Abstract: An integrated inductor may be formed over a substrate. An aperture may be formed by a backside etch through the semiconductor substrate underneath the integrated inductor. The aperture may then be filled with a dielectric material. As a result of the removal of the underlying substrate material, magnetic and capacitive coupling of the inductor to the substrate may be reduced. In addition, in some cases, the presence of the dielectric may facilitate attachment of the resulting die to a leadframe and package without degrading the inductor's performance and may provide better structural support.

Abstract: In a system that demodulates a frequency modulated signal using a quadrature detector circuit, an apparatus that tunes the output signal to compensate for any offset in the signal includes an offset adjustment circuit and a control circuit. The offset adjustment circuit is operably coupled to the control circuit which may consist of a DAC and a digital logic such as a computer CPU. The control circuit determines a correction signal in response to a sequence of sampled of the system output, and supplies the correction signal to the offset adjustment circuit. The offset adjustment circuit provides an offset correction signal in response to the correction signal, and combines the offset correction signal with the output of the quadrature detector to provide an offset adjusted signal at an output node.

Abstract: An integrated inductor may be formed over a substrate. An aperture may be formed by a backside etch through the semiconductor substrate underneath the integrated inductor. The aperture may then be filled with a dielectric material. As a result of the removal of the underlying substrate material, magnetic and capacitive coupling of the inductor to the substrate may be reduced. In addition, in some cases, the presence of the dielectric may facilitate attachment of the resulting die to a leadframe and package without degrading the inductor's performance and may provide better structural support.

Abstract: An integrated inductor may be formed over a substrate. An aperture may be formed by a backside etch through the semiconductor substrate underneath the integrated inductor. The aperture may then be filled with a dielectric material. As a result of the removal of the underlying substrate material, magnetic and capacitive coupling of the inductor to the substrate may be reduced. In addition, in some cases, the presence of the dielectric may facilitate attachment of the resulting die to a leadframe and package without degrading the inductor's performance and may provide better structural support.

Abstract: An integrated inductor may be formed over a substrate. An aperture may be formed by a backside etch through the semiconductor substrate underneath the integrated inductor. The aperture may then be filled with a dielectric material. As a result of the removal of the underlying substrate material, magnetic and capacitive coupling of the inductor to the substrate may be reduced. In addition, in some cases, the presence of the dielectric may facilitate attachment of the resulting die to a leadframe and package without degrading the inductor's performance and may provide better structural support.

Abstract: Component mounting pads for multi-layer printed circuit boards encompass a smaller area than conventional pads, reducing parasitic capacitance between the pads and a ground plane layer. A number of such pads are arranged to accommodate standard surface-mount component sizes and packages. Further capacitance reductions are achieved by implementing mesh areas or apertures in the board's ground plane opposite the reduced-capacitance pads.