Patents by Inventor Christopher Andrew Bower

Christopher Andrew Bower has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230343630
    Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.
    Type: Application
    Filed: April 27, 2023
    Publication date: October 26, 2023
    Inventors: Christopher Andrew Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond, Carl Ray Prevatte, Jr.
  • Patent number: 11799061
    Abstract: A method of making a display structure comprises providing a display substrate having a display surface, disposing components on and in contact with the display surface, uniformly blanket coating the display surface with a curable layer of uncured light-absorbing material, and curing the curable layer of uncured light-absorbing material to provide a layer of cured light-absorbing material so that the components project from the layer of cured light-absorbing material without having pattern-wise etched the layer of cured light-absorbing material after the light-absorbing material has been cured. The uniform blanket coating has a thickness greater than a thickness of the component, disposing the components comprises printing the components through the uniform blanket coating such that the components protrude from the uniform blanket coating, or the component is coated with a de-wetting material.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: October 24, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Glenn Arne Rinne, Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok
  • Publication number: 20230290763
    Abstract: A hybrid-control pixel includes a TFT substrate, a TFT circuit formed on the TFT substrate, a micro-device having an integrated-circuit substrate separate and independent from the TFT substrate disposed on or over the TFT substrate, a micro-circuit electrically connected to the TFT circuit, and an LED or other device disposed on the integrated circuit or the TFT substrate. The LED can be electrically connected to the micro-circuit and the TFT circuit and the micro-circuit together control the LED.
    Type: Application
    Filed: June 23, 2022
    Publication date: September 14, 2023
    Inventors: Matthew Alexander Meitl, Christopher Andrew Bower, Ronald S. Cok, Murat Ozbas
  • Patent number: 11742450
    Abstract: An electro-optically controlled active-matrix system comprises a system substrate, row wires extending in a row direction disposed on the system substrate, a row controller providing a row electrical signal to each row wire, column light-pipes extending in a column direction disposed on the system substrate, a column controller providing a column optical signal to each column light-pipe, and pixels disposed over the system substrate. Each pixel can comprise a pixel circuit that is uniquely responsive to a row wire and to a column light-pipe, the pixel circuit receiving the row electrical signal from the row wire and receiving the column optical signal from the column light-pipe. In some embodiments, column wires carrying column electrical signals extend in a column direction over the system substrate and the pixel circuit is capacitively coupled to the row wire, the column wire, or both.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: August 29, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Robert R. Rotzoll, Ronald S. Cok
  • Patent number: 11742471
    Abstract: A method of making a surface-mountable pixel engine package comprises providing an array of spaced-apart conductive pillars and an insulating mold compound laterally disposed between the conductive pillars on a substrate together defining a planarized surface. Pixel engines comprising connection posts are printed to the conductive pillars so that each of the connection posts is in electrical contact with one of the conductive pillars. The pixel engines are tested to determine known-good pixel engines. An optically clear mold compound is provided over the planarized surface and tested pixel engines. Optically clear mold compound is adhered to a tape and the substrate is removed. The optically clear mold compound, the insulating mold compound, the conductive pillars, the optically clear mold compound, and the tested pixel engines are singulated to provide pixel packages that comprise the pixel engines and the known-good pixel engines are transferred to a reel or tray.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: August 29, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Glenn Arne Rinne, Justin Walker Brown
  • Patent number: 11705439
    Abstract: A multi-color LED display comprises pixels, each comprising a first sub-pixel, a second sub-pixel, and a third sub-pixel. The first sub-pixel comprises a first light-emitting diode (LED) that emits a first color of light, the second sub-pixel comprises second LEDs that emit a second color of light different from the first color of light, and the third sub-pixel comprises third LEDs that emit a third color of light different from the first color of light and different from the second color of light. The second LEDs are electrically connected in parallel and the third LEDs are electrically connected in series.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: July 18, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Matthew Alexander Meitl, Christopher Andrew Bower, Ronald S. Cok, Brook Raymond
  • Publication number: 20230222960
    Abstract: A pixel with a color-agnostic repair site includes a pixel controller, a first site for a first light emitter electrically connected to the pixel controller with a first wire, a second site for a second light emitter electrically connected to the pixel controller with a second wire different from the first wire, and a repair site for a repair light emitter. A repair wire can independently electrically connect the repair site to the pixel controller. A repair wire can electrically connect the repair site to the first wire or to the second wire with a jumper. The repair site can electrically connect to the first wire or to the second wire. A first repair wire can electrically connect the repair site to the first wire, a second repair wire can electrically connect the repair site to the second wire, and one of these wires can be cut.
