Abstract: A data center is configured in a room using alternating rows of racks containing heat-generating electronic devices and air conditioners or liquid conditioners. Chilled fluid, such as water or a refrigerant, for the air conditioners or liquid conditioners is supplied through redundant plumbing comprising first and second supply and return pipes below a raised floor. Attached to this redundant plumbing are standard fluid couplings configured to couple to either air conditioners or liquid conditioners. The air conditioners and liquid conditioners use the same chilled fluid so that they may share the redundant plumbing and continually receive chilled fluid in the event of the failure of one of the chilled fluid supplies.

Abstract: Systems, methodologies, media, and other embodiments associated with a configurable heat sink are described. One exemplary system embodiment includes a base portion of a heat sink to which different accessories may be removably attached. The example system may include a first accessory like a cover that forms an assembly with the base portion of the heat sink and causes the assembly to operate in a first manner.

Abstract: An enclosure having a front and back and including at least one environmental parameter detector is built. The environmental parameter detector is electrically coupled with a display mechanically attached to the front or back of the enclosure. The display may be programmed to show a variety of environmental parameters from the at least one environmental parameter detectors inside the enclosure. An optional alarm may be mechanically attached to the enclosure configured to activate when one or more of the environmental parameters exceeds their defined margin.

Abstract: An equipment rack including front and back doors is configured with fans for air cooling enclosed electronic devices in both doors. The fans in each door are sufficient, by themselves, to provide sufficient airflow to cool the electronic devices. The two doors include switches and magnetic interlocks configured such that when one door is opened, the magnetic interlock on the other door is activated preventing both door from being opened at the same time. This ensures that at least one door is always closed while the system is powered up, and since the fans in each door provide sufficient cooling for the equipment rack, the rack is always sufficiently cooled to prevent electronic device failure from overheating.

Abstract: A computer system comprising a chassis supporting a processor, memory, and a power supply. An inlet allows air to flow into the chassis and an outlet allows air to flow out of the chassis. An air mover is operable to generate an airflow through said chassis between the inlet and the outlet and in thermal communication with the processor, memory, and power supply. The air mover is disposed external to said chassis.

Abstract: In one embodiment, there is shown a heat transfer device having at least one ultra-dense heat sink, where the heat sink is maintained in a position to be air flow direction neutral. In another embodiment, there is shown a method of conducting heat away from an electronic device wherein the electronic device is constructed on a circuit board, the method comprises placing a plurality of heat transfer devices in heat transfer relationship with the electronic device and passing air through the heat transfer devices in at least one air flow direction.

Abstract: A data center is configured using alternating rows of racks containing heat-generating electronic devices and air conditioners. Fluid, such as water or a refrigerant, for the air conditioners is supplied through pluming below a raised floor, such as those commonly found in current data centers. Attached to this plumbing are standard fluid couplings configured to couple to either air conditioners or liquid cooling units. These air conditioners and liquid cooling units use the same fluid so that they may share the plumbing. As data center migrates to liquid-cooled racks, a fraction of the air conditioners are replaced with liquid conditioning units in such a way that the data center contains both air-cooled and liquid-cooled racks without substantial reduction in efficiency of the air-cooling system. Since the air conditioners and liquid conditioning units use the same couplings and the same fluid, no infrastructure change is required.

Abstract: A cooling assembly is disclosed comprising one or more heat pipes heat pipes connected to a base member, a plurality of thermal plates connected to the one or more heat pipes at predefined intervals, wherein the one or more heat pipes intersects the plurality of thermal plates, and an opening fashioned in each one of the plurality of thermal plates

Abstract: In one embodiment, a thermal dissipation system comprises a plurality of thermal members having surfaces adapted for transferring heat from heat generating elements, a heat sink, and a plurality of heat pipes, each of the heat pipes coupled between a respective one of the plurality of thermal members and the heat sink, wherein the plurality of heat pipes possess a sufficient amount of flexibility to enable each of the plurality of thermal members to be disposed over a range of positions relative to the heat sink.

