Patents by Inventor Chong Zhang

Chong Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10811549
    Abstract: A quantum-dot based avalanche photodiode (QD-APD) may include a silicon substrate and a waveguide on which a quantum dot (QD) stack of layers is formed having a QD light absorption layer, a charge multiplication layer (CML), and spacer layers. The QD stack may be formed within a p-n junction. The waveguide may include a mode converter to facilitate optical coupling and light transfer from the waveguide to the QD light absorption layer. The QD absorption layer and the CML layer may be combined or separate layers. The CML may generate electrical current from the absorbed light with more than 100% quantum efficiency when the p-n junction is reverse-biased.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: October 20, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Geza Kurczveil, Di Liang, Bassem Tossoun, Chong Zhang, Xiaoge Zeng, Zhihong Huang, Raymond Beausoleil
  • Patent number: 10812849
    Abstract: The present disclosure provides method, apparatus, and storage medium for media file delivery. The method includes: obtaining a target resource consumption and an actual resource consumption of a first media file, one time of delivery of the first media file corresponding to one time of resource consumption; comparing the target resource consumption with the actual resource consumption, to obtain a first comparison result; adjusting, according to the first comparison result, a value of a resource contention parameter of the first media file from a first value to a second value, the resource contention parameter being used for determining a delivery order of the first media file when the first media file participates in a delivery contention; and performing a first delivery operation on the first media file according to the resource contention parameter whose value is the second value.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: October 20, 2020
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Xiwang Yang, Xu He, Gong Chen, Chong Peng, Shi Huang, Bifeng Zhang
  • Patent number: 10804188
    Abstract: An electronic device may include a substrate, and the substrate may include one or more layers. The one or more layers may include a first dielectric material and one or more electrical traces. A cavity may be defined in the substrate, and the cavity may be adapted to receive one or more electrical components. One or more lateral traces may extend through a wall of the cavity. The lateral traces may provide electrical communication pathways between the substrate and the electrical components.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: October 13, 2020
    Assignee: Intel Corporation
    Inventors: Yikang Deng, Ying Wang, Cheng Xu, Chong Zhang, Junnan Zhao
  • Publication number: 20200321539
    Abstract: An objective of the disclosure is to provide an organic light-emitting composite material based on an exciplex, which, when used as a light-emitting layer, can enhance the efficiency of an organic electroluminescent device. The disclosure also relates to an organic light-emitting device comprising the organic light-emitting composite material, and use of the organic light-emitting composite material of the disclosure for an organic electron device.
    Type: Application
    Filed: June 21, 2020
    Publication date: October 8, 2020
    Inventors: XINDONG ZHAO, ZHAOCHAO ZHANG, CHONG LI, LICHUN WANG
  • Patent number: 10793549
    Abstract: The present invention relates to a sulfuryl-substituted benzoheterocyclic derivative, a preparation method and medical use thereof. Particularly, disclosed is a compound of formula (I) or a pharmaceutically acceptable salt, stereoisomer, solvate, or prodrug thereof, and a preparation method and application thereof. The definition of each group in the formula can be found in the specification and the claims.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: October 6, 2020
    Assignees: SHANGHAI HAIYAN PHARMACEUTICAL TECHNOLOGY CO., LTD., YANGTZE RIVER PHARMACEUTICAL GROUP CO., LTD.
    Inventors: Yunzhou Jin, Xiang Chen, Pengfei Cheng, Ping Bu, Leitao Zhang, Chong Wen, Yingtao Liu, Fusheng Zhou, Ming Weng, Jiong Lan
  • Publication number: 20200312771
    Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.
    Type: Application
    Filed: March 27, 2019
    Publication date: October 1, 2020
    Inventors: Bai NIE, Gang DUAN, Srinivas PIETAMBARAM, Jesse JONES, Yosuke KANAOKA, Hongxia FENG, Dingying XU, Rahul MANEPALLI, Sameer PAITAL, Kristof DARMAWIKARTA, Yonggang LI, Meizi JIAO, Chong ZHANG, Matthew TINGEY, Jung Kyu HAN, Haobo CHEN
  • Publication number: 20200310929
    Abstract: Methods and apparatus for detecting that a processing node, in a network including a plurality of processing nodes, is reporting invalid results and for taking corrective actions in response to the detection are described.
    Type: Application
    Filed: March 29, 2019
    Publication date: October 1, 2020
    Inventors: Chong Li, Sichao Yang, Lei Zhang
  • Publication number: 20200312738
    Abstract: An integrated circuit assembly may be formed having at least one integrated circuit device electrically attached to an electronic substrate. The integrated circuit assembly may further include at least one heat dissipation device attached to the electronic substrate, wherein the at least one heat dissipation device comprises a phase change material within a containment chamber. The at least one integrated circuit device may be thermally connected to the at least one heat dissipation device with at least one heat transfer structure formed in or on the electronic substrate.
