Abstract: A method and an apparatus for beam analysis in an optical system are disclosed, wherein a plurality of beam parameters of a beam propagating along an optical axis are ascertained. The method includes: splitting the beam into a plurality of partial beams which have a focus offset in the longitudinal direction in relation to the optical axis; recording a measurement image produced by these partial beams; carrying out a forward simulation of the beam in the optical system on the basis of estimated initial values for the beam parameters in order to obtain a simulated image; and calculating a set of values for the beam parameters on the basis of the comparison between the simulated image and the measurement image.

Abstract: For three-dimensional imaging, an object is illuminated at a plurality of illumination angles. A detector detects a plurality of images of the object for the plurality of illumination angles. An electronic processing device processes the plurality of images in order to reconstruct three-dimensional information of the object.

Abstract: In detecting the structure of a lithography mask, a portion of the lithography mask is firstly illuminated with illumination light of an at least partially coherent light source in the at least one preferred illumination direction. A diffraction image of the illuminated portion is then recorded by spatially resolved detection of a diffraction intensity of the illumination light diffracted from the illuminated portion in a detection plane. The steps of “illuminating” and “recording the diffraction image” are then carried out for further portions of the lithography mask. Between at least two portions of the lithography mask that are thereby detected, there is in each case an overlap region whose surface extent measures at least 5% or more of the smaller of the two portions of the lithography mask. The repetition takes place until the detected portions of the lithography mask completely cover a region of the lithography mask to be detected.

Abstract: The present invention relates to an apparatus for analyzing an element of a photolithography process, said apparatus comprising: (a) a first measuring apparatus for recording first data of the element; and (b) means for transforming the first data into second, non-measured data, which correspond to measurement data of a measurement of the element with a second measuring apparatus; (c) wherein the means comprise a transformation model, which has been trained using a multiplicity of first data used for training purposes and second data corresponding therewith, which are linked to the second measuring apparatus.

Abstract: An object is illuminated sequentially using at least two illumination geometries. An intensity image of the object is captured for each one of the at least two illumination geometries. The intensity images are combined for producing a results image. Combining is carried out in such a way that the results image satisfies a predetermined optimization criterion. By way of example, the optimization criterion may relate to an image contrast, an edge steepness or an image sharpness. Optimization may be carried out with a spatial resolution.

Abstract: An object is illuminated from at least one illuminating direction. For each illuminating direction, an intensity image of the object is captured during the illumination. On the basis of the at least one intensity image, a phase contrast image of the object is generated.

Abstract: At least two images (201-1-201-3) of an object (100) are obtained, wherein each image has an illumination field (110-1-110-3) associated therewith, which is associated with predetermined beam shape properties (111-1-111-3). For each one of the at least two images (201-1-201-3) an effect of the beam shape properties is added to a predetermined approximation of the object, the approximation is adjusted by means of Fourier ptychography techniques on the basis of the respective image and then the effect of the beam shape properties is removed from the adapted approximation of the object.

Abstract: The invention relates to a method and an appliance for predicting the imaging result obtained with a mask when a lithography process is carried out, wherein the mask comprises mask structures to be imaged and the mask is destined to be illuminated in a lithography process in a projection exposure apparatus with a predetermined illumination setting for exposing a wafer comprising a photoresist.

Abstract: In order to modulate different spectral components of a light beam independently of one another, the light beam is split into a plurality of spectral components which can be modulated at different locations of a spatial light modulator.

Abstract: The invention relates to a contrast formation method, for generating a contrast image, including the steps: Illuminating an object by an illumination sequence based on one or more illumination sources; creating an illumination image of the object for each illumination in the illumination sequence; overlaying two respective illumination images which neighbor each other with respect to a first axis to form a first total axis image of the first axis; overlaying two respective illumination images which neighbor each other with respect to a second axis to form a second total axis image of the second axis; creating a first color gradient image based on the first total axis image; creating a second color gradient image based on the second total axis image; transforming the first color gradient image and the second color gradient image into a color space; and generating a contrast image, based on the transformed first color gradient image and the second color gradient image into the color space.

Abstract: In a method for three-dimensionally measuring a 3D aerial image in the region around an image plane during the imaging of a lithography mask, which is arranged in an object plane, a selectable imaging scale ratio in mutually perpendicular directions (x, y) is taken into account. For this purpose, an electromagnetic wavefront of imaging light is reconstructed after interaction thereof with the lithography mask. An influencing variable that corresponds to the imaging scale ratio is included. Finally, the 3D aerial image measured with the inclusion of the influencing variable is output. This results in a measuring method with which lithography masks that are optimized for being used with an anamorphic projection optical unit during projection exposure can also be measured.

Abstract: A confocally chromatic sensor for determining coordinates of two different determination locations of a measurement object.

Abstract: The invention relates to a reflection-reduced contrast imaging method and to a device for generating a reflection-reduced contrast image, preferably from microscopic images, in particular in order to read height progression information of a condition of an object.

Abstract: In a method for localizing defects on a substrate for EUV masks, a phase contrast optical unit having a phase mask is used for examining the substrate.

Abstract: In a method for three-dimensionally measuring a 3D aerial image in the region around an image plane during the imaging of a lithography mask, which is arranged in an object plane, a selectable imaging scale ratio in mutually perpendicular directions (x, y) is taken into account. For this purpose, an electromagnetic wavefront of imaging light is reconstructed after interaction thereof with the lithography mask. An influencing variable that corresponds to the imaging scale ratio is included. Finally, the 3D aerial image measured with the inclusion of the influencing variable is output. This results in a measuring method with which lithography masks that are optimized for being used with an anamorphic projection optical unit during projection exposure can also be measured.

Abstract: A method and an apparatus for beam analysis in an optical system are disclosed, wherein a plurality of beam parameters of a beam propagating along an optical axis are ascertained. The method includes: splitting the beam into a plurality of partial beams which have a focus offset in the longitudinal direction in relation to the optical axis; recording a measurement image produced by these partial beams; carrying out a forward simulation of the beam in the optical system on the basis of estimated initial values for the beam parameters in order to obtain a simulated image; and calculating a set of values for the beam parameters on the basis of the comparison between the simulated image and the measurement image.

Abstract: A confocally chromatic sensor for determining coordinates of two different determination locations of a measurement object.

Abstract: For three-dimensional imaging, an object is illuminated at a plurality of illumination angles. A detector detects a plurality of images (51-53) of the object for the plurality of illumination angles. An electronic processing device processes the plurality of images (51-53) in order to reconstruct three-dimensional information of the object (57).

Abstract: An object is illuminated from at least one illuminating direction. For each illuminating direction, an intensity image of the object is captured during the illumination. On the basis of the at least one intensity image, a phase contrast image of the object is generated.

Abstract: An object (100) is illuminated sequentially using at least two illumination geometries (110-1, 110-2). An intensity image of the object (100) is captured for each one of the at least two illumination geometries (110-1, 110-2). The intensity images are combined for producing a results image. Combining is carried out in such a way that the results image satisfies a predetermined optimization criterion. By way of example, the optimization criterion may relate to an image contrast, an edge steepness or an image sharpness. Optimization may be carried out with a spatial resolution.