Abstract: One aspect of the present disclosure can include an interconnect system for bridging electrical contacts. The system can include a first electrical contact, a second electrical contact, and an interconnect device that is coupled to and extends between the first and second electrical contacts. The interconnect device can include a flexible bridge and a non-linear conductive transmission line. The flexible bridge can have a length and an outer surface. The non-linear conductive transmission line can extend along, and encircle at least a portion of, the length of the bridge such that the non-linear conductive transmission line electrically connects the first electrical contact with the second electrical contact.

Abstract: A cell layer measurement device includes a first zone, a second zone, and a porous membrane between the first and second zones. A tissue sample includes the cell layer on the porous membrane. A fluid is on at least a first side of the tissue. A fluid inflow line and fluid outflow line are on at least a first side of the tissue. At least one electrode measures a property of the fluid. A property of the cell layer is determined based on the measured property of the fluid.

Abstract: The present invention provides a thin and flexible device and method of use thereof for pain and wound treatment of a subject. The integrated surface stimulation device may comprise a complete wireless stimulation system in a disposable and/or reusable flexible device for widespread use in multiple therapeutic applications. The invention would be situated on the skin surface of a patient and would be activated so as to reduce the overall occurrence of pain and/or increase wound healing rates. As provided, the device will comprise an integrated power supply and pre-programmable stimulator/control system mounted on the upper face of a flexible polymeric substrate layer. The lower face of the substrate layer will comprise areas of stimulating electrodes, applied using thin film coating techniques. The device can then be applied to the user with a medical grade pressure sensitive adhesive coating provided on the lower face of the substrate layer.

Abstract: A method for forming an electrical-conductor-free vapor barrier suitable for protecting long-term implanted electronic systems is disclosed. The method comprises forming a nascent layer of a partially cured layer and repeatedly compressing the layer via a roller-based process. Once the layer has been suitably compressed, the layer is fully cured. In some embodiments, a multi-layer protective layer is formed by repeating the roller-based formation process for each of a plurality of layers. In some embodiments, a multi-layer protective layer comprising layers of different materials is formed.

Abstract: A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties.

Abstract: A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties.

Abstract: A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties.

Abstract: A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties.

Abstract: A method for molding high precision components is provided that allows inexpensive, rapid fabrication of components using a process involving a silicon substrate, in which the mold pattern is created using multiple mask layers, a deep reactive ion etch process and photolithographic patterning techniques.

Abstract: A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties.