Patents by Inventor Chong Kim

Chong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9247776
    Abstract: A pocket for a garment includes a first pocket fixedly attached to the garment at a predetermined location wherein a first opening is formed on the garment and the first pocket is fixedly attached to a rim of the first opening such that the first pocket is accessible through the first opening, and a second pocket fixedly attached to the first pocket wherein a second opening is formed on the first pocket such that the second pocket is accessible through the second opening. The first pocket is to carry items such as a cell phone, smart phone or mobile phone and the second pocket is generally to carry smaller items.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: February 2, 2016
    Inventor: Yong Chong Kim
  • Patent number: 9241515
    Abstract: A garment having a detachable backpack includes a first strap and a second strap; a first pouch and a second pouch wherein one end of the first strap is attached to the first pouch and one end of the second strap is attached to the second pouch; and a first backpack wherein the first backpack is constructed to be detachably attachable to the first and second pouches. The first and second pouches are constructed to be detachably attached a back of the garment. In addition, the first backpack and the first and second pouches are constructed such that the first backpack can be rolled up and received and contained in either the first or second pouch.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: January 26, 2016
    Inventor: Yong Chong Kim
  • Publication number: 20150374044
    Abstract: A garment having a detachable backpack includes a first strap and a second strap; a first pouch and a second pouch wherein one end of the first strap is attached to the first pouch and one end of the second strap is attached to the second pouch; and a first backpack wherein the first backpack is constructed to be detachably attachable to the first and second pouches. The first and second pouches are constructed to be detachably attached a back of the garment. In addition, the first backpack and the first and second pouches are constructed such that the first backpack can be rolled up and received and contained in either the first or second pouch.
    Type: Application
    Filed: September 5, 2014
    Publication date: December 31, 2015
    Inventor: Yong Chong KIM
  • Publication number: 20150374055
    Abstract: A garment having a detachable ornament includes a rectangular base; an ornament detachably attached to the rectangular base; and an attachment means to attach the rectangular base to the garment. Another garment having a detachable ornament includes a wire which is plastically deformable; a fabric which receives the wire along an outer edge of the fabric; and an attachment means to attach the fabric to the garment. Still another garment having a detachable ornament comprises a strip which is plastically deformable; a rectangular base which receives the strip therein; and an attachment means to attach the ornament to the garment.
    Type: Application
    Filed: September 5, 2014
    Publication date: December 31, 2015
    Inventor: Yong Chong KIM
  • Publication number: 20150325613
    Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
    Type: Application
    Filed: June 18, 2015
    Publication date: November 12, 2015
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Patent number: 9094593
    Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: July 28, 2015
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Publication number: 20150036046
    Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
    Type: Application
    Filed: July 24, 2014
    Publication date: February 5, 2015
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Publication number: 20150034975
    Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
    Type: Application
    Filed: July 24, 2014
    Publication date: February 5, 2015
    Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
  • Publication number: 20140011118
    Abstract: A carbon substrate for a gas diffusion layer that has a porosity gradient in a thickness direction thereof, a gas diffusion using the carbon substrate, an electrode and a membrane-electrode assembly for a fuel cell that include the gas diffusion layer, and a fuel cell including the membrane-electrode assembly having the gas diffusion layer are provided. The gas diffusion layer has improved water discharge ability and improved bending strength both in the machine direction and cross-machine direction.
    Type: Application
    Filed: July 1, 2013
    Publication date: January 9, 2014
    Applicants: JNTG Co., Ltd., JNTC Co., Ltd.
    Inventors: Eun Sook Lee, Do Hun Kim, Eun Chong Kim, Jy Young Jyoung, Jung Mi Gwak, Sang Jin Choi, Tae Nyun Kim, Jung Kyu Lee
  • Publication number: 20130346737
    Abstract: A method for remotely powering on a host, a system using the method, and an electronic apparatus using the method are provided. In the method, a control apparatus is employed to connect a server and detect whether the server receives a booting command from a remote apparatus. When it is detected that the server receives the booting command, an activation signal is transmitted to the host by the control apparatus, so as to power on the host.
    Type: Application
    Filed: April 23, 2013
    Publication date: December 26, 2013
    Applicant: ASROCK INC.
    Inventors: Hsin-Chung Yu, Chong-Kim Chan, Yu-Guang Chen
  • Patent number: 8566575
    Abstract: A computer apparatus and a method for charging a portable electronic device are provided. The method is implemented in a computer apparatus including a connector. The method includes: (a) detecting whether the portable electronic device is plugged and connected to the connector when the computer apparatus is in a power off state; (b) causing the computer apparatus to execute a boot process if the portable electronic device is plugged and connected to the connector; (c) determining whether the portable electronic device is a predetermined device; (d) sending a charging command to the portable electronic device such that the portable electronic device derives a charging current from the computer apparatus if the portable electronic device is the predetermined device; and (e) causing the computer apparatus to shut down before an operating system is loaded.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: October 22, 2013
    Assignee: Asrock Inc.
