Patents by Inventor Choon Lee

Choon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220079238
    Abstract: Provided is a heater for a ciga-like electronic cigarette with a heat transfer efficiency improved by strengthening a bonding force between a cigarette support portion and a heater portion by thermally pressing and bonding the cigarette support portion and the heater portion together using a heat-dissipating adhesive layer with a heat-dissipating filler added to a high-heat-resistant thermoplastic polyimide resin, and a method of manufacturing the same.
    Type: Application
    Filed: November 14, 2019
    Publication date: March 17, 2022
    Inventors: Jae-choon LEE, Choung-Kook LEE, Young-seong WANG
  • Patent number: 11259125
    Abstract: A MEMS microphone includes a substrate presenting a vibration area, a supporting area surrounding the vibration area and a peripheral area surrounding the supporting area, the substrate defining a cavity formed in the vibration area, a lower back plate being disposed over the substrate to cover the cavity and having a plurality of lower acoustic holes, a diaphragm being disposed over the lower back plate, the diaphragm being spaced apart from the lower back plate and configured to generate a displacement thereof in response to an applied acoustic pressure, an upper back plate being disposed over the diaphragm, the upper back plate being spaced apart from the diaphragm and having a plurality of upper acoustic holes, and an intermediate anchor being in contact with an upper surface of the lower back plate in the supporting area, the intermediate anchor being configured to support the diaphragm to space the diaphragm from the lower back plate, and to provide elasticity for the diaphragm.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: February 22, 2022
    Assignee: DB HITEK CO., LTD.
    Inventors: Han Choon Lee, Hyeok In Kwon, Jong Won Sun, Dong Chun Park, Ye Eun Na
  • Publication number: 20220034132
    Abstract: Disclosed is a two way swinging door opening gap control device for controlling the movements of companion animals that is detachably attached to the existing door and door frame with ease, without any structural change or damage, thereby being applied conveniently to various types of doors, and that controls an opening gap of the door to allow the companion animals to freely enter through the door, to prevent the door from being excessively opened by external wind or animals entering therethrough, and to limit the spaces the animals can enter according to animal sizes to thus provide individual living spaces for the animals. According to the present invention, the opening gap control device largely includes a gap control band 100, a locking pin module 200, and a locking holder module 300.
    Type: Application
    Filed: July 20, 2021
    Publication date: February 3, 2022
    Inventor: Sang Choon LEE
  • Publication number: 20210400930
    Abstract: A method for adjusting an aquarium water temperature through direct heat exchange by a water temperature adjustment apparatus for an aquarium includes: a first step of allowing a smart sensor unit to measure the temperature of the water; a second step of controlling a heat exchange adjuster that sunk in the water to adjust the temperature of the water based on the temperature of the water measured by the smart sensor unit; and a third step of allowing the heat exchange adjuster to adjust direct heat exchange with the water.
    Type: Application
    Filed: March 11, 2019
    Publication date: December 30, 2021
    Inventor: Han Choon LEE
  • Publication number: 20210380653
    Abstract: Fusion polypeptides with modified multimerization domains that provide high expression, solubility, stability, and low immunogenicity to the fusion polypeptides have been developed. TRAIL compositions with the modified multimerization domains show improved physico-chemical and biological properties relative to TRAIL compositions with unmodified multimerization domains. The TRAIL compositions also have lower immunogenicity in the mammalian host when compared to that of TRAIL compositions with unmodified multimerization domains. The TRAIL compositions induce apoptosis of cancer cells and cancer-associated fibroblasts in vivo, reducing tumor size.
    Type: Application
    Filed: April 6, 2021
    Publication date: December 9, 2021
    Inventors: Alex Sokoloff, Viktor Roschke, Kang Choon Lee, Seulki Lee, Yumin Oh
  • Publication number: 20210317178
    Abstract: The present invention relates to a pharmaceutical composition including a polypeptide, and more particularly, to a pharmaceutical composition for preventing or treating obesity, diabetes, or non-alcoholic fatty liver disease. The pharmaceutical composition is safe without any side effects such as vomiting or nausea, and has effects of reducing food intake, enhancing insulin secretion, suppressing gastric emptying, promoting lipolysis, and lowering a level of triglycerides.
    Type: Application
    Filed: July 19, 2019
    Publication date: October 14, 2021
    Inventors: Kang Choon Lee, Og Yi Park, Hyoung Tae An, Eun Ji Park, Jae Hee Shin, Sung Mook Lim
  • Patent number: 11083116
    Abstract: The present disclosure relates to a cooler and to a display device having the same, where a heat-exchanger of the cooler is arranged on a side surface of a display unit in order to simplify the structure and to make a slimmer display device. The cooler includes a closed air circulation pathway circulating between the front, rear and sides of the display unit; an open air flow pathway that flows in the length direction of the side of the display unit; and a cooling module that is installed on the side of the display along the length direction of the display, and that includes the heat-exchanger, where the closed air circulation path and the open air flow part are adjacent, thereby causing heat-exchange.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: August 3, 2021
    Assignee: LG ELECTRONICS INC.