    Type: Application
    Filed: March 26, 2019
    Publication date: October 1, 2020
    Applicant: Intel Corporation
    Inventors: Junnan Zhao, Cheng Xu, Zhimin Wan, Yikang Deng, Chong Zhang, Ying Wang
  • Patent number: 10790159
    Abstract: The systems and methods described herein provide for the fabrication of semiconductor package substrates having magnetic inductors formed in at least a portion of the through-holes formed in the semiconductor package substrate. Such magnetic inductors are formed without exposing the magnetic material disposed in the through-hole to any wet chemistry (desmear, electro-less plating, etc.) processes by sealing the magnetic material with a patterned sealant (e.g., patterned dry film resist) which seals the magnetic material prior to performing steps involving wet chemistry on the semiconductor package substrate. Such beneficially minimizes or even eliminates the contamination of wet chemistry reagents by the magnetic material should the magnetic material remain exposed during the wet chemistry processes. The patterned sealant is removed subsequent to the semiconductor package processing steps involving wet chemistry.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: September 29, 2020
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Chong Zhang, Yikang Deng, Junnan Zhao, Ying Wang
  • Patent number: 10784296
    Abstract: The present disclosure relates to the technical field of semiconductors, and discloses an image sensor and a manufacturing method therefor. The image sensor includes: a semiconductor substrate; a first active region located on the semiconductor substrate; a doped semiconductor layer located on the first active region; and a contact located on the semiconductor layer, where the first active region includes: a first doped region and a second doped region abutting against the first doped region, wherein the second doped region is located at an upper surface of the first active region, and wherein the second doped region is formed by dopants in the semiconductor layer that are annealed to be diffused to a surface layer of the first doped region. The present disclosure may reduce leakage current and improve device performances.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: September 22, 2020
    Assignees: Semiconductor Manufacturing (Shanghai) International Corporation, Semiconductor Manufacturing (Beijing) International Corporation
    Inventors: Tzu Yin Chiu, Chong Wang, Haifang Zhang, Xuanjie Liu
  • Patent number: 10777514
    Abstract: Techniques are provided for an inductor at a second level interface between a first substrate and a second substrate. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first substrate, second conductive traces of a second non-semiconductor substrate, and a plurality of connectors configured to connect the first substrate with the second substrate. Each connector of the plurality of connectors can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: September 15, 2020
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji Yong Park, Srinivas Pietambaram, Ying Wang, Chong Zhang, Rui Zhang, Junnan Zhao
  • Publication number: 20200273776
    Abstract: An integrated circuit package may be formed having a heat transfer fluid chamber, wherein the heat transfer fluid chamber may be positioned to allow a heat transfer fluid to directly contact an integrated circuit device within the integrated circuit package. In one embodiment, a first surface of the integrated circuit device may be electrically attached to a first substrate. The first substrate may then may be electrically attached to a second substrate, such that the integrated circuit device is between the first substrate and the second substrate. The second substrate may include a cavity, wherein the heat transfer fluid chamber may be formed between a second surface of the integrated circuit device and the cavity of the second substrate. Thus, at least a portion of a second surface of the integrated circuit device is exposed to the heat transfer fluid which flows into the heat transfer fluid chamber.
    Type: Application
    Filed: February 27, 2019
    Publication date: August 27, 2020
    Applicant: Intel Corporation
    Inventors: Cheng Xu, Junnan Zhao, Zhimin Wan, Ying Wang, Yikang Deng, Chong Zhang, Jiwei Sun, Zhenguo Jiang, Kyu-Oh Lee
  • Patent number: 10751810
    Abstract: A vertical-edge double-step sawtooth cutter for preparing high-quality holes of composite material and thereof hybrid stack structure, and has three parts which are a major cutting edge region A, a minor cutting edge region B and a shank region C. The minor cutting edge region B comprises a step vertical-edge region D and a sawtooth cutting region E. This has the step structure and the sawtooth structure which is distributed in the first step, has a recutting function at the inlet and a reverse cutting function at the outlet in the direction opposite to the main cutting motion. The cutter has the vertical edge structure distributed in the second step, and the angle of the second step is a negative value, thereby realizing chip breaking and crushing, reducing scratch to the upper-layer composite material and metal hole walls.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: August 25, 2020
    Assignee: DALIAN UNIVERSITY OF TECHNOLOGY
    Inventors: Fuji Wang, Zhenyuan Jia, Meng Zhao, Yu Bai, De Cheng, Chong Zhang
  • Publication number: 20200255856
    Abstract: The present invention relates to materials and methods for creating and maintaining a cereal plant line for the production of a hybrid cereal plant, that include for example, and not limitation, using the BLue Aleurone (BLA) system.
    Type: Application
    Filed: August 29, 2018
    Publication date: August 13, 2020
    Applicants: KWS SAAT SE & Co. KGaA, THE UNIVERSITY OF SYDNEY, GLOBAL CROP INNOVATIONS PTY. LTD.
