Abstract: A method may include receiving a reconfiguration to a first Virtual Local Area Network (VLAN)/spanning tree table, where the first VLAN/spanning tree table has a first identifier and is associated with a region of a network; updating the first VLAN/spanning tree table to generate a second VLAN/spanning tree table based on the reconfiguration; determining a second identifier of the second VLAN/spanning tree table; and generating a list of identifiers associated with the region of the network, the list including the first identifier and the second identifier.

Abstract: A method may include receiving a reconfiguration to a first Virtual Local Area Network (VLAN)/spanning tree table, where the first VLAN/spanning tree table has a first identifier and is associated with a region of a network; updating the first VLAN/spanning tree table to generate a second VLAN/spanning tree table based on the reconfiguration; determining a second identifier of the second VLAN/spanning tree table; and generating a list of identifiers associated with the region of the network, the list including the first identifier and the second identifier.

Abstract: A method may include receiving a reconfiguration to a first Virtual Local Area Network (VLAN)/spanning tree table, where the first VLAN/spanning tree table has a first identifier and is associated with a region of a network; updating the first VLAN/spanning tree table to generate a second VLAN/spanning tree table based on the reconfiguration; determining a second identifier of the second VLAN/spanning tree table; and generating a list of identifiers associated with the region of the network, the list including the first identifier and the second identifier.

Abstract: A digital broadcast system and a method of processing data disclose. A receiving system of the digital broadcast system may include a baseband processor, a management processor, and a presentation processor. The baseband processor receives broadcast signals including mobile service data and main service data. The mobile service data configures a RS frame, and the RS frame includes the mobile service data and at least one type of channel setting information on the mobile service data. The management processor decodes the RS frame to acquire the mobile service data and the at least one type of channel setting information on the mobile service data, then extracts position information of an SDP message. Herein, the SDP message includes Codec information for each component in the respective virtual channel from the channel setting information, thereby accessing the SDP message from the extracted position information and gathers SDP message information.

Abstract: A digital broadcast system and a method of processing data disclose. A receiving system of the digital broadcast system may include a baseband processor, a management processor, and a presentation processor. The baseband processor receives broadcast signals including mobile service data and main service data. The mobile service data configures a RS frame, and the RS frame includes the mobile service data and at least one type of channel setting information on the mobile service data. The management processor decodes the RS frame to acquire the mobile service data and the at least one type of channel setting information on the mobile service data, then extracts position information of an SDP message. Herein, the SDP message includes Codec information for each component in the respective virtual channel from the channel setting information, thereby accessing the SDP message from the extracted position information and gathers SDP message information.

Abstract: A digital broadcast system and a method of processing data disclose. A receiving system of the digital broadcast system may include a baseband processor, a management processor, and a presentation processor. The baseband processor receives broadcast signals including mobile service data and main service data. The mobile service data configures a RS frame, and the RS frame includes the mobile service data and at least one type of channel setting information on the mobile service data. The management processor decodes the RS frame to acquire the mobile service data and the at least one type of channel setting information on the mobile service data, then extracts position information of an SDP message. Herein, the SDP message includes Codec information for each component in the respective virtual channel from the channel setting information, thereby accessing the SDP message from the extracted position information and gathers SDP message information.

Abstract: A method may include receiving a reconfiguration to a first Virtual Local Area Network (VLAN)/spanning tree table, where the first VLAN/spanning tree table has a first identifier and is associated with a region of a network; updating the first VLAN/spanning tree table to generate a second VLAN/spanning tree table based on the reconfiguration; determining a second identifier of the second VLAN/spanning tree table; and generating a list of identifiers associated with the region of the network, the list including the first identifier and the second identifier.

Abstract: A method may include receiving a reconfiguration to a first Virtual Local Area Network (VLAN)/spanning tree table, where the first VLAN/spanning tree table has a first identifier and is associated with a region of a network; updating the first VLAN/spanning tree table to generate a second VLAN/spanning tree table based on the reconfiguration; determining a second identifier of the second VLAN/spanning tree table; and generating a list of identifiers associated with the region of the network, the list including the first identifier and the second identifier.

Abstract: A digital broadcast system and a method of processing data disclose. A receiving system of the digital broadcast system may include a baseband processor, a management processor, and a presentation processor. The baseband processor receives broadcast signals including mobile service data and main service data. The mobile service data configures a RS frame, and the RS frame includes the mobile service data and at least one type of channel setting information on the mobile service data. The management processor decodes the RS frame to acquire the mobile service data and the at least one type of channel setting information on the mobile service data, then extracts position information of an SDP message. Herein, the SDP message includes Codec information for each component in the respective virtual channel from the channel setting information, thereby accessing the SDP message from the extracted position information and gathers SDP message information.

Abstract: Substrates for mounting microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices are disclosed herein. A method of manufacturing a substrate in accordance with one embodiment of the invention includes forming a conductive trace on a first side of a sheet of non-conductive material, and forming a via through the non-conductive material from a second side of the sheet to the conductive trace. The method further includes removing a section of the non-conductive material to form an edge of the non-conductive material extending across at least a portion of the via. In one embodiment, forming the edge across the via exposes at least a portion of the second conductive trace for subsequent attachment to a terminal on a microelectronic die.