    Inventors: Ji Won Choi, Se Hyeon Kim, Ju Hyok Kim, Han Choon Lee, Sung Wook Han
  • Patent number: 10905036
    Abstract: The present invention relates to: a cooler capable of simplifying a structure, increasing heat exchange efficiency, and slimming a display device; and a display device using the same. A cooler structure applied to the display device uses a heat pipe allowing a refrigerant, which is a volatile liquid, to flow therein and a fin structure expanding a heat transfer cross section, so as to rapidly absorb, through evaporation of the refrigerant, heat from the air in a closed air circulation path circulating around a display unit, and quickly dissipate heat from an outside space (an open air circulation path) of the closed air circulation path through condensation of the refrigerant, thereby enabling heat exchange to occur very efficiently while occupying less volume. Additionally, the present invention provides the cooler structure in which the heat pipe is made in a circular fashion such that the refrigerant efficiently flows therein.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: January 26, 2021
    Assignee: LG ELECTRONICS INC.
    Inventors: Min Woo Jeong, Han Choon Lee, Se Hyeon Kim, Sung Wook Han
  • Publication number: 20200356041
    Abstract: An image forming apparatus includes an engine to form an image on an image forming medium, a paper transfer device to pick up a printing paper and transfer the paper to a transfer path, a sensor to sense a printing paper at a predetermined position on the transfer path, and a processor to determine whether a transfer delay occurs, when the printing paper is sensed, and adjust a pickup timing to advance a pickup of a printing paper of a next page.
    Type: Application
    Filed: July 9, 2018
    Publication date: November 12, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Ui Choon LEE, Chun Sub RYU
  • Publication number: 20200337185
    Abstract: The present disclosure relates to a cooler and to a display device having the same, where a heat-exchanger of the cooler is arranged on a side surface of a display unit in order to simplify the structure and to make a slimmer display device. The cooler includes a closed air circulation pathway circulating between the front, rear and sides of the display unit; an open air flow pathway that flows in the length direction of the side of the display unit; and a cooling module that is installed on the side of the display along the length direction of the display, and that includes the heat-exchanger, where the closed air circulation path and the open air flow part are adjacent, thereby causing heat-exchange.
    Type: Application
    Filed: December 16, 2016
    Publication date: October 22, 2020
    Inventors: Ji Won CHOI, Se Hyeon KIM, Ju Hyok KIM, Han Choon LEE, Sung Wook HAN
  • Publication number: 20200322732
    Abstract: A MEMS microphone includes a substrate presenting a vibration area, a supporting area surrounding the vibration area and a peripheral area surrounding the supporting area, the substrate defining a cavity formed in the vibration area, a lower back plate being disposed over the substrate to cover the cavity and having a plurality of lower acoustic holes, a diaphragm being disposed over the lower back plate, the diaphragm being spaced apart from the lower back plate and configured to generate a displacement thereof in response to an applied acoustic pressure, an upper back plate being disposed over the diaphragm, the upper back plate being spaced apart from the diaphragm and having a plurality of upper acoustic holes, and an intermediate anchor being in contact with an upper surface of the lower back plate in the supporting area, the intermediate anchor being configured to support the diaphragm to space the diaphragm from the lower back plate, and to provide elasticity for the diaphragm.
    Type: Application
    Filed: April 7, 2020
    Publication date: October 8, 2020
    Inventors: Han Choon LEE, Hyeok In KWON, Jong Won SUN, Dong Chun PARK, Ye Eun NA
  • Patent number: 10785577
    Abstract: A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate, a diaphragm disposed between the substrate and the back plate, a first supporting member surrounding the diaphragm, the first supporting member including first dam portions arranged along a circumference of the diaphragm, and first slit portions between the first dam portion adjacent to each other to be configured to support the diaphragm from a lower face of the substrate, and a second supporting member surrounding the first supporting member, the second supporting member including second dam portions arranged along a circumference of the first dam portions, and second slit portions between the second dam portion adjacent to each other to be configured to further support the diaphragm from the lower face of the substrate. Thus, the MEMS microphone has an increased acoustic resistance.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: September 22, 2020
    Assignee: DB HITEK CO., LTD.
    Inventors: Ye Eun Na, Han Choon Lee
  • Patent number: 10785557
    Abstract: A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate to cover the cavity and having a plurality of acoustic holes, a diaphragm disposed over the substrate to cover the cavity, the diaphragm being disposed under the back plate, including a venting hole communicating with the cavity, and sensing an acoustic pressure to create a displacement, and a first insulation layer interposed between the substrate and the diaphragm to support an end portion of the diaphragm to separate the diaphragm from the substrate, and the first insulation layer having an opening formed at a position corresponding to the cavity to expose the diaphragm. Thus, since the process of forming an anchor may be omitted, the process may be simplified, and process time may be shortened.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: September 22, 2020
    Assignee: DB HITEK CO., LTD.
    Inventors: Dong Chun Park, Han Choon Lee
  • Publication number: 20200280808
    Abstract: A back plate is disposed in a vibration area of a MEMS microphone. The back plate includes a central area located at a central portion of the back plate and having a plurality of acoustic holes formed therein, and a peripheral area located to surround the central area. The acoustic holes are arranged to be spaced apart from each other by the same interval.
    Type: Application
    Filed: February 27, 2020
    Publication date: September 3, 2020
    Inventors: Jong Won SUN, Han Choon LEE, Kum Jae SHIN
  • Patent number: 10642597
    Abstract: The present disclosure relates to a method of managing and updating two different versions of software, and more particularly, to an integrated management and update method of software including integrating software of a DC-DC converter and a battery management system (BMS) installed in residential Energy Storage System (ESS) to generate and manage one integrated management package, and sequentially executing a software update procedure of the DC-DC converter and the BMS in the integrated management package.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: May 5, 2020
    Assignee: LG Chem, Ltd.
    Inventors: Nak Choon Lee, Kyu Hyok Yim, Seong Keun Lee
  • Publication number: 20200063250
    Abstract: The present invention provides a high thermal conductivity iron-copper (Fe—Cu) alloy and a method of manufacturing the same. The present invention provides an iron-copper alloy containing 55 to 95 atomic % of iron and 5 to 45 atomic % of copper. The present invention also provides an iron-copper alloy manufacturing method including a first step of preparing a melting furnace; a second step of adding iron and copper to the melting furnace and performing dissolution and molten metal formation so as to contain 55 to 95 atomic % of iron and 5 to 45 atomic % of copper based on the weight of the iron-copper alloy; a third step of stabilizing the molten metal; and a fourth step of pouring the stabilized molten metal into a casting mold and performing casting.
    Type: Application
    Filed: February 6, 2017
    Publication date: February 27, 2020
    Inventors: Kwang Choon Lee, Bok Hyeon Jang
  • Publication number: 20200029460
    Abstract: The present invention relates to: a cooler capable of simplifying a structure, increasing heat exchange efficiency, and slimming a display device; and a display device using the same. A cooler structure applied to the display device uses a heat pipe allowing a refrigerant, which is a volatile liquid, to flow therein and a fin structure expanding a heat transfer cross section, so as to rapidly absorb, through evaporation of the refrigerant, heat from the air in a closed air circulation path circulating around a display unit, and quickly dissipate heat from an outside space (an open air circulation path) of the closed air circulation path through condensation of the refrigerant, thereby enabling heat exchange to occur very efficiently while occupying less volume. Additionally, the present invention provides the cooler structure in which the heat pipe is made in a circular fashion such that the refrigerant efficiently flows therein.
    Type: Application
    Filed: February 23, 2017
    Publication date: January 23, 2020
    Inventors: Min Woo JEONG, Han Choon LEE, Se Hyeon KIM, Sung Wook HAN
  • Publication number: 20190387325
    Abstract: A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate, a diaphragm disposed between the substrate and the back plate, a first supporting member surrounding the diaphragm, the first supporting member including first dam portions arranged along a circumference of the diaphragm, and first slit portions between the first dam portion adjacent to each other to be configured to support the diaphragm from a lower face of the substrate, and a second supporting member surrounding the first supporting member, the second supporting member including second dam portions arranged along a circumference of the first dam portions, and second slit portions between the second dam portion adjacent to each other to be configured to further support the diaphragm from the lower face of the substrate. Thus, the MEMS microphone has an increased acoustic resistance.
    Type: Application
    Filed: June 14, 2019
    Publication date: December 19, 2019
    Inventors: Ye Eun Na, Han Choon Lee
  • Patent number: 10412504
    Abstract: A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate and having a plurality of acoustic holes, a diaphragm disposed over the substrate to cover the cavity, the diaphragm being disposed under the back plate to be spaced apart from the back plate, including venting holes communicating with the cavity, and sensing an acoustic pressure to create a displacement, a first insulation layer interposed between the substrate and the diaphragm to support the diaphragm, and the first insulation layer including an opening formed at a position corresponding to the cavity to expose the diaphragm, a second insulating layer formed over the substrate to cover an upper face of the back plate and an insulating interlayer formed between the first insulation layer and the second insulation layer, and the insulation interlayer being located outside the diaphragm and supporting the second insulation layer to make the back plate be spaced from the diaphragm.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: September 10, 2019
    Assignee: DB HITEK CO., LTD.
    Inventors: Jong Won Sun, Han Choon Lee
  • Patent number: 10393689
    Abstract: In embodiments, a semiconductor gas sensor includes a substrate having a cavity, a first insulation layer formed on the substrate, including an exposure hole formed at a position corresponding to the cavity and a peripheral portion of the cavity, a second insulation layer formed on the first insulation layer, covering the exposure hole, a heating electrode formed on the second insulation layer, being formed at a position corresponding to the cavity, a sensing electrode formed over the heating electrode, being electrically insulated from the heating electrode and a detection layer covering the sensing electrode, being capable of having a variable resistance when acting with a predetermined kind of gas.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: August 27, 2019
    Assignee: DB HITEK CO., LTD.
    Inventors: Joo Hyeon Lee, Han Choon Lee