Abstract: A surface-treated inorganic nanoparticle including an inorganic nanoparticle, a first dispersant connected to the inorganic nanoparticle, and a second dispersant connected to the inorganic nanoparticle, wherein a molecular weight (MW) of the first dispersant is different from a molecular weight (MW) of the second dispersant.

Abstract: A lens includes an optical unit, and a rib unit extending outwardly in a radial direction of the optical portion, wherein the rib unit includes a light transmitting region and a light blocking region, and the light blocking region is disposed in the rib unit.

Abstract: The present disclosure relates to a dispersant containing a specific compound having a fluorene skeleton, and a composition using the same.

Abstract: A lens includes a light-transmitting portion and a light-shielding portion adjacent to at least a portion of the light-transmitting portion and integrated with the light-transmitting portion. The light-shielding portion includes at least one of carbon nanotubes and carbon black.

Abstract: A method of dyeing a lens, and a method of manufacturing a lens assembly is provided. The method includes an operation of dipping the lens in a dyeing solution containing a non-polar dye.

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface; a heat dissipation member disposed on the inactive surface of the semiconductor chip and including a graphite material; an adhesive member disposed between the semiconductor chip and the heat dissipation member; an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member; and an interconnect structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad. The encapsulant covers at least a portion of aside surface of the adhesive member.

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface; a heat dissipation member disposed on the inactive surface of the semiconductor chip and including a graphite material; an adhesive member disposed between the semiconductor chip and the heat dissipation member; an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member; and an interconnect structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad. The encapsulant covers at least a portion of aside surface of the adhesive member.

Abstract: There are provided a conductive paste composition for an external electrode and a multilayer ceramic electronic component fabricated using the same, the conductive paste composition for an external electrode including: a conductive metal powder; and a resin mixture including at least one resin selected from a group consisting of an epoxy-based resin and a phenoxy-based resin, and a polyvinyl formal resin.

Abstract: Disclosed herein are an insulating film for a printed circuit board and products having the same. In detail, in the insulating film according to a representative embodiment of the present invention, an insulating material in which a content of an inorganic filler in an insulating layer has a concentration gradient and a printed circuit board using the same may increase fillability of an inner layer circuit and a through hole of the inner layer circuit.

Abstract: Disclosed herein are a laminate for a printed circuit board, a printed circuit board using the same, and a method of manufacturing the same. The laminate for a printed circuit board includes: a first insulating film; and a second insulating film formed on the first insulating film, wherein a content of a reaction accelerator in the first insulating film is different from that of the second insulating film.

Abstract: The present invention relates to a method for manufacturing a printed circuit board including a flame retardant insulation layer. The printed circuit board of the present invention exhibits excellent thermal stability and excellent mechanical strength, is suitable for imprinting lithography process, provides improved reliability by reducing coefficient of thermal expansion, and has excellent adhesion between circuit patterns and an insulation layer.

Abstract: A method of manufacturing a flexible printed circuit board including determining an elastic modulus of a conductive portion and an elastic modulus of first and second dielectric portions, determining a thickness of the conductive portion and the first and second dielectric portions so that a neutral plane is located within a predetermined range of the thickness of the conductive portion, the neutral plane being substantially free from tension or compression in response to bending of the flexible printed circuit board, and insulating the conductive portion according to the determined thickness and the determined elastic modulus.

Abstract: Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 ?m or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.

Abstract: A filter is disclosed. The filter in accordance with an embodiment of the present invention is installed in a conduit through which resin mixed with filler passes, and includes a plate having an area corresponding to a horizontal section of the conduit and having a plurality of openings formed therein for filtering the filler. Each of the plurality of openings includes a first opening area and the second opening area that intersect with each other and are each elongated in one direction and have a predetermined width for filtering the filler.

Abstract: There are provided an apparatus for measuring a drying rate and a method for measuring a drying rate using the same in order to measure the drying rate of a substrate material for manufacturing an electronic apparatus, the apparatus for measuring a drying rate, including a support part having a substrate seated thereon, and a marking part disposed above the substrate while being vertically and horizontally movable, and forming a marking on the substrate while being in contact with the substrate.

Abstract: Disclosed are an insulator for a build-up PCB and a method of manufacturing a printed circuit board using the insulator. The insulator for a build-up PCB in accordance with an embodiment of the present invention includes: an insulation film layer, of which one surface has an area corresponding to a circuit board to be built-up; and a cover film layer, which is stacked on the insulation film layer and of which one surface has a larger area than the one surface of the insulation film layer so as to cover an entire outer perimeter of the insulation film layer.

Abstract: Disclosed herein is an insulation film having a metal layer, including: a carrier; a metal layer formed on the carrier; and an insulation layer formed on the metal layer.

Abstract: This invention relates to an epoxy resin composition, an insulating film formed therefrom, and a printed circuit board, and more particularly to an epoxy resin composition including an epoxy resin, an acid anhydride curing agent, etc., which exhibits improved dielectric properties by decreasing permittivity, dielectric tangent, etc. in a build-up type multilayer printed circuit board, and to an insulating film manufactured using the epoxy resin composition, and to a multilayer printed circuit board in which inner circuits formed of copper (Cu) are insulated by virtue of the insulating film to thus form multiple layers.

Abstract: There are provided a conductive paste composition for an external electrode and a multilayer ceramic electronic component fabricated using the same, the conductive paste composition for an external electrode including: a conductive metal powder; and a resin mixture including at least one resin selected from a group consisting of an epoxy-based resin and a phenoxy-based resin, and a polyvinyl formal resin.

Abstract: Disclosed herein are an adhesive member for manufacturing a printed circuit board, a printed circuit board, and a method of manufacturing the same. The printed circuit board includes a base substrate, an insulating layer formed on the base substrate, a primer layer formed on the insulating layer, and a circuit layer formed on the primer layer.