Patents by Inventor Chris J. Paidosh

Chris J. Paidosh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9737657
    Abstract: The disclosure is directed to a pressure sensor of an implantable medical device. The pressure sensor may utilize detect fluid pressure based on a changing capacitance between two capacitive elements. The pressure sensor may define at least a portion of a fluid enclosure of the IMD. In one example, the pressure sensor has a self-aligning housing shape that occludes an opening in the pump bulkhead of the IMD. An operative surface of the pressure and the portion of the fluid enclosure may be formed of a corrosion resistant and/or biocompatible material. A first capacitive element of the pressure sensor may be a metal alloy diaphragm that deflects in response to external fluid pressure. A second capacitive element of the pressure sensor may be a metal coating on a rigid insulator sealed from the fluid by the diaphragm and a housing of the sensor.
    Type: Grant
    Filed: June 3, 2010
    Date of Patent: August 22, 2017
    Assignee: Medtronic, Inc.
    Inventors: Keith A. Miesel, James M. Haase, Chris J. Paidosh, Darren A. Janzig, Timothy J. Denison
  • Patent number: 9687660
    Abstract: A one-piece electrical contact ring for use in a lead receptacle of an implantable medical device includes (i) a tubular body defining a cavity extending through the body and (ii) a plurality of resiliently deflectable elements extending from the tubular body into the cavity. The deflectable elements have a lead contacting portion configured to contact the lead when received by the cavity. The lead contacting portions of the deflectable elements in a relaxed state are located in a plane that intersects the tubular body and are configured to deflect along the plane towards the tubular body as the lead is inserted in the contact ring. The contact ring may further include a plurality of stops, each configured to (i) engage a stop portion of the elements when the elements are sufficiently outwardly deflected and (ii) inhibit further outward deflection of the elements when the stops engage the stop portions.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: June 27, 2017
    Assignee: MEDTRONIC, INC.
    Inventors: Darren A. Janzig, Chris J. Paidosh, Paulette C. Olson, Gerald G. Lindner
  • Patent number: 9610453
    Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a shield member defining a first portion of an interior cavity of the implantable medical device and a skirted feedthrough assembly. The feedthrough assembly includes a shield extender having a top face and a sidewall that extends from the top face so that the top face and the sidewall are a single continuous component. At least one feedthrough aperture extends through the top face.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: April 4, 2017
    Assignee: MEDTRONIC, INC.
    Inventors: John E. Kast, Linda M. Johnson-Morke, Chris J. Paidosh, Randy S. Roles
  • Publication number: 20170072189
    Abstract: A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.
    Type: Application
    Filed: November 29, 2016
    Publication date: March 16, 2017
    Inventors: Darren A. Janzig, Andrew J. Thom, Chris J. Paidosh, Brad C. Tischendorf, Gerald G. Lindner
  • Patent number: 9581519
    Abstract: A method for introducing an analyte gas into a cavity of an implantable medical device includes analyzing gas that exits the cavity through an outlet in communication with the cavity and introducing an analyte gas into the cavity via an inlet in communication with the cavity until the composition of the gas exiting the cavity comprises a predetermined percent or amount of the analyte gas. The inlet and outlet may be sealed, and the device may be leak tested.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: February 28, 2017
    Assignee: Medtronic, Inc.
    Inventor: Chris J. Paidosh
  • Publication number: 20160331978
    Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.
    Type: Application
    Filed: July 25, 2016
    Publication date: November 17, 2016
    Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
  • Patent number: 9398901
    Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: July 26, 2016
    Assignee: Medtronic, Inc.
    Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
  • Publication number: 20160121125
    Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a shield member defining a first portion of an interior cavity of the implantable medical device and a skirted feedthrough assembly. The feedthrough assembly includes a shield extender having a top face and a sidewall that extends from the top face so that the top face and the sidewall are a single continuous component. At least one feedthrough aperture extends through the top face.
    Type: Application
    Filed: October 29, 2015
    Publication date: May 5, 2016
    Inventors: John E. Kast, Linda M. Johnson-Morke, Chris J. Paidosh, Randy S. Roles
  • Publication number: 20150375002
    Abstract: A one-piece electrical contact ring for use in a lead receptacle of an implantable medical device includes (i) a tubular body defining a cavity extending through the body and (ii) a plurality of resiliently deflectable elements extending from the tubular body into the cavity. The deflectable elements have a lead contacting portion configured to contact the lead when received by the cavity. The lead contacting portions of the deflectable elements in a relaxed state are located in a plane that intersects the tubular body and are configured to deflect along the plane towards the tubular body as the lead is inserted in the contact ring. The contact ring may further include a plurality of stops, each configured to (i) engage a stop portion of the elements when the elements are sufficiently outwardly deflected and (ii) inhibit further outward deflection of the elements when the stops engage the stop portions.
    Type: Application
    Filed: July 2, 2015
    Publication date: December 31, 2015
    Inventors: Darren A. Janzig, Chris J. Paidosh, Paulette C. Olson, Gerald G. Lindner
  • Patent number: 9095728
    Abstract: A one-piece electrical contact ring for use in a lead receptacle of an implantable medical device includes (i) a tubular body defining a cavity extending through the body and (ii) a plurality of resiliently deflectable elements extending from the tubular body into the cavity. The deflectable elements have a lead contacting portion configured to contact the lead when received by the cavity. The lead contacting portions of the deflectable elements in a relaxed state are located in a plane that intersects the tubular body and are configured to deflect along the plane towards the tubular body as the lead is inserted in the contact ring. The contact ring may further include a plurality of stops, each configured to (i) engage a stop portion of the elements when the elements are sufficiently outwardly deflected and (ii) inhibit further outward deflection of the elements when the stops engage the stop portions.
