Patents by Inventor Choon Chung

Choon Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9365935
    Abstract: The present invention provides an etching solution for silver or silver alloy comprising one at least ammonium compound represented by the formula (1), (2) or (3) below and an oxidant: wherein each of the variables is as defined herein.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: June 14, 2016
    Assignee: Inktec Co., Ltd.
    Inventors: Kwang Choon Chung, Hyun-Nam Cho, Young-Kwan Seo
  • Publication number: 20160132141
    Abstract: Provided herein is a method for producing a hybrid transparent electrode, the method including filling grooves of a substrate with a conductive metal ink composition; filling the grooves with residue conductive metal ink composition that remains on a surface of the substrate as the grooves are being filled with the conductive metal ink composition to form an electrode pattern; and forming a conductive layer including a conductive material on the electrode pattern.
    Type: Application
    Filed: May 16, 2014
    Publication date: May 12, 2016
    Inventors: Kwang-Choon CHUNG, In-Sook YI, Ji Hoon YOO, Joonki SEONG, Dae sang HAN
  • Patent number: 9313900
    Abstract: Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: April 12, 2016
    Assignees: Inktec Co., Ltd., Haeun Chemtec Co., Ltd.
    Inventors: Kwang Choon Chung, Young-Koo Han, Myung-Bong Yoo, Nam-Boo Cho, Young-Ho Han, Kyong-Min Lee, Kwang-Baek Yoon, Hee-Yong Ahn, Su-Han Kim
  • Patent number: 9299483
    Abstract: Provided are a method for manufacturing a transparent conductive film and a transparent conductive film manufactured thereby, the method including: a) forming a coating film by coating a transparent conductive film coating solution on a substrate, the transparent conductive film coating solution including a non-polar solvent; a polar solvent; a conductive metal ink; and a surfactant; and b) forming a conductive pattern having a hole type transmissive part and a pattern part formed of the conductive metal ink, on the substrate, by drying and burning the coating film.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: March 29, 2016
    Assignee: Inktec Co., Ltd.
    Inventors: Kwang Choon Chung, Hyun Nam Cho, Ji Hoon Yoo, Yun-Ho Jung
  • Patent number: 9290844
    Abstract: Provided is a method for manufacturing a metal film, including: coating or printing a metal ink containing an organic metal complex on a substrate; and necessarily parallel-performing a pressure process during a procedure of forming metal particles by firing the metal ink, thereby forming a conductive metal film. The present invention can provide a method for manufacturing a metal film capable of improving film characteristics such as conductivity, reflectance, and uniformity in thickness, and the like, as well as remarkably shortening the time for forming the metal film, thereby efficiently manufacturing a superior-quality metal film.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: March 22, 2016
    Assignee: Inktec Co., Ltd.
    Inventors: Kwang Choon Chung, Hyun Nam Cho, Ji Hoon Yoo, Jae Ho Beak, Yoo Seong Kim
  • Patent number: 9269478
    Abstract: Provided are a method for preparing a transparent conductive layer and a transparent conductive layer prepared by the method. The method for preparing a transparent conductive layer includes: 1) forming a cellulose derivative film by coating a transparent substrate with a cellulose derivative coating liquid; 2) hydrolyzing the cellulose derivatives by treating the cellulose derivative film using an alkaline agent; 3) forming a metal film by coating the hydrolyzed cellulose derivative film with an organic metal ink and reducing metals on the cellulose derivative; and 4) forming a conductive metal layer by heat-treating the cellulose derivative film with the metal film formed, and a transparent conductive layer prepared by the method. According to the present invention, a process can be simplified, and also a transparent conductive layer having excellent conductivity, transmittance, bending resistance, and low haze can be prepared.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: February 23, 2016
    Assignee: INKTEC CO., LTD.
    Inventors: Kwang Choon Chung, Hyun Nam Cho, Ji Hoon Yoo, Yun Ho Jung, Su Phil Kim
  • Patent number: 9230707
    Abstract: Provided is a production method for a transparent conductive film wherein: a substrate has formed thereon a transparent conductive oxide, a conductive metal body, and a conductive polymer comprised in a transparent composite conductive layer; or else a substrate has formed thereon a transparent conductive oxide layer; a conductive metal body layer, and a conductive polymer layer comprised in a transparent composite conductive layer; or a substrate has formed thereon a transparent conductive oxide layer, and also a conductive metal body and a conductive polymer comprised in an organic-inorganic hybrid layer in a transparent composite conductive layer. Also provided is a transparent conductive film produced by means of the method.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: January 5, 2016
    Assignee: Inktec Co., Ltd.
    Inventors: Kwang Choon Chung, Hyun-Nam Cho, Ji Hoon Yoo, Yun-Ho Jung
  • Patent number: 9167735
    Abstract: Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: October 20, 2015
    Assignee: Inktec Co., Ltd.
    Inventors: Kwang Choon Chung, Hyun Nam Cho, Myung Bong Yoo, Nam-Boo Cho, Seok Pil Jin, Seong Hoon No
  • Patent number: 9107317
    Abstract: The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.
    Type: Grant
    Filed: December 10, 2008
    Date of Patent: August 11, 2015
    Assignee: Inktec Co., Ltd.
    Inventors: Kwang Choon Chung, Ji Hoon Yoo, Byung Hun Kim, Su Han Kim
  • Patent number: 9096737
    Abstract: The present invention relates to synthetic resin composition containing nano silver particles, in which a silver complex having a specific structure that allows formation of the nano silver particles is dissolved in monomer for the resin composition and the organic silver complex is decomposed with polymerization to prepare the synthetic resin composition containing the nano silver particles. The present invention can provide a method for resin compositions, which has simple and economic preparation process and allows uniform dispersion of the nano silver particles in the resin composition.
