Abstract: A heat exchanger for heating a fluid that exhibits simplified manufacturing, a reduced construction size, and/or an increased heating efficiency. The heat exchanger has at least two distanced tube bodies through which a flow path of the fluid leads. A thin-film resistor is applied on the outer surface of at least one of the tube bodies with an interface made of a thermal interface material located between the thick-film resistor and the next neighboring tube body.

Abstract: A heat exchanger for heating a fluid that exhibits simplified manufacturing, a reduced construction size, and/or an increased heating efficiency. The heat exchanger has at least two distanced tube bodies through which a flow path of the fluid leads. A thin-film resistor is applied on the outer surface of at least one of the tube bodies with an interface made of a thermal interface material located between the thick-film resistor and the next neighboring tube body.

Abstract: An electric power converter device may include first and second housings separated by a fluid-impermeable plate, at least one power electronics unit electrically connected to an electric power input and output, at least one fluid chamber fluidically connected to a fluid inlet and outlet, and at least one heater electrically connected to the electric power input and output, the fluid chamber and heater thermally coupled such that waste heat generated by the power electronics unit may be used to heat a fluid flowing through the fluid chamber. The electric power converter device may have first and second operation modes, the waste heat being increased in the second operation mode. The first housing and the plate may form a first space area in which the power electronics unit and the heater may be arranged, and the plate and the second chamber form the fluid chamber with a second space area.

Abstract: Methods and systems are described that include a differential amplifier driving an active load circuit, the active load circuit having a pair of load transistors and a high-frequency gain stage providing high frequency peaking for the active load circuit according to a frequency response characteristic determined in part by resistive values of a pair of active resistors connected, respectively, to gates of the pair of load transistors, and a bias circuit configured to stabilize the high frequency peaking of the high-frequency gain stage by generating a process-and-temperature variation (PVT)-dependent control voltage at gates of the active resistors to stabilize the resistive values of the pair of active resistors to account for PVT-dependent voltages at the gates of the pair of load transistors.

Abstract: The present disclosure relates to a power electronic device for a vehicle. The power electronic device includes at least one intermediate unit having at least one fluid duct system fluidically connected to a fluid inlet and a fluid outlet, at least one power electronic unit arranged at least at a surface of the at least one intermediate unit, and at least one heating device arranged at least at a surface of the at least one intermediate unit.

Abstract: A carrier for an optoelectronic component includes a main body, wherein the main body includes a first electrically conductive heating layer arrangement, a first solder layer for soldering an optoelectronic component to the main body is arranged on a first side of the main body, the first electrically conductive heating layer arrangement is electrically insulated from the first solder layer and thermally connected to the first solder layer, and the first heating layer arrangement has an exposed portion on which molten solder of the first solder layer can flow to reduce an electrical resistance of the first heating layer arrangement.

Abstract: The application relates to an appliance (1) for creating and monitoring a safety area (2) in a working space (3). The suggested appliance (1) comprises a recording device (4). The recording device (4) is configured to record images in a monitoring area (8) which encompasses the safety area (2). The appliance (1) further comprises an illumination device (5) which is configured to project lines or patterns which define the safety area (2), into the working space (3). Furthermore, the appliance (1) comprises an evaluation device (9) which is configured to evaluate the images which are recorded by the recording device (4), with respect to a violation of the safety area (2). The illumination device (5) is configured to project a temporally coded sequence (11, 11?, 11?, 11??, 11???) of the lines (6) or patterns into the working space (3).

Abstract: A production method for producing a heat exchanger assembly, which may serve for at least one of cooling and heating a functional component via a heat exchanger fluid, may include first providing a duct flat body, which may have a flow duct comprising a clear flow cross section, through which heat exchanger fluid may be flowable. The method then may include forming the duct flat body as part of a rolling process or as part of a roller burnishing process to form a bent cylinder jacket-shaped heat exchanger housing. The method then may include arranging the bent heat exchanger housing on a jacket surface of the functional component, and fixing the heat exchanger housing on the jacket surface of the functional component.

Abstract: An arrangement is disclosed. In an embodiment the arrangement includes at least one semiconductor component and a heat sink, wherein the semiconductor component is arranged on the heat sink, wherein the heat sink is configured to dissipate heat from the semiconductor component, wherein the heat sink comprises a thermally conductive material, and wherein the material comprises at least aluminum and silicon.

Abstract: The present disclosure relates to a power electronic device for a vehicle. The power electronic device includes at least one intermediate unit having at least one fluid duct system fluidically connected to a fluid inlet and a fluid outlet, at least one power electronic unit arranged at least at a surface of the at least one intermediate unit, and at least one heating device arranged at least at a surface of the at least one intermediate unit.

Abstract: The application relates to an appliance (1) for creating and monitoring a safety area (2) in a working space (3). The suggested appliance (1) comprises a recording device (4). The recording device (4) is configured to record images in a monitoring area (8) which encompasses the safety area (2). The appliance (1) further comprises an illumination device (5) which is configured to project lines or patterns which define the safety area (2), into the working space (3). Furthermore, the appliance (1) comprises an evaluation device (9) which is configured to evaluate the images which are recorded by the recording device (4), with respect to a violation of the safety area (2). The illumination device (5) is configured to project a temporally coded sequence (11, 11?, 11?, 11??, 11???) of the lines (6) or patterns into the working space (3).

Abstract: Methods and systems are described that include a differential amplifier driving an active load circuit, the active load circuit having a pair of load transistors and a high-frequency gain stage providing high frequency peaking for the active load circuit according to a frequency response characteristic determined in part by resistive values of a pair of active resistors connected, respectively, to gates of the pair of load transistors, and a bias circuit configured to stabilize the high frequency peaking of the high-frequency gain stage by generating a process-and-temperature variation (PVT)-dependent control voltage at gates of the active resistors to stabilize the resistive values of the pair of active resistors to account for PVT-dependent voltages at the gates of the pair of load transistors.

Abstract: A method of producing an optoelectronic component includes providing a carrier including a top side; creating at the top side of the carrier a region that is recessed with respect to a mounting region of the top side to form a step between the mounting region and the recessed region; arranging at the top side of the carrier a metallization extending over the mounting region and the recessed region; creating a separating track in the metallization, wherein the metallization is completely severed at least in sections in the mounting region and is at least not completely severed in the recessed region; and arranging an optoelectronic semiconductor chip above the mounting region of the top side, wherein the optoelectronic semiconductor chip is aligned at the separating track.

Abstract: Directing an electrostatic discharge received via a conductive pad through a multi-tap inductor having a signal path connecting the conductive pad to a signal processing circuit, the multi-tap inductor having a sequence of taps located at positions along a signal path from the conductive pad to the signal processing circuit, distributing the electrostatic discharge as a plurality of currents through the sequence of taps, wherein magnitudes of the plurality of currents are controlled by current-distribution resistors connected to respective taps of the sequence of taps, and dissipating the plurality of currents using a plurality of electrostatic discharge (ESD) circuits connected to the plurality of current-distribution resistors.

Abstract: A carrier for an optoelectronic component includes a main body, wherein the main body includes a first electrically conductive heating layer arrangement, a first solder layer for soldering an optoelectronic component to the main body is arranged on a first side of the main body, the first electrically conductive heating layer arrangement is electrically insulated from the first solder layer and thermally connected to the first solder layer, and the first heating layer arrangement has an exposed portion on which molten solder of the first solder layer can flow to reduce an electrical resistance of the first heating layer arrangement.

Abstract: A method of producing an optoelectronic component includes providing a carrier including a top side; creating at the top side of the carrier a region that is recessed with respect to a mounting region of the top side to form a step between the mounting region and the recessed region; arranging at the top side of the carrier a metallization extending over the mounting region and the recessed region; creating a separating track in the metallization, wherein the metallization is completely severed at least in sections in the mounting region and is at least not completely severed in the recessed region; and arranging an optoelectronic semiconductor chip above the mounting region of the top side, wherein the optoelectronic semiconductor chip is aligned at the separating track.

Abstract: The invention relates to a condenser, in particular a condenser cooled by a coolant, said condenser consisting of at least one tube/fin block having several flat tubes, each flat tube having a plurality of flow channels that extend adjacent to one another in the tube transverse direction and define a refrigerant-side hydraulic diameter (Dh refrigerant). At least one respective intermediate element defining a coolant-side hydraulic diameter (Dh coolant) is arranged in the region of the flat tubes. The condenser is characterized in that the ratio of the two hydraulic diameters (Dh coolant) to (Dh refrigerant) is greater than (>) 1.3.

Abstract: The invention relates to a condenser of stacked-plate design, having a first flow duct for a refrigerant and having a second flow duct for a coolant.

Abstract: An accumulator temperature control arrangement for a motor vehicle may include an electrical accumulator and a temperature control device for controlling a temperature of the accumulator. The temperature control device may include at least one temperature control element in heat-exchanging contact with an underside of the accumulator. A pressing element may be arranged on a side of the at least one temperature control element facing away from the underside. The pressing element may pretension the at least one temperature control element in a direction of the underside. The arrangement may include at least one bracing element arranged on the underside and faces the pressing element. The pressing element may include a clamping component corresponding to the at least one bracing element and which, together with the at least one bracing element, provide a bracing device that may pretension the pressing element in the direction of the underside.

Abstract: An arrangement is disclosed. In an embodiment the arrangement includes at least one semiconductor component and a heat sink, wherein the semiconductor component is arranged on the heat sink, wherein the heat sink is configured to dissipate heat from the semiconductor component, wherein the heat sink comprises a thermally conductive material, and wherein the material comprises at least aluminum and silicon.