    Type: Application
    Filed: January 7, 2022
    Publication date: July 13, 2023
    Inventors: Nikhil Jain, Ronald S. Cok, Christopher Andrew Bower
  • Publication number: 20230217598
    Abstract: A device source wafer includes a wafer substrate, devices formed on or in the wafer substrate at a location on the wafer substrate, and test structures disposed on the wafer substrate connected to some but not all of the devices. The devices include a first device disposed at a first location and a second device disposed at a second different location on the wafer substrate. The test structures include at least a first test structure connected to the first device and a second test structure connected to the second device. The first test structure is adapted to measuring a characteristic of the first device and the second test structure is adapted to measuring the characteristic of the second device. An estimated characteristic of unmeasured devices is derived from the first and second device locations and measured characteristics and the device is selected based on the estimated characteristic.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Inventors: Matthew Alexander Meitl, Ronald S. Cok, Christopher Andrew Bower
  • Patent number: 11670533
    Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: June 6, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Andrew Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond, Carl Ray Prevatte, Jr.
  • Publication number: 20230154390
    Abstract: A current-selectable light-emitting-diode (LED) display includes pixels distributed in an array of rows and columns. The pixels are grouped in mutually exclusive clusters and cluster controllers are connected to each pixel in a cluster of pixels to control the pixels in the cluster to emit light. Each cluster controller comprises a selectable current source. Each of the selectable current sources can include cluster current sources that are responsive to a current-select signal to enable one or more of the cluster current sources. The pixels can include micro-LEDs and the cluster controller can be disposed between the micro-LEDs. The display can be disposed on a display substrate with signal wires. The signal wires can include separate wire segments that are electrically connected through regeneration circuits that regenerate the signals. The display can be an information display or a backlight.
    Type: Application
    Filed: November 15, 2022
    Publication date: May 18, 2023
    Inventors: Murat Ozbas, Matthew Alexander Meitl, Christopher Andrew Bower, Lee B. Baker, Robert R. Rotzoll, Mike C. Chiu, Ronald S. Cok
  • Publication number: 20230132981
    Abstract: An interpolated flat-panel display comprises a display substrate, pixel controllers disposed in a controller array over the display substrate, and pixels disposed in a pixel array over the display substrate. Each pixel controller is connected to one or more control lines and is operable to output pixel information. Each pixel is operable to emit light in response to pixel information received from a pixel controller. The pixel array is larger than the controller array, each pixel is connected to at least one pixel controller, and at least some pixels are interpolated pixels connected to at least two pixel controllers and are operable to emit light in response to pixel information received from the at least two pixel controllers.
    Type: Application
    Filed: December 22, 2022
    Publication date: May 4, 2023
    Inventors: Christopher Andrew Bower, Ronald S. Cok, Matthew Alexander Meitl
  • Publication number: 20230091571
    Abstract: An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.
    Type: Application
    Filed: November 14, 2022
    Publication date: March 23, 2023
    Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Brook Raymond, Salvatore Bonafede
  • Patent number: 11600744
    Abstract: A transfer-printable (e.g., micro-transfer-printable) device source wafer comprises a growth substrate comprising a growth material, a plurality of device structures comprising one or more device materials different from the growth material, the device structures disposed on and laterally spaced apart over the growth substrate, each device structure comprising a device, and a patterned dissociation interface disposed between each device structure of the plurality of device structures and the growth substrate. The growth material is more transparent to a desired frequency of electromagnetic radiation than at least one of the one or more device materials. The patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and a device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and the device structure of the plurality of device structures.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: March 7, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Brook Raymond, Christopher Andrew Bower, Matthew Meitl, Ronald S. Cok
  • Patent number: 11588075
    Abstract: An interpolated flat-panel display comprises a display substrate, pixel controllers disposed in a controller array over the display substrate, and pixels disposed in a pixel array over the display substrate. Each pixel controller is connected to one or more control lines and is operable to output pixel information. Each pixel is operable to emit light in response to pixel information received from a pixel controller. The pixel array is larger than the controller array, each pixel is connected to at least one pixel controller, and at least some pixels are interpolated pixels connected to at least two pixel controllers and are operable to emit light in response to pixel information received from the at least two pixel controllers.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: February 21, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Andrew Bower, Ronald S. Cok, Matthew Alexander Meitl
  • Publication number: 20230037480
    Abstract: A current-selectable light-emitting-diode (LED) display includes pixels distributed in an array of rows and columns. The pixels are grouped in mutually exclusive clusters and cluster controllers are connected to each pixel in a cluster of pixels to control the pixels in the cluster to emit light. Each cluster controller comprises a selectable current source. Each of the selectable current sources can include cluster current sources that are responsive to a current-select signal to enable one or more of the cluster current sources. The pixels can include micro-LEDs and the cluster controller can be disposed between the micro-LEDs. The display can be disposed on a display substrate with signal wires. The signal wires can include separate wire segments that are electrically connected through regeneration circuits that regenerate the signals. The display can be an information display or a backlight.
