Patents by Inventor Christopher Andrew Bower

Christopher Andrew Bower has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240105698
    Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.
    Type: Application
    Filed: December 7, 2023
    Publication date: March 28, 2024
    Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
  • Publication number: 20240071801
    Abstract: A printable-component structure includes a carrier substrate, a bonding layer disposed on the carrier substrate, a solid weak-adhesion layer disposed on at least a portion of the bonding layer, at least a portion of a component disposed directly on and in contact with at least a portion of the weak-adhesion layer, and a release layer disposed in contact with at least a portion of the component. The component is adhered to the weak-adhesion layer with a force that is less than the adhesion between the component and a stamp, such as a PDMS stamp. The component can include a protruding post in sole contact with the weak-adhesion layer.
    Type: Application
    Filed: August 29, 2022
    Publication date: February 29, 2024
    Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Nikhil Jain, Ronald S. Cok
  • Publication number: 20240066905
    Abstract: A micro-transfer structure comprises a stamp comprising a rigid support, only a single contiguous bulk layer disposed on the rigid support, and posts disposed on the bulk layer. Components are adhered to (e.g., disposed in contact with) some but not all of the posts. The posts can be substantially identical and disposed in a regular array on the bulk layer. Each component is adhered to (e.g., in contact with) two or more posts. Components can be disposed on a source wafer entirely over sacrificial portions of a sacrificial layer on or in the source wafer and attached to anchors disposed between sacrificial portions with a tether.
    Type: Application
    Filed: November 7, 2023
    Publication date: February 29, 2024
    Inventors: Tanya Yvette Moore, David Gomez, Christopher Andrew Bower, Matthew Alexander Meitl, Salvatore Bonafede
  • Patent number: 11916179
    Abstract: A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: February 27, 2024
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Andrew Bower, Ronald S. Cok
  • Patent number: 11916174
    Abstract: An interpolated flat-panel display comprises a display substrate, pixel controllers disposed in a controller array over the display substrate, and pixels disposed in a pixel array over the display substrate. Each pixel controller is connected to one or more control lines and is operable to output pixel information. Each pixel is operable to emit light in response to pixel information received from a pixel controller. The pixel array is larger than the controller array, each pixel is connected to at least one pixel controller, and at least some pixels are interpolated pixels connected to at least two pixel controllers and are operable to emit light in response to pixel information received from the at least two pixel controllers.
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: February 27, 2024
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Andrew Bower, Ronald S. Cok, Matthew Alexander Meitl
  • Publication number: 20240063161
    Abstract: An electrical conductor structure comprises a substrate and an electrical conductor disposed on or in the substrate. The electrical conductor comprises a first layer and a second layer disposed on a side of the first layer opposite the substrate. The first layer comprises a first electrical conductor that forms a non-conductive layer on a surface of the first electrical conductor when exposed to air and the second layer comprising a second electrical conductor that does not form a non-conductive layer on a surface of the second electrical conductor when exposed to air. A component comprises a connection post that is electrically connected to the second layer and the electrical conductor. The first and second layers can be inorganic. The first layer can comprise a metal such as aluminum and the second layer can comprise an electrically conductive metal oxide such as indium tin oxide.
    Type: Application
    Filed: November 3, 2023
    Publication date: February 22, 2024
    Applicant: X Display Company Technology Limited
    Inventors: Christopher Andrew Bower, Matthew Alexander Meitl
  • Patent number: 11890890
    Abstract: A light-emitting module structure comprises a support substrate and a micro-module disposed on or in the support substrate that extends over only a portion of the support substrate. The micro-module comprises a rigid module substrate, an inorganic light-emitting diode, a power source, and a control circuit. The inorganic light-emitting diode, the power source, and the control circuit are disposed on or in the module substrate and the control circuit receives power from the power source to control the inorganic light-emitting diode to emit light. A light conductor is disposed on or in the support substrate and in alignment with the micro-module so that the inorganic light-emitting diode is disposed to emit light into the light conductor and the light conductor conducts the light beyond the micro-module to emit the light from the light conductor.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: February 6, 2024
    Assignee: X Display Company Technology Limited
    Inventors: Mark Willner, Ronald S. Cok, Robert R. Rotzoll, Christopher Andrew Bower
  • Publication number: 20240038150
    Abstract: A flat-panel display comprises a display substrate, an array of pixels distributed in rows and columns over the display substrate, the array having a column-control side, and column controller disposed on the column-control side of the array providing column data to the array of pixels through column-data lines. In some embodiments, rows of pixels in the array of pixels form row groups and each column of pixels in a row group receives column data through a separate column-data line. In some embodiments, each pixel in each column of pixels in the array of pixels is serially connected and each pixel in the array of pixels comprises a token-passing circuit for passing a token through the serially connected column of pixels.
    Type: Application
    Filed: October 10, 2023
    Publication date: February 1, 2024
    Inventors: Ronald S. Cok, Christopher Andrew Bower
  • Publication number: 20240030370
    Abstract: An electro-optically controlled active-matrix system comprises a system substrate, row wires extending in a row direction disposed on the system substrate, a row controller providing a row electrical signal to each row wire, column light-pipes extending in a column direction disposed on the system substrate, a column controller providing a column optical signal to each column light-pipe, and pixels disposed over the system substrate. Each pixel can comprise a pixel circuit that is uniquely responsive to a row wire and to a column light-pipe, the pixel circuit receiving the row electrical signal from the row wire and receiving the column optical signal from the column light-pipe. In some embodiments, column wires carrying column electrical signals extend in a column direction over the system substrate and the pixel circuit is capacitively coupled to the row wire, the column wire, or both.
