Abstract: Techniques for controlling cooling of electronic components in computing facilities are disclosed herein. In one embodiment, a method includes detecting a pressure drop of a coolant flowing across multiple servers in an enclosure between the inlet and outlet manifolds and a supply temperature of the coolant at the inlet manifold. The method further includes automatically adjust operations of the pump to maintain the calculated pressure drop at or near a pressure-drop setpoint while automatically adjusting operations of the air mover to maintain the supply temperature at or near a temperature setpoint.

Abstract: Systems and methods for determining efficiency-of-use scores related to uses of a product by two or more users may implement operations including, but not limited to: computing at least one of an efficiency-of-use score and an environmental impact quantification according to data associated with a use of a physical product by a user over a period of time the user is indicated as having control of the physical product; and publishing the at least one of an efficiency-of-use score and an ecological impact quantification associated with the use of the product by the user to a social media interface.

Abstract: Systems and methods for providing ecological impact quantification identifiers may implement operations including, but not limited to computing at least one ecological impact quantification associated with at least one life-cycle phase of a product; and means for assigning at least one of a positive ecological impact status, a negative ecological impact status and a neutral ecological impact status with a user account according to the at least one ecological impact quantification.

Abstract: A cooling system has at least one heat conducting element in thermal contact with an electronic component. A heat exchanger is in fluid communication with the heat conducting element. The heat exchanger is configured to provide a working fluid to the at least one heat conducting element to facilitate dissipation of heat from the respective electronic component. The heat exchanger has a form factor dimensioned and configured for mounting in a preconfigured hardware unit slot of a computer chassis.

Abstract: A cooling system has at least one heat conducting element in thermal contact with an electronic component. A heat exchanger is in fluid communication with the heat conducting element. The heat exchanger is configured to provide a working fluid to the at least one heat conducting element to facilitate dissipation of heat from the respective electronic component. The heat exchanger has a form factor dimensioned and configured for mounting in a preconfigured hardware unit slot of a computer chassis.

Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.

Abstract: According to at least one embodiment, a cell board interconnection architecture comprises an interconnection structure for interconnecting a plurality of cell boards, the interconnection structure configured to allow air to pass therethrough in a direction in which the cell boards couple therewith.

Abstract: In certain embodiments, there is provided a computer system and a method for providing a computer system. Specifically, there is provided a computer system that may include a porous main board that is configured to couple to a plurality of switch boards. The porous main board may be configured to conduct air flowing from the front to the back of the computer system and to permit the switch boards to be serviced from the front or back of the computer system. Moreover, in certain embodiments, the switch boards may be hot-swappable.

Abstract: The present invention provides for redistributing workloads among computers to optimize resource utilization. Utilization by software workloads of computer resources is monitored to yield utilization data. A utilization chronology is updated using the utilization data. The chronology is analyzed to yield resource utilization predictions. The workloads are redistributed among the resources at least in part as function of said predictions.

Abstract: A system has a plurality of electronic components that are powered by a power source, and each of the components is associated with a respective power cap. The system further has logic configured to monitor power consumption of the electronic components over a duration and dynamically adjust at least one power cap associated with at least one of the electronic components based on the monitored power consumption.

Abstract: A cooling system for a server includes at least one liquid cooling unit. The liquid cooling unit connects to the server to provide fault-tolerant cooling to the server when a cooling system connected to the server fails.

Abstract: In one embodiment, a system comprises one or more electronic components, one or more coolant sources, one or more coolant supply lines in fluid communication with the one or more coolant sources, a heat exchanger in thermal communication with the coolant supply lines and the one or more electronic components; one or more coolant distribution units to regulate the flow of coolant through the one or more coolant supply lines, and an environment management unit communicatively coupled to the one or more electronic components and the one or more coolant distribution units, wherein the environment management unit regulates coolant flow through the one or more coolant supply lines according to one or more environmental parameters proximate the one or more electronic components.

Abstract: A floor tile body containing a plurality of openings (such as those commonly used in computer data centers) is built to include at least one air parameter sensor. The one or more sensors are electrically coupled with control electronics where their raw data is converted into air parameters such as temperature, humidity, pressure, and air flow velocity or volume. Optionally, the control electronics may communicate with a computer for data logging or a display.

Abstract: A multi-board assembly includes a main printed circuit board (PCB) assembly that is coupled to at least two secondary PCB assemblies. A positioning device situates the second PCB assemblies in a desired position such that electrical connectors on the second PCB assemblies align with and engage complementary connectors on the main PCB assembly.

Abstract: In certain embodiments, an air-pressurizing device is positioned to discharge a computer system. A supply conduit pneumatically couples a cooled-air discharge conditioning system with an inlet of the air-pressurizing device.

Abstract: Systems, methods, and apparatus are disclosed for supplying power to racks having plural servers. One exemplary embodiment is a system with a rack having a plurality of servers and being connected to two separate alternating current (AC) power grids that distribute power to the plurality of servers with load of the rack being distributed across both AC power grids.

Abstract: A computer server is configured to electrically and mechanically couple with a plurality of different power modules. These power modules are interchangeable, and all fit within the form factor of the server, eliminating the use of PDUs within the server rack. The server may be configured in the factory or in the field to use either the single-phase AC power configuration, the 3-phase AC power configuration, or any other power configuration, such as DC, desired.

Abstract: A system comprises a first equipment rack, a power distribution unit (PDU) and a plurality of rack connectors. The PDU is mounted in the first equipment rack and is configured to provide alternating current (AC) power that comprises a plurality of phases. The plurality of rack connectors mount within the first equipment rack, and each of the plurality of rack connectors couples to the PDU and provides access to the plurality of phases. Each rack connector is usable to accommodate a first device installed in the equipment rack that uses one or more of the plurality of phases, and is also usable to accommodate a second device installed in the equipment rack that uses one or more of the plurality of phases, thereby permitting each rack connector to couple to any of a plurality of devices, and permitting each of the plurality of devices to use any number of the plurality of phases. The number of phases used by the first device differs from the number of phases used by the second device.

Abstract: A fan and heat sink combination for transferring heat from a heat source includes a base, a fan and a plurality of heat dissipation fins. The base is for conducting heat from the heat source. The fan is mounted on top of the base. The heat dissipation fins extend around the fan from the base to a location beyond a surface of the fan.

Abstract: Embodiments include apparatus, methods, and systems providing a thermal dissipation device with thermal compound recesses. In one embodiment, the thermal dissipation device includes a body with plural recesses formed in a planar surface of the body. The recesses are adapted to receive a thermal compound that conducts heat from an electronic heat generating component to the thermal dissipation device.