure. The cap wafer includes a second substrate, an elastic structure and a stopper. The stopper is connected to the second substrate by the elastic structure. The stopper constrains a movement of the movable structure, and when the movable structure contacts the stopper, the elastic structure provides a resilience force to the stopper.

Abstract: A wafer-level packaged semiconductor device is described. In an implementation, the device includes one or more self-assembled resilient leads disposed on an integrated circuit chip. Each of the resilient leads are configured to move from a first position wherein the resilient lead is held adjacent to the chip and a second position wherein the resilient lead is extended away from the chip to interconnect the chip to a printed circuit board. A guard is provided to protect the resilient leads when the resilient leads are in the first position. One or more attachment bumps may also be furnished to facilitate attachment of the device to the printed circuit board.

Abstract: A micromachined magnetic field sensor is disclosed. The micromachined magnetic field sensor includes a substrate; and a drive subsystem partially supported by the substrate with a plurality of beams, and at least one anchor; a mechanism for providing an electrical current through the drive subsystem along a first axis; and Lorentz force acting on the drive subsystem along a second axis in response to a magnetic field vector along a third axis. The micromachined magnetic field sensor also includes a position transducer to detect the motion of the drive subsystem and an electrostatic offset cancellation mechanism coupled to the drive subsystem.

Abstract: A micromachined magnetic field sensor is disclosed. The micromachined magnetic field comprises a substrate; a drive subsystem, the drive subsystem comprises a plurality of beams, and at least one anchor connected to the substrate; a mechanism for providing an electrical current through the drive subsystem along a first axis; and Lorentz force acting on the drive subsystem along a second axis in response to a magnetic field along a third axis. The micromachined magnetic field sensor also includes a sense subsystem, the sense subsystem includes a plurality of beams, and at least one anchor connected to the substrate; wherein a portion of the sense subsystem moves along a fourth axis; a coupling spring between the drive subsystem and the sense subsystem which causes motion of the sense subsystem in response to the magnetic field; and a position transducer to detect the motion of the sense subsystem.

Abstract: A wafer-level packaged semiconductor device is described. In an implementation, the device includes one or more self-assembled resilient leads disposed on an integrated circuit chip. Each of the resilient leads are configured to move from a first position wherein the resilient lead is held adjacent to the chip and a second position wherein the resilient lead is extended away from the chip to interconnect the chip to a printed circuit board. A guard is provided to protect the resilient leads when the resilient leads are in the first position. One or more attachment bumps may also be furnished to facilitate attachment of the device to the printed circuit board.

Abstract: Wafer-level chip-scale package semiconductor devices are described that have bump assemblies configured to mitigate solder bump failures due to stresses, particularly stresses caused by CTE mismatch during thermal cycling tests, dynamic deformation during drop tests or cyclic bending tests, and so on. In an implementation, the wafer-level chip-scale package devices include an integrated circuit chip having two or more arrays of bump assemblies for mounting the device to a printed circuit board. At least one of the arrays includes bump assemblies that are configured to withstand higher levels of stress than the bump assemblies of the remaining arrays.