    Type: Application
    Filed: July 13, 2023
    Publication date: January 25, 2024
    Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Robert R. Rotzoll, Ronald S. Cok
  • Patent number: 11881475
    Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: January 23, 2024
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
  • Publication number: 20240014129
    Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.
    Type: Application
    Filed: September 26, 2023
    Publication date: January 11, 2024
    Applicant: X Display Company Technology Limited
    Inventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
  • Patent number: 11854855
    Abstract: An example of a method of micro-transfer printing comprises providing a micro-transfer printable component source wafer, providing a stamp comprising a body and spaced-apart posts, and providing a light source for controllably irradiating each of the posts with light through the body. Each of the posts is contacted to a component to adhere the component thereto. The stamp with the adhered components is removed from the component source wafer. The selected posts are irradiated through the body with the light to detach selected components adhered to selected posts from the selected posts, leaving non-selected components adhered to non-selected posts. In some embodiments, using the stamp, the selected components are adhered to a provided destination substrate. In some embodiments, the selected components are discarded. An example micro-transfer printing system comprises a stamp comprising a body and spaced-apart posts and a light source for selectively irradiating each of the posts with light.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: December 26, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Erich Radauscher, Ronald S. Cok, Christopher Andrew Bower, Matthew Alexander Meitl, James O. Thostenson
  • Patent number: 11850874
    Abstract: A micro-transfer structure comprises a stamp comprising a rigid support, only a single contiguous bulk layer disposed on the rigid support, and posts disposed on the bulk layer. Components are adhered to (e.g., disposed in contact with) some but not all of the posts. The posts can be substantially identical and disposed in a regular array on the bulk layer. Each component is adhered to (e.g., in contact with) two or more posts. Components can be disposed on a source wafer entirely over sacrificial portions of a sacrificial layer on or in the source wafer and attached to anchors disposed between sacrificial portions with a tether.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: December 26, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Tanya Yvette Moore, David Gomez, Christopher Andrew Bower, Matthew Alexander Meitl, Salvatore Bonafede
  • Patent number: 11855026
    Abstract: An electrical conductor structure comprises a substrate and an electrical conductor disposed on or in the substrate. The electrical conductor comprises a first layer and a second layer disposed on a side of the first layer opposite the substrate. The first layer comprises a first electrical conductor that forms a non-conductive layer on a surface of the first electrical conductor when exposed to air and the second layer comprising a second electrical conductor that does not form a non-conductive layer on a surface of the second electrical conductor when exposed to air. A component comprises a connection post that is electrically connected to the second layer and the electrical conductor. The first and second layers can be inorganic. The first layer can comprise a metal such as aluminum and the second layer can comprise an electrically conductive metal oxide such as indium tin oxide.
    Type: Grant
    Filed: October 5, 2022
    Date of Patent: December 26, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Andrew Bower, Matthew Alexander Meitl
  • Patent number: 11817434
    Abstract: A display comprises a transparent polymer support, an array of light emitters embedded in the support, and a redistribution layer. Each light emitter comprises electrode contacts that are substantially coplanar with a back surface of the support and emits light through a front surface of the support opposite the back surface when provided with power through the electrode contacts. The redistribution layer comprises a dielectric layer that is disposed on and in contact with the support back surface and distribution contacts that extend through the dielectric layer. Each of the distribution contacts is electrically connected to an electrode contact and is at least partially exposed.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: November 14, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Glenn Arne Rinne, Justin Walker Brown, Ronald S. Cok
  • Patent number: 11817040
    Abstract: A flat-panel display comprises a display substrate, an array of pixels distributed in rows and columns over the display substrate, the array having a column-control side, and column controller disposed on the column-control side of the array providing column data to the array of pixels through column-data lines. In some embodiments, rows of pixels in the array of pixels form row groups and each column of pixels in a row group receives column data through a separate column-data line. In some embodiments, each pixel in each column of pixels in the array of pixels is serially connected and each pixel in the array of pixels comprises a token-passing circuit for passing a token through the serially connected column of pixels.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: November 14, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Ronald S. Cok, Christopher Andrew Bower
  • Patent number: 11804431
    Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: October 31, 2023
    Assignee: Display Company Technology Limited
    Inventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
  • Publication number: 20230343630
    Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.
    Type: Application
    Filed: April 27, 2023
    Publication date: October 26, 2023
    Inventors: Christopher Andrew Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond, Carl Ray Prevatte, Jr.
  • Patent number: 11799061
    Abstract: A method of making a display structure comprises providing a display substrate having a display surface, disposing components on and in contact with the display surface, uniformly blanket coating the display surface with a curable layer of uncured light-absorbing material, and curing the curable layer of uncured light-absorbing material to provide a layer of cured light-absorbing material so that the components project from the layer of cured light-absorbing material without having pattern-wise etched the layer of cured light-absorbing material after the light-absorbing material has been cured. The uniform blanket coating has a thickness greater than a thickness of the component, disposing the components comprises printing the components through the uniform blanket coating such that the components protrude from the uniform blanket coating, or the component is coated with a de-wetting material.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: October 24, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Glenn Arne Rinne, Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok
  • Publication number: 20230290763
    Abstract: A hybrid-control pixel includes a TFT substrate, a TFT circuit formed on the TFT substrate, a micro-device having an integrated-circuit substrate separate and independent from the TFT substrate disposed on or over the TFT substrate, a micro-circuit electrically connected to the TFT circuit, and an LED or other device disposed on the integrated circuit or the TFT substrate. The LED can be electrically connected to the micro-circuit and the TFT circuit and the micro-circuit together control the LED.
    Type: Application
    Filed: June 23, 2022
    Publication date: September 14, 2023
    Inventors: Matthew Alexander Meitl, Christopher Andrew Bower, Ronald S. Cok, Murat Ozbas