    Inventors: Chong-Kim Chan, Yu-Guang Chen
  • Publication number: 20130268744
    Abstract: A method for detecting hardware suitable for an electronic apparatus is provided. In the method, a booting signal is received. A graphical interface is started. The graphical interface includes a mainboard layout. And each connector is detected for obtaining peripheral hardware configured in the electronic apparatus. A figure corresponding to the peripheral hardware configured in the electronic apparatus and a location information of the peripheral hardware on a mainboard are obtained from a database. The figure is placed on a corresponding connector location of the mainboard layout.
    Type: Application
    Filed: March 13, 2013
    Publication date: October 10, 2013
    Applicant: ASROCK INC.
    Inventors: Chong-Kim Chan, Yu-Guang Chen
  • Publication number: 20130262848
    Abstract: An electronic apparatus and a booting method are provided. The electronic apparatus comprises a processing unit, a firmware unit and a memory. In the booting method, a boot code is read from the firmware unit by the processing unit for executing a booting initialization procedure. Whether a new version firmware code exists in a first block of the memory is determined by the boot code. If the new version firmware code exists in the first block, the new version firmware code is loaded into a second block of the memory by the boot code, and the new version firmware code is read from the second block so as to execute a booting procedure for loading an operating system.
    Type: Application
    Filed: February 7, 2013
    Publication date: October 3, 2013
    Applicant: ASROCK INC.
    Inventors: Chong-Kim Chan, Yu-Guang Chen
  • Publication number: 20120072711
    Abstract: A computer apparatus and a method for charging a portable electronic device are provided. The method is implemented in a computer apparatus including a connector. The method includes: (a) detecting whether the portable electronic device is plugged and connected to the connected when the computer apparatus is in a power off state; (b) causing the computer apparatus to execute a boot process if the portable electronic device is plugged and connected to the connector; (c) determining whether the portable electronic device is a predetermined device; (d) sending a charging command to the portable electronic device such that the portable electronic device derives a charging current from the computer apparatus if the portable electronic device is the predetermined device; and (e) causing the computer apparatus to shut down before an operating system is loaded.
    Type: Application
    Filed: September 16, 2011
    Publication date: March 22, 2012
    Applicant: ASROCK INC.
    Inventors: Chong-Kim Chan, Yu-Guang Chen
  • Publication number: 20110271606
    Abstract: A system and a method of preventing disaster by compensating displacement of a skyscraper in accordance with wind pressure are disclosed. The system for preventing disaster of a skyscraper includes a displacement sensing module configured to sense displacement of the skyscraper, and a displacement compensating apparatus configured to pull the skyscraper in the gravity direction in case that the sensed displacement is more than a reference value.
    Type: Application
    Filed: February 11, 2009
    Publication date: November 10, 2011
    Applicant: Golden Wheels Defense Fire Co., Ltd.
    Inventor: Eun-Chong Kim
  • Publication number: 20100100719
    Abstract: The invention provides a method for reducing booting time and a computer using the same. The method includes the following steps. The computer is shut down. After the step of shutting down the computer, the computer is booted up to make the computer enter into a power-saving mode. Thus, when a user performs an operation to boot up the computer, the computer resumes a normal state from the power-saving mode.
    Type: Application
    Filed: August 18, 2009
    Publication date: April 22, 2010
    Inventors: Yu-Guang CHEN, Chong-Kim Chan, Hsin-Chung Yu
  • Patent number: 7465354
    Abstract: A process, for patterning a thin film that is highly resistant to conventional etching processes and that is to be deposited at a high substrate temperature, is disclosed. The process uses a liftoff method wherein a refractory material has been substituted for the conventional organic resin. The method is particularly useful for the fabrication of tunable microwave devices and ferroelectric memory elements.
    Type: Grant
    Filed: March 8, 2005
    Date of Patent: December 16, 2008
    Assignee: National University of Singapore
    Inventors: Chong Kim Ong, Chin Yaw Tan
  • Publication number: 20070132087
    Abstract: Disclosed herein are a via hole having a fine hole land with which the density of circuit patterns can be increased and a method for forming the same. The method comprises: step 1 of forming a via hole in a copper clad laminate, coating an etching resist over the copper clad laminate, and forming a circuit pattern on the copper foil of the copper clad laminate; step 2 of forming a seed layer, coating a photoresist, and exposing an inner wall of the via hole; and step 3 of forming a plated layer on the inner wall of the via hole and removing the photoresist and the seed layer.
    Type: Application
    Filed: July 12, 2006
    Publication date: June 14, 2007
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chong Kim, Jong Choi, Young Shin
  • Publication number: 20060255339
    Abstract: The present invention relates to a single-crystalline gallium nitride substrate having an n-doping concentration of about 0.7×1018 to about 3×1018/cm3 and a thermal conductivity of at least about 1.5 W/cmK at a room temperature (300 K), and being appropriately applied in manufacturing of a light emitting device.
    Type: Application
    Filed: May 12, 2006
    Publication date: November 16, 2006
    Inventors: Changho Lee, Hae Lee, Hyun Shin, Chong Kim
  • Patent number: D551623
    Type: Grant
    Filed: July 12, 2005
    Date of Patent: September 25, 2007
    Assignee: Tyco Electronics AMP Korea Ltd.
    Inventors: Cheol-Seob Lee, Hang-Goo Cho, Yong-Mun Choi, Chun-Chong Kim