Patents by Inventor Chris J. Paidosh
Chris J. Paidosh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9737657Abstract: The disclosure is directed to a pressure sensor of an implantable medical device. The pressure sensor may utilize detect fluid pressure based on a changing capacitance between two capacitive elements. The pressure sensor may define at least a portion of a fluid enclosure of the IMD. In one example, the pressure sensor has a self-aligning housing shape that occludes an opening in the pump bulkhead of the IMD. An operative surface of the pressure and the portion of the fluid enclosure may be formed of a corrosion resistant and/or biocompatible material. A first capacitive element of the pressure sensor may be a metal alloy diaphragm that deflects in response to external fluid pressure. A second capacitive element of the pressure sensor may be a metal coating on a rigid insulator sealed from the fluid by the diaphragm and a housing of the sensor.Type: GrantFiled: June 3, 2010Date of Patent: August 22, 2017Assignee: Medtronic, Inc.Inventors: Keith A. Miesel, James M. Haase, Chris J. Paidosh, Darren A. Janzig, Timothy J. Denison
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Patent number: 9687660Abstract: A one-piece electrical contact ring for use in a lead receptacle of an implantable medical device includes (i) a tubular body defining a cavity extending through the body and (ii) a plurality of resiliently deflectable elements extending from the tubular body into the cavity. The deflectable elements have a lead contacting portion configured to contact the lead when received by the cavity. The lead contacting portions of the deflectable elements in a relaxed state are located in a plane that intersects the tubular body and are configured to deflect along the plane towards the tubular body as the lead is inserted in the contact ring. The contact ring may further include a plurality of stops, each configured to (i) engage a stop portion of the elements when the elements are sufficiently outwardly deflected and (ii) inhibit further outward deflection of the elements when the stops engage the stop portions.Type: GrantFiled: July 2, 2015Date of Patent: June 27, 2017Assignee: MEDTRONIC, INC.Inventors: Darren A. Janzig, Chris J. Paidosh, Paulette C. Olson, Gerald G. Lindner
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Patent number: 9610453Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a shield member defining a first portion of an interior cavity of the implantable medical device and a skirted feedthrough assembly. The feedthrough assembly includes a shield extender having a top face and a sidewall that extends from the top face so that the top face and the sidewall are a single continuous component. At least one feedthrough aperture extends through the top face.Type: GrantFiled: October 29, 2015Date of Patent: April 4, 2017Assignee: MEDTRONIC, INC.Inventors: John E. Kast, Linda M. Johnson-Morke, Chris J. Paidosh, Randy S. Roles
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Publication number: 20170072189Abstract: A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.Type: ApplicationFiled: November 29, 2016Publication date: March 16, 2017Inventors: Darren A. Janzig, Andrew J. Thom, Chris J. Paidosh, Brad C. Tischendorf, Gerald G. Lindner
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Patent number: 9581519Abstract: A method for introducing an analyte gas into a cavity of an implantable medical device includes analyzing gas that exits the cavity through an outlet in communication with the cavity and introducing an analyte gas into the cavity via an inlet in communication with the cavity until the composition of the gas exiting the cavity comprises a predetermined percent or amount of the analyte gas. The inlet and outlet may be sealed, and the device may be leak tested.Type: GrantFiled: March 1, 2013Date of Patent: February 28, 2017Assignee: Medtronic, Inc.Inventor: Chris J. Paidosh
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Publication number: 20160331978Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.Type: ApplicationFiled: July 25, 2016Publication date: November 17, 2016Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
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Patent number: 9398901Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.Type: GrantFiled: December 6, 2013Date of Patent: July 26, 2016Assignee: Medtronic, Inc.Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
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Publication number: 20160121125Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a shield member defining a first portion of an interior cavity of the implantable medical device and a skirted feedthrough assembly. The feedthrough assembly includes a shield extender having a top face and a sidewall that extends from the top face so that the top face and the sidewall are a single continuous component. At least one feedthrough aperture extends through the top face.Type: ApplicationFiled: October 29, 2015Publication date: May 5, 2016Inventors: John E. Kast, Linda M. Johnson-Morke, Chris J. Paidosh, Randy S. Roles
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Publication number: 20150375002Abstract: A one-piece electrical contact ring for use in a lead receptacle of an implantable medical device includes (i) a tubular body defining a cavity extending through the body and (ii) a plurality of resiliently deflectable elements extending from the tubular body into the cavity. The deflectable elements have a lead contacting portion configured to contact the lead when received by the cavity. The lead contacting portions of the deflectable elements in a relaxed state are located in a plane that intersects the tubular body and are configured to deflect along the plane towards the tubular body as the lead is inserted in the contact ring. The contact ring may further include a plurality of stops, each configured to (i) engage a stop portion of the elements when the elements are sufficiently outwardly deflected and (ii) inhibit further outward deflection of the elements when the stops engage the stop portions.Type: ApplicationFiled: July 2, 2015Publication date: December 31, 2015Inventors: Darren A. Janzig, Chris J. Paidosh, Paulette C. Olson, Gerald G. Lindner
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Patent number: 9095728Abstract: A one-piece electrical contact ring for use in a lead receptacle of an implantable medical device includes (i) a tubular body defining a cavity extending through the body and (ii) a plurality of resiliently deflectable elements extending from the tubular body into the cavity. The deflectable elements have a lead contacting portion configured to contact the lead when received by the cavity. The lead contacting portions of the deflectable elements in a relaxed state are located in a plane that intersects the tubular body and are configured to deflect along the plane towards the tubular body as the lead is inserted in the contact ring. The contact ring may further include a plurality of stops, each configured to (i) engage a stop portion of the elements when the elements are sufficiently outwardly deflected and (ii) inhibit further outward deflection of the elements when the stops engage the stop portions.Type: GrantFiled: September 8, 2009Date of Patent: August 4, 2015Assignee: Medtronic, Inc.Inventors: Darren A. Janzig, Chris J. Paidosh, Paulette C. Olson, Gerald G. Lindner