    Inventors: Norman DARVEY, Peng ZHANG, Richard TRETHOWAN, Chong Mei DONG, Jacob LAGE, Nicholas BIRD, Christopher TAPSELL, Aaron HUMMEL
  • Patent number: 10730854
    Abstract: Provided are compounds useful for treating of cancer and methods for treating of cancer, comprising administering to a subject in need thereof a compound described therein.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: August 4, 2020
    Assignee: Agios Pharmaceuticals, Inc.
    Inventors: Samuel V. Agresta, Chong-Hui Gu, David Schenkein, Hua Yang, Liting Guo, Zhen Tang, Jianming Wang, Yanfeng Zhang, Yan Zhou
  • Publication number: 20200243701
    Abstract: A quantum-dot based avalanche photodiode (QD-APD) may include a silicon substrate and a waveguide on which a quantum dot (QD) stack of layers is formed having a QD light absorption layer, a charge multiplication layer (CML), and spacer layers. The QD stack may be formed within a p-n junction. The waveguide may include a mode converter to facilitate optical coupling and light transfer from the waveguide to the QD light absorption layer. The QD absorption layer and the CML layer may be combined or separate layers. The CML may generate electrical current from the absorbed light with more than 100% quantum efficiency when the p-n junction is reverse-biased.
    Type: Application
    Filed: January 29, 2019
    Publication date: July 30, 2020
    Inventors: Geza Kurczveil, Di Liang, Bassem Tossoun, Chong Zhang, Xiaoge Zeng, Zhihong Huang, Raymond Beausoleil
  • Publication number: 20200234244
    Abstract: Disclosed are systems, methods, and non-transitory computer-readable media for providing profiles with limited permission level functionality in the network. In response to receiving a request to post the new employment listing, a collaboration system updates a permission list of the employment listing to provide a first user account with an administrator permission level in relation to the employment listing. The administrator permission level provides a first function and a second function in relation to the employment listing. The collaboration system receives a request to tag a second user account to the employment listing and updates the permission list to provide the second user account with a limited permission level in relation to the employment listing. The limited permission level provides the second user account with permission to perform the first function in relation to the employment listing but does not provide permission to perform the second function.
    Type: Application
    Filed: January 23, 2019
    Publication date: July 23, 2020
    Inventors: Li Zhou, Chong Zhang, Andrew Walter Chimka, Kevin Chuang, Kumaresh Pattabiraman, Yixiao Lu, Chen Qian, George Pearman
  • Publication number: 20200231479
    Abstract: A method for achieving rapid startup of a denitrification biofilter tank, which belongs to the technical field of biofilm sewage treatment. The specific steps are: 1. selecting heterotrophic denitrification or mixotrophic denitrification to treat influent sewage; 2. when the heterotrophic denitrification is used, pretreating the filter material with sodium carboxymethyl cellulose solution and then adding rhamnolipid after the introduction of sewage until the biofilter tank system starts successfully; 3. when the mixotrophic denitrification method is used, the filter tank is inoculated after the introduction of sewage, and the rhamnolipid is added thereto and is changed to sulfur source after operation for a while until startup is complete. The invention solves the problem that the denitrification biofilter tank in the sewage treatment is particularly slow in the mixotrophic state, and has a good application prospect.
    Type: Application
    Filed: March 14, 2019
    Publication date: July 23, 2020
    Inventors: Hui HUANG, Chong PENG, XuXiang ZHANG, HongQiang REN
  • Patent number: 10712759
    Abstract: Power supply rejection (PSR) peaking in Low Dropout (LDO) voltage regulators can lead to reduced bandwidth and efficiency. The present invention is directed to a new design method by combining power transmission lines (PTL) with LDOs for enhancing its bandwidth and efficiency. This approach is applicable for LDOs regulating high speed I/O drivers. The PTL combined with decoupling capacitors on the package or board are used to mitigate the PSR peaking. This methodology is demonstrated using printed circuit board test vehicles with off-the-shelf components. When compared to conventional approaches, the PTL solution showed ˜80% lower power supply noise.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: July 14, 2020
    Assignee: GEORGIA TECH RESEARCH CORPORATION
    Inventors: David Chong Zhang, Arijit Raychowdhury, Madhavan Swaminathan
  • Publication number: 20200219517
    Abstract: A method includes receiving an utterance of speech and segmenting the utterance of speech into a plurality of segments. For each segment of the utterance of speech, the method also includes extracting a speaker=discriminative embedding from the segment and predicting a probability distribution over possible speakers for the segment using a probabilistic generative model configured to receive the extracted speaker-discriminative embedding as a feature input. The probabilistic generative model trained on a corpus of training speech utterances each segmented into a plurality of training segments. Each training segment including a corresponding speaker-discriminative embedding and a corresponding speaker label. The method also includes assigning a speaker label to each segment of the utterance of speech based on the probability distribution over possible speakers for the corresponding segment.
    Type: Application
    Filed: January 8, 2019
    Publication date: July 9, 2020
    Applicant: Google LLC
    Inventors: Chong Wang, Aonan Zhang, Quan Wang, Zhenyao Zhu