    Type: Grant
    Filed: September 8, 2009
    Date of Patent: August 4, 2015
    Assignee: Medtronic, Inc.
    Inventors: Darren A. Janzig, Chris J. Paidosh, Paulette C. Olson, Gerald G. Lindner
  • Publication number: 20150114092
    Abstract: A method for introducing an analyte gas into a cavity of an implantable medical device includes analyzing gas that exits the cavity through an outlet in communication with the cavity and introducing an analyte gas into the cavity via an inlet in communication with the cavity until the composition of the gas exiting the cavity comprises a predetermined percent or amount of the analyte gas. The inlet and outlet may be sealed, and the device may be leak tested.
    Type: Application
    Filed: March 1, 2013
    Publication date: April 30, 2015
    Applicant: MEDTRONIC, INC.
    Inventor: Chris J. Paidosh
  • Publication number: 20150094789
    Abstract: A implantable active medical device includes a chassis plate having a first major surface and an opposing second major surface, an elongate lead connector fixed to the first major surface and extending orthogonally away from the first major surface and a circuit board fixed to the first major surface and extending orthogonally away from the first major surface. A hermetic housing defines a sealed housing cavity. The hermetic housing is fixed to the first major surface. The elongate lead connector and the circuit board are disposed within the sealed housing cavity.
    Type: Application
    Filed: March 12, 2013
    Publication date: April 2, 2015
    Inventors: Darren A. Janzig, Gerald Lindner, Chris J. Paidosh, Andrew J. Thom, Brad C. Tischendorf
  • Publication number: 20140163646
    Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.
    Type: Application
    Filed: December 6, 2013
    Publication date: June 12, 2014
    Applicant: Medtronic, Inc.
    Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
  • Patent number: 8525027
    Abstract: An end interconnector for one or both ends of a lead body of an electrical lead for an implantable medical device. The interconnector has an insulative body having a receptacle at its first end for each of a plurality of wire filars from the lead body, and a receiver at its second end for each of a plurality of connection wires extending from the medical device, such as an electrode tip. The interconnector provides electrical connection between the plurality of wire filars and the plurality of connection wires.
    Type: Grant
    Filed: January 23, 2009
    Date of Patent: September 3, 2013
    Assignee: Medtronic, Inc.
    Inventors: Gerald G. Lindner, Paulette C. Olson, Darren A. Janzig, Chris J. Paidosh
  • Patent number: 8397578
    Abstract: The disclosure is directed to a capacitive pressure sensor, and the assembly of a capacitive pressure sensor, that may be used within an implantable medical pump. In one example, a housing ferrule that encloses one capacitive plate and includes at least one protrusion for attaching a support structure of the capacitive plate. The at least one protrusion defines a smaller inner diameter as a reference point for securing the support structure while the ferrule provides a larger inner diameter to allow the support structure to tilt inside the ferrule to orient the capacitive plate into a desired plane. Despite manufacturing irregularities, the capacitive plate can be mounted in the desired plane parallel to another capacitive plate, a diaphragm, mounted to an edge of the ferrule. In another example, an assembly tool provides a stage to orient the capacitive plate and support structure within the ferrule at a desired depth.
    Type: Grant
    Filed: June 3, 2010
    Date of Patent: March 19, 2013
    Assignee: Medtronic, Inc.
    Inventors: Keith A. Miesel, James M. Haase, Chris J. Paidosh, Darren A. Janzig, Timothy J. Denison
  • Patent number: 8380311
    Abstract: A housing for an implantable medical device includes a first portion formed from a first material and a second portion formed from a second material. The first material and the second material comprise titanium and the first material has a higher resistivity than the second material.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: February 19, 2013
    Assignee: Medtronic, Inc.
    Inventors: Bernard Q. Li, John J. Grevious, Timothy J. Davis, Leroy Perz, Chris J. Paidosh
  • Publication number: 20120124831
    Abstract: A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.
    Type: Application
    Filed: January 30, 2012
    Publication date: May 24, 2012
    Applicant: MEDTRONIC, INC.
    Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
  • Publication number: 20120116470
    Abstract: A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating glass material. The electrically insulating glass material fixes the two or more electrically conducting contact rings in axial alignment.
    Type: Application
    Filed: January 25, 2011
    Publication date: May 10, 2012
    Applicant: MEDTRONIC, INC.
    Inventors: John E. KAST, Darren A. Janzig, Chris J. Paidosh, Andrew J. Thom, Brad C. Tischendorf, Gerald G. Lindner
  • Patent number: 8131370
    Abstract: A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.
    Type: Grant
    Filed: April 10, 2007
    Date of Patent: March 6, 2012
    Assignee: Medtronic, Inc
    Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
  • Publication number: 20110296925
    Abstract: The disclosure is directed to a capacitive pressure sensor, and the assembly of a capacitive pressure sensor, that may be used within an implantable medical pump. In one example, a housing ferrule that encloses one capacitive plate and includes at least one protrusion for attaching a support structure of the capacitive plate. The at least one protrusion defines a smaller inner diameter as a reference point for securing the support structure while the ferrule provides a larger inner diameter to allow the support structure to tilt inside the ferrule to orient the capacitive plate into a desired plane. Despite manufacturing irregularities, the capacitive plate can be mounted in the desired plane parallel to another capacitive plate, a diaphragm, mounted to an edge of the ferrule. In another example, an assembly tool provides a stage to orient the capacitive plate and support structure within the ferrule at a desired depth.
    Type: Application
    Filed: June 3, 2010
    Publication date: December 8, 2011
    Applicant: Medtronic, Inc.
    Inventors: Keith A. Miesel, James M. Haase, Chris J. Paidosh, Darren A. Janzig, Timothy J. Denison