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Publication number: 20150114092Abstract: A method for introducing an analyte gas into a cavity of an implantable medical device includes analyzing gas that exits the cavity through an outlet in communication with the cavity and introducing an analyte gas into the cavity via an inlet in communication with the cavity until the composition of the gas exiting the cavity comprises a predetermined percent or amount of the analyte gas. The inlet and outlet may be sealed, and the device may be leak tested.Type: ApplicationFiled: March 1, 2013Publication date: April 30, 2015Applicant: MEDTRONIC, INC.Inventor: Chris J. Paidosh
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Publication number: 20150094789Abstract: A implantable active medical device includes a chassis plate having a first major surface and an opposing second major surface, an elongate lead connector fixed to the first major surface and extending orthogonally away from the first major surface and a circuit board fixed to the first major surface and extending orthogonally away from the first major surface. A hermetic housing defines a sealed housing cavity. The hermetic housing is fixed to the first major surface. The elongate lead connector and the circuit board are disposed within the sealed housing cavity.Type: ApplicationFiled: March 12, 2013Publication date: April 2, 2015Inventors: Darren A. Janzig, Gerald Lindner, Chris J. Paidosh, Andrew J. Thom, Brad C. Tischendorf
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Publication number: 20140163646Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.Type: ApplicationFiled: December 6, 2013Publication date: June 12, 2014Applicant: Medtronic, Inc.Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
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Patent number: 8525027Abstract: An end interconnector for one or both ends of a lead body of an electrical lead for an implantable medical device. The interconnector has an insulative body having a receptacle at its first end for each of a plurality of wire filars from the lead body, and a receiver at its second end for each of a plurality of connection wires extending from the medical device, such as an electrode tip. The interconnector provides electrical connection between the plurality of wire filars and the plurality of connection wires.Type: GrantFiled: January 23, 2009Date of Patent: September 3, 2013Assignee: Medtronic, Inc.Inventors: Gerald G. Lindner, Paulette C. Olson, Darren A. Janzig, Chris J. Paidosh
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Patent number: 8397578Abstract: The disclosure is directed to a capacitive pressure sensor, and the assembly of a capacitive pressure sensor, that may be used within an implantable medical pump. In one example, a housing ferrule that encloses one capacitive plate and includes at least one protrusion for attaching a support structure of the capacitive plate. The at least one protrusion defines a smaller inner diameter as a reference point for securing the support structure while the ferrule provides a larger inner diameter to allow the support structure to tilt inside the ferrule to orient the capacitive plate into a desired plane. Despite manufacturing irregularities, the capacitive plate can be mounted in the desired plane parallel to another capacitive plate, a diaphragm, mounted to an edge of the ferrule. In another example, an assembly tool provides a stage to orient the capacitive plate and support structure within the ferrule at a desired depth.Type: GrantFiled: June 3, 2010Date of Patent: March 19, 2013Assignee: Medtronic, Inc.Inventors: Keith A. Miesel, James M. Haase, Chris J. Paidosh, Darren A. Janzig, Timothy J. Denison
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Patent number: 8380311Abstract: A housing for an implantable medical device includes a first portion formed from a first material and a second portion formed from a second material. The first material and the second material comprise titanium and the first material has a higher resistivity than the second material.Type: GrantFiled: October 31, 2006Date of Patent: February 19, 2013Assignee: Medtronic, Inc.Inventors: Bernard Q. Li, John J. Grevious, Timothy J. Davis, Leroy Perz, Chris J. Paidosh
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Publication number: 20120124831Abstract: A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.Type: ApplicationFiled: January 30, 2012Publication date: May 24, 2012Applicant: MEDTRONIC, INC.Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
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Publication number: 20120116470Abstract: A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating glass material. The electrically insulating glass material fixes the two or more electrically conducting contact rings in axial alignment.Type: ApplicationFiled: January 25, 2011Publication date: May 10, 2012Applicant: MEDTRONIC, INC.Inventors: John E. KAST, Darren A. Janzig, Chris J. Paidosh, Andrew J. Thom, Brad C. Tischendorf, Gerald G. Lindner
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Patent number: 8131370Abstract: A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.Type: GrantFiled: April 10, 2007Date of Patent: March 6, 2012Assignee: Medtronic, IncInventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
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Publication number: 20110296925Abstract: The disclosure is directed to a capacitive pressure sensor, and the assembly of a capacitive pressure sensor, that may be used within an implantable medical pump. In one example, a housing ferrule that encloses one capacitive plate and includes at least one protrusion for attaching a support structure of the capacitive plate. The at least one protrusion defines a smaller inner diameter as a reference point for securing the support structure while the ferrule provides a larger inner diameter to allow the support structure to tilt inside the ferrule to orient the capacitive plate into a desired plane. Despite manufacturing irregularities, the capacitive plate can be mounted in the desired plane parallel to another capacitive plate, a diaphragm, mounted to an edge of the ferrule. In another example, an assembly tool provides a stage to orient the capacitive plate and support structure within the ferrule at a desired depth.Type: ApplicationFiled: June 3, 2010Publication date: December 8, 2011Applicant: Medtronic, Inc.Inventors: Keith A. Miesel, James M. Haase, Chris J. Paidosh, Darren A. Janzig, Timothy J. Denison