    Type: Grant
    Filed: September 20, 2013
    Date of Patent: August 4, 2015
    Assignee: Inktec Co., Ltd.
    Inventors: Myoung Seon Gong, Kwang Choon Chung, Hyun Nam Cho
  • Patent number: 9090785
    Abstract: The present invention relates to a silver ink composition comprising: silver complexes obtained by reacting one or more silver compounds selected from chemical formula 1 with one or more ammonium carbamate-based compounds or ammonium carbonate-based compounds selected from chemical formula 2 to chemical formula 4; and oxime-based compounds.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: July 28, 2015
    Assignee: INKTEC CO., LTD.
    Inventors: Kwang-Choon Chung, Hyun Nam Cho, Ji Hoon Yoo, Dae Sang Han
  • Patent number: 8979972
    Abstract: Disclosed herein is a method of manufacturing a metal flake, including the steps of: applying metal ink containing an organic metal compound onto a substrate; calcining the metal ink applied on the substrate to form a thin metal film; separating the formed thin metal film from the substrate; and pulverizing the separated thin metal film. The method of manufacturing a metal flake is characterized in that the thickness and size of metal flakes can be easily adjusted, metal flakes having excellent conductivity and gloss can be obtained, and metal flakes can be mass-produced using environmentally friendly and economical methods.
    Type: Grant
    Filed: August 24, 2009
    Date of Patent: March 17, 2015
    Assignee: Inktec Co., Ltd.
    Inventors: Kwang Choon Chung, Hyun Nam Cho, Dong Rip Kim, Ji Hoon Yoo
  • Publication number: 20150068787
    Abstract: Provided herein is a conductive pattern making method and conductive pattern, the method including forming a groove such that its width in an inlet area is bigger than its width in an inner area; filling the groove with a conductive ink composition; and drying the conductive ink composition so that a solvent contained in the conductive ink composition inside the groove is volatilized to reduce the volume of the conductive ink composition.
    Type: Application
    Filed: September 8, 2014
    Publication date: March 12, 2015
    Inventors: Kwang-Choon Chung, Ji Hoon Yoo, Joonki Seong, Dae Sang Han, Nam-Boo Cho
  • Patent number: 8944586
    Abstract: An ink jet printer bed in which a printing object placed on a bed is stably fixed by means of air suction and is printed, is disclosed, which comprises a plurality of upper plates having a plurality of air suction ports on their front surfaces; an intermediate plate which is formed of a guide space of which intermediate portion is open via its upper lower sides, the intermediate plate being assembled to a lower side of the upper plate; a lower plate which is assembled to a lower side of the intermediate portion and is formed of at least one air passage; a connection part which is assembled to each air passage of the lower plate and is connected with a suction pump; and a sensor which detects an air pressure in the interior of the bed and transmits a result of the detection to a controller which controls the operation of the suction pump, so the air pressure of the interior of the bed by the suction pump can be adjusted.
    Type: Grant
    Filed: October 9, 2009
    Date of Patent: February 3, 2015
    Assignee: Inktec Co., Ltd.
    Inventors: Kwang Choon Chung, Hae Sung Jung, Ki Yong Kim, Kyung Soo Kim, Sung Chul Jeon, Chung Il Kim
  • Publication number: 20150000125
    Abstract: Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.
    Type: Application
    Filed: January 4, 2013
    Publication date: January 1, 2015
    Inventors: Kwang-Choon Chung, Young-Koo Han, Myung-Bong Yoo, Kwang-Baek Yoon, Bong-Ki Jung
  • Publication number: 20140377455
    Abstract: The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.
    Type: Application
    Filed: September 9, 2014
    Publication date: December 25, 2014
    Inventors: Kwang Choon Chung, Ji Hoon Yoo, Su-Han Kim, Byung Hun Kim
  • Publication number: 20140338192
    Abstract: Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom.
    Type: Application
    Filed: December 24, 2012
    Publication date: November 20, 2014
    Inventors: Kwang-Choon Chung, Nam Boo Cho, Young-Koo Han, Myung Bong Yoo, Woong Ku On
  • Patent number: 8866128
    Abstract: The present invention relates to a method capable of considerably improving the characteristics of an organic electroluminescent device. The present invention provides a method capable of reducing operating voltage and improving efficiency by inserting an inorganic oxide interlayer configured of at least one layer between light-emitting layers.
    Type: Grant
    Filed: August 13, 2007
    Date of Patent: October 21, 2014
    Assignee: Inktec Co., Ltd.
    Inventors: Hyun-Nam Cho, Ji-Hoon Yoo, Kwang-Choon Chung
  • Publication number: 20140263185
    Abstract: The present invention provides an etching solution for silver or silver alloy comprising one at least ammonium compound represented by the formula (1), (2) or (3) below and an oxidant:
    Type: Application
    Filed: June 2, 2014
    Publication date: September 18, 2014
    Applicant: Inktec Co., Ltd.
    Inventors: Kwang Choon Chung, Hyun-Nam Cho, Young-Kwan Seo
  • Patent number: 8828352
    Abstract: A process for preparation of silver oxide with various shape and size using a silver complex compound having a special structure, includes 1) step of preparing a precursor solution including a silver complex compound obtained by reacting a silver compound with one or more mixture selected from the group consisting of an ammonium carbamate-based compound, an ammonium carbonate-based compound or an ammonium bicarbonate-based compound in the presence of a solvent; and 2) step of preparing silver oxide by reacting the precursor solution including the silver complex compound of step 1) with an oxidant. The shape and particle size of the silver oxide prepared according to the preparation process can be changed.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: September 9, 2014
    Assignee: Inktec Co., Ltd.
    Inventors: Kwang Choon Chung, Hyun Nam Cho, Ji Hoon Yoo, Kee In Son