Abstract: A pool cleaning system is provided. The system includes a pool pole. The system also includes an angled attachment device configured to connect to an end of the pool pole. The system additionally includes specialty tools structured to connect to an end of the angled attachment device. The angled attachment device is structured to connect to pool poles and to specialty devices in such a way to provide a plurality of angles to allow cleaning of pool surfaces and pool surface areas in an effective, efficient, and ergonomically friendly fashion for pool cleaning personnel. The pool cleaning system is arranged to change the angles at which the surfaces are being cleaned without having to change out components.

Abstract: A pool cleaning system is provided. The system includes a pool pole. The system also includes an angled attachment device configured to connect to an end of the pool pole. The system additionally includes specialty tools structured to connect to an end of the angled attachment device. The angled attachment device is structured to connect to pool poles and to specialty devices in such a way to provide a plurality of angles to allow cleaning of pool surfaces and pool surface areas in an effective, efficient, and ergonomically friendly fashion for pool cleaning personnel. The pool cleaning system is arranged to change the angles at which the surfaces are being cleaned without having to change out components.

Abstract: In one example, a fluid system component includes a first element and a second element, where one or both of the first and second elements are configured to be exposed to a fluid. The fluid system also includes a flexible diaphragm positioned between the first and second elements. Finally, the fluid system component includes one or more retaining elements, each retaining element having a first portion received in the first element and a second portion received in the second element. The retaining elements also extend through the flexible diaphragm.

Abstract: According to example embodiments, a device configured to dissipate heat from a first chip and a second chip on a multi-chip package includes a primary heat sink configured to contact an upper surface of the first chip, a secondary heat sink configured to contact an upper surface of the second chip, the secondary heat sink disposed within the primary heat sink and movable in relation to the primary heat sink, and a thermally conductive substance disposed in contact with the primary heat sink and the secondary heat sink.