Abstract: According to at least one embodiment, a cell board interconnection architecture comprises an interconnection structure for interconnecting a plurality of cell boards, the interconnection structure configured to allow air to pass therethrough in a direction in which the cell boards couple therewith.

Abstract: A heat dissipating arrangement includes a first heat emitting device, a second heat emitting device, and a heat sink thermally coupled to the first heat emitting device and extending on opposite sides of the second heat emitting device.

Abstract: An electronic device such as a computer, circuit board, or integrated circuit is built including circuitry for receiving temperature information. The clock frequency of the electronic device is varied in response to the temperature of the electronic device, thus lowering speed and power consumption of the device during periods of higher than normal temperature. Alternately, an electronic device such as a computer, circuit board, or integrated circuit is built including circuitry for receiving power supply information. The clock frequency and possibly the power supply voltage of the electronic device is varied in response to the power supply status of the electronic device, thus lowering speed and power consumption of the device during periods of lower than normal power supply current capability.

Abstract: A cooling device for electronic devices is built comprising at least two fan sinks thermally coupled together such that when one fan sink fails, the remaining fan sinks are able to compensate for the failed fan sink. Optionally, the remaining fan sinks may be controlled to speed up upon detection of a failure, increasing their cooling capacity to compensate for the failed fan sink. Also optionally, a thermal coupling device such as heat pipes may be used as part of the thermal coupling between the fan sinks to increase the cooling efficiency of the remaining fan sinks to the device or devices closest to the failed fan sink. Also optionally, the thermal coupling device may be configured to allow some flexibility in the cooling device assembly allowing for the cooling of non-coplanar electronic devices.

Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.

Abstract: A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the pad. Each plate assembly includes one or more spring members configured such that the completed thermal interface pad includes a plurality of spring members on at least two sides of the pad. The thermal interface plate assemblies are configured to allow the thermal interface pad to vary greatly in thickness. The pad is sufficiently adjustable in thickness to accommodate gross tolerance differences between multiple heat generating and sinking devices. Rods inserted in openings in the plates may be used to align the plate assemblies and to apply compressive force to the plates, improving the thermal conductivity between adjacent plates and greatly decreasing the overall thermal resistance of the thermal interface pad.

Abstract: A power supply system and method are disclosed that may incorporate a plurality of cascading power units arranged in parallel, a connection interface between the plurality of cascading power units and an electronic load, wherein the connection interface prevents current from entering one of the plurality of cascading power units from another of the plurality, and wherein each one of the plurality of cascading power units has a maximum effective output voltage greater than a next one of said plurality.

Abstract: Example sealed electronics modules are described. The sealed electronics module may include electronics components. The sealed electronics module may also include one or more connectors configured to provide one or more detachable liquid connections to a liquid transporting apparatus. The liquid transporting apparatus may provide liquid communication between the sealed electronics module and an external liquid cooling module. The sealed electronics module may also include an apparatus for the cooling electronics components in the electronics module using liquid that is transported between the sealed electronics module and the external liquid cooling module.

Abstract: An example airborne conductive contaminant handling system is described. The airborne conductive contaminant handling system may include a handling circuit that is configured to selectively pass an electric current through a conductive contaminant. The airborne conductive contaminant handling system may also include an attracting circuit that is configured to attract an airborne conductive contaminant towards the handling circuit, where it can be subjected to the electric current. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the application. It is submitted with the understanding that it will not be employed to interpret or limit the scope or meaning of the claims.

Abstract: A system for cooling heat generating objects arranged in a room. The system adapts in real time to changing cooling demands of the objects. Remote sensors mounted in proximity to the heat generating objects relay information to cooling units, which adjust their operation in response to the information.

Abstract: A method and system are disclosed for cooling a heat generating object. A coolant is passed through a heat exchanger so that heated air passing through a first portion of the heat exchanger is cooled. A fan unit is selectively positioned relative to the heat exchanger. When activated, the fan unit draws the cooled air through a second portion of the heat exchanger and directs the twice cooled air towards the heat generating object. The fan unit may be repositioned along a different portion of the heat exchanger so as to redefine the flow of air drawn from and directed towards the heat generating object.