    Type: Application
    Filed: July 29, 2021
    Publication date: February 9, 2023
    Inventors: Murat Ozbas, Matthew Alexander Meitl, Christopher Andrew Bower, Lee B. Baker, Robert R. Rotzoll, Mike C. Chiu, Ronald S. Cok
  • Patent number: 11568796
    Abstract: A current-selectable light-emitting-diode (LED) display includes pixels distributed in an array of rows and columns. The pixels are grouped in mutually exclusive clusters and cluster controllers are connected to each pixel in a cluster of pixels to control the pixels in the cluster to emit light. Each cluster controller comprises a selectable current source. Each of the selectable current sources can include cluster current sources that are responsive to a current-select signal to enable one or more of the cluster current sources. The pixels can include micro-LEDs and the cluster controller can be disposed between the micro-LEDs. The display can be disposed on a display substrate with signal wires. The signal wires can include separate wire segments that are electrically connected through regeneration circuits that regenerate the signals. The display can be an information display or a backlight.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: January 31, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Murat Ozbas, Matthew Alexander Meitl, Christopher Andrew Bower, Lee B. Baker, Robert R. Rotzoll, Mike C. Chiu, Ronald S. Cok
  • Patent number: 11569425
    Abstract: A method of making a surface-mountable pixel engine package comprises providing an array of spaced-apart conductive pillars and an insulating mold compound laterally disposed between the conductive pillars on a substrate together defining a planarized surface. Pixel engines comprising connection posts are printed to the conductive pillars so that each of the connection posts is in electrical contact with one of the conductive pillars. The pixel engines are tested to determine known-good pixel engines. An optically clear mold compound is provided over the planarized surface and tested pixel engines. Optically clear mold compound is adhered to a tape and the substrate is removed. The optically clear mold compound, the insulating mold compound, the conductive pillars, the optically clear mold compound, and the tested pixel engines are singulated to provide pixel packages that comprise the pixel engines and the known-good pixel engines are transferred to a reel or tray.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: January 31, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Glenn Arne Rinne, Justin Walker Brown
  • Publication number: 20230024488
    Abstract: An electrical conductor structure comprises a substrate and an electrical conductor disposed on or in the substrate. The electrical conductor comprises a first layer and a second layer disposed on a side of the first layer opposite the substrate. The first layer comprises a first electrical conductor that forms a non-conductive layer on a surface of the first electrical conductor when exposed to air and the second layer comprising a second electrical conductor that does not form a non-conductive layer on a surface of the second electrical conductor when exposed to air. A component comprises a connection post that is electrically connected to the second layer and the electrical conductor. The first and second layers can be inorganic. The first layer can comprise a metal such as aluminum and the second layer can comprise an electrically conductive metal oxide such as indium tin oxide.
    Type: Application
    Filed: October 5, 2022
    Publication date: January 26, 2023
    Inventors: Christopher Andrew Bower, Matthew Alexander Meitl
  • Patent number: 11540398
    Abstract: An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: December 27, 2022
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Brook Raymond, Salvatore Bonafede
  • Patent number: 11528808
    Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: December 13, 2022
    Assignee: X Display Company Technology Limited
    Inventors: David Gomez, Christopher Andrew Bower, Raja Fazan Gul, António José Marques Trindade, Ronald S. Cok