Abstract: This invention relates generally to olefin metathesis, and more particularly relates to the ring-opening, ring insertion cross-metathesis of cyclic olefins with internal olefins such as seed oils and the like. In one embodiment, a method is provided for carrying out a catalytic ring-opening cross-metathesis reaction, comprising contacting at least one olefinic substrate with at least one cyclic olefin as a cross metathesis partner, in the presence of a ruthenium alkylidene olefin metathesis catalyst under conditions effective to allow ring insertion cross metathesis whereby the cyclic olefin is simultaneously opened and inserted into the olefinic substrate. The invention has utility in the fields of catalysis, organic synthesis, and industrial chemistry.

Abstract: A memory card including a printed circuit board having an electronic circuit device mounted thereto and at least one I/O pad disposed thereon. The printed circuit board and the electronic circuit device are at least partially encapsulated or covered by an encapsulant material which hardens into a body of the memory card, such body generally defining the outer appearance of the memory card. The I/O pads of the printed circuit board are exposed in the body. The body is formed to include one or more chamfers. Such chamfer(s) are sized and configured to minimize potential damage to the connection terminals or host socket of a device during the process of interfacing the memory card thereto.

Abstract: Stacked microelectronic devices and methods for manufacturing such devices are disclosed herein. In one embodiment, a stacked microelectronic device assembly can include a first known good packaged microelectronic device including a first interposer substrate. A first die and a first through-casing interconnects are electrically coupled to the first interposer substrate. A first casing at least partially encapsulates the first device such that a portion of each first interconnect is accessible at a top portion of the first casing. A second known good packaged microelectronic device is coupled to the first device in a stacked configuration. The second device can include a second interposer substrate having a plurality of second interposer pads and a second die electrically coupled to the second interposer substrate. The exposed portions of the first interconnects are electrically coupled to corresponding second interposer pads.

Abstract: Methods of fabrication of lead frame-based semiconductor device packages including at least one land grid array package. At least one semiconductor die is mounted to an interposer substrate, with bond pads of the semiconductor die connected to terminal pads of the interposer substrate. The terminal pads of the interposer substrate may be electrically connected to both a peripheral array pattern of lands and to a central, two-dimensional array pattern of pads, both array patterns located on the opposing side of the interposer substrate from the at least one semiconductor die. The assembly is overmolded with an encapsulant, leaving the opposing side of the interposer substrate free of encapsulant. Lead fingers of a lead frame superimposed on the opposing side of the interposer substrate are bonded directly to the land grid array lands.

Abstract: Methods for packaging microelectronic devices and microelectronic devices formed using such methods are disclosed herein. One aspect of the invention is directed toward a method for packaging a microelectronic device that includes coupling an active side of a microelectronic die to a surface of a support member. The microelectronic die can have a backside opposite the active side, a peripheral side extending at least part way between the active side and the backside, and at least one through-wafer interconnect. The method can further include applying an encapsulant to cover a portion of the surface of the support member so that a portion of the encapsulant is laterally adjacent to the peripheral side, removing material from a backside of the microelectronic die to expose a portion of at least one through-wafer interconnect, and applying a redistribution structure to the backside of the microelectronic die.

Abstract: A stack-type semiconductor package includes a first semiconductor package upon which a second semiconductor package is stacked. A layer of a hardened, insulative material, e.g., a no-flow underfill (NUF) material, is disposed between, and mechanically couples the stacked first and second semiconductor packages. The NUF layer covers portions of the first semiconductor package, e.g., the semiconductor die and the substrate of the first semiconductor package, and solder balls of the second semiconductor package that are fused to the substrate of the first semiconductor package. The NUF material is applied onto the semiconductor die and substrate of the first semiconductor package before the second semiconductor package is stacked on the first semiconductor package, and substantially cures after the solder balls of the second semiconductor package are fused to the substrate of the first semiconductor package.

Abstract: A mobile communication terminal and method of displaying an icon using the same are displayed, by which icons can be displayed on screens of calling and called parties, respectively in the course of video communications. The present invention includes entering an icon input mode in performing the video communications with at least one terminal using the mobile communication terminal, receiving a signal for selecting an icon and a position of the icon, and transmitting image control signal including the selected icon and position information of the selected icon.

Abstract: Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.

Abstract: Substrates for mounting microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices are disclosed herein. A method of manufacturing a substrate in accordance with one embodiment of the invention includes forming a conductive trace on a first side of a sheet of non-conductive material, and forming a via through the non-conductive material from a second side of the sheet to the conductive trace. The method further includes removing a section of the non-conductive material to form an edge of the non-conductive material extending across at least a portion of the via. In one embodiment, forming the edge across the via exposes at least a portion of the second conductive trace for subsequent attachment to a terminal on a microelectronic die.

Abstract: A Virtual Communication Environment to support virtual switching engines for layer 2 switches is described. The virtual layer 2 switching engines allow many virtual switches to be created in a CPU or across multiple CPUs in switching hardware. The virtual switch engines reduce the inter-communication costs in memory, CPU, inter-process bandwidth, and fabric bandwidth. This reduction in the cost per Virtual Switch device allows either more virtual switches to be contained within a control plane or more applications per switch control plane.