Abstract: The invention relates to a chip card (CC), in particular a SIM card, inserted for operation into a holder (HH), which holder (HH) is equipped with electrical device contacts (GK) and a press-on device (AE). The chip card (CC) comprises a substrate (S), a contact field (K), a chip (C), and a single-piece encapsulation (V). According to the invention, the encapsulation (V) has a thickness (dV) which ensures that, on insertion of the chip card (CC), the encapsulation (V) has body contact with the press-on device (AE), the contact field (K) has body contact with the device contacts (GK), and the contact field (K) is reliably electrically contacted to the device contacts (GK). No further carrier material (T) is provided.

Abstract: In a method of producing a transponder (T1, T2, T3), a substrate (1, 91) is provided. The substrate (9, 91) comprises a first area (2), a second area (3) adjacent to the first area (2), and a first electric contact (8, 98) adjacent to the second area (3). An electric device (50, 80) is placed in or on the first area (2), preferably without touching the first electric contact (8, 98). Subsequently, a conductive glue (12) is applied on the second area (3) and on the first electric contact (8, 98) so that the conductive glue (12) electrically couples the first electric contact (8, 98) with the electric device (50, 80).

Abstract: The invention relates to a device comprising a first electric contact (8, 98) and a substrate (1, 91). The first electric contact (8, 98) comprises a first area (10, 110) with a first wettability, and the substrate (1, 91) comprises a second area (3) with a second wettability and a third area (2) with a third wettability and being adjacent to the second area (2). The first electric contact (8, 98) is attached on the substrate (1, 91) so that the first area (10, 110) of the first electric contact (8, 98) is adjacent to the second area (3), and the second area (3) is located between the first area (10, 110) and the third area (2). The first and the second wettability are higher than the third wettability. The invention also relates to a transponder (T1, T2, T3) which comprises the substrate (1, 91), an electric device (50, 80) and an antenna (7, 93).

Abstract: In the case of a chip (1) having an integrated circuit (2), a dielectric mirror coating (3) having at least two dielectric layers (6, 7, . . . H, I, H) is applied as light protection means for the at least one integrated circuit (2) on at least one portion of the surface of the chip (1).