Abstract: A semiconductor device is disclosed. The semiconductor device includes one or more charge control electrodes a plurality of charge control electrodes. The one or more charge control electrodes may control the electric field within the drift region of a semiconductor device.

Abstract: A semiconductor device is disclosed. The semiconductor device includes one or more charge control electrodes a plurality of charge control electrodes. The one or more charge control electrodes may control the electric field within the drift region of a semiconductor device.

Abstract: A semiconductor device is disclosed. The semiconductor device includes one or more charge control electrodes a plurality of charge control electrodes. The one or more charge control electrodes may control the electric field within the drift region of a semiconductor device.

Abstract: An integrated circuit device includes a semiconductor layer of a first conductivity type, a plurality of spaced apart semiconductor pillars extending outwardly from said semiconductor layer and defining trenches therebetween, a respective gate structure in each trench, and at least one deep well region having the second conductivity type and being positioned to extend in the semiconductor layer between an adjacent pair of corresponding semiconductor pillars and beneath a bottom of at least one trench defining therein at least one inactive gate structure. The at least one deep well region may be positioned so that at least one trench does not include a deep well region therebeneath to define at least one active gate structure. Each semiconductor pillar may be of a second conductivity type opposite the first conductivity type.

Abstract: The resistance to current flow through an MOS-gated semiconductor device is reduced by providing a high conductivity region in the path of current through the drain region, but so positioned relative to the p-n voltage blocking junction of the device so as not to adversely affect the voltage blocking capability of the p-n junction. In one embodiment, the drain region is made of higher than normal electrical conductivity, but a diffused, graded p-n junction is provided for extending the low conductivity portion of the drain region bordering the p-n junction further than usual into the drain region.

Abstract: In the manufacture of an MOS gated semiconductor device, indentations are provided on a surface of a semiconductor wafer extending inwardly of respective spaced apart regions at the wafer surface having doping concentrations greater than that present in the remainder of the wafer. A layer of silicon having a doping concentration less than that of the substrate is conformally provided on the substrate surface whereby the indentations in the substrate surface are replicated on the surface of the silicon layer. Dopants in the substrate regions are then out-diffused into the silicon layer to provide highly doped buried regions within the layer. Then, using the silicon layer surface indentations as photomask alignment marks, gate electrode structures are formed on and within the silicon layer in preselected orientation relative to the buried regions. The buried regions provide low resistance paths for current through the resulting devices.

Abstract: A gate electrode control structure of an MOS-gated semiconductor device includes four doped regions including a first (source) region forming a first P-N junction with an enclosing composite region comprising a second, lightly doped (channel) region wholly enclosing a third heavily doped (body) region partly enclosing the first region, and a fourth (drain) region forming a P-N junction with the third region. The gate electrode control structure is fabricated using known gate electrode self-alignment doping processes but wherein, in the process for forming the third heavily doped region, a spacer layer is provided on the gate electrode for defining a spacing between the third region and the channel region with an improved degree of precision.