Patents by Inventor Christopher Colin Arp

Christopher Colin Arp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BOND PATTERN
    Publication number: 20230233384
    Abstract: A composite includes a first substrate and a second substrate joined in a bonding region, wherein the first substrate comprises a first Peak Force Tensile Strength and the second Peak Force Tensile Strength. The first Peak Force Tensile Strength is greater than or equal to the second Peak Force Tensile Strength. The bonding region has a Bond Density of about 10% to about 22%; and a Composite Tensile Strength at Peak Force that is within about 15% of the second Peak Force Tensile Strength.
    Type: Application
    Filed: March 29, 2023
    Publication date: July 27, 2023
    Inventors: Ray Dennis DRIA, Michael Joseph PAGE, Joseph Leslie GROLMES, Scott Alan KING, Matthew Steven RITTER, Christopher Colin ARP
  • Bond pattern
    Patent number: 11642255
    Abstract: A composite includes a first substrate and a second substrate joined in a bonding region, wherein the first substrate comprises a first Peak Force Tensile Strength and the second Peak Force Tensile Strength. The first Peak Force Tensile Strength is greater than or equal to the second Peak Force Tensile Strength. The bonding region has a Bond Density of about 10% to about 22%; and a Composite Tensile Strength at Peak Force that is within about 15% of the second Peak Force Tensile Strength.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: May 9, 2023
    Assignee: THE PROCTER & GAMBLE COMPANY
    Inventors: Ray Dennis Dria, Michael Joseph Page, Joseph Leslie Grolmes, Scott Alan King, Matthew Steven Ritter, Christopher Colin Arp
  • BOND PATTERN
    Publication number: 20190290504
    Abstract: A composite includes a first substrate and a second substrate joined in a bonding region, wherein the first substrate comprises a first Peak Force Tensile Strength and the second Peak Force Tensile Strength. The first Peak Force Tensile Strength is greater than or equal to the second Peak Force Tensile Strength. The bonding region has a Bond Density of about 10% to about 22%; and a Composite Tensile Strength at Peak Force that is within about 15% of the second Peak Force Tensile Strength.
    Type: Application
    Filed: March 19, 2019
    Publication date: September 26, 2019
    Inventors: Ray Dennis DRIA, Michael Joseph Page, Joseph Leslie Grolmes, Scott Alan King, Matthew Steven Ritter, Christopher Colin Arp
  • Bond pattern for substrate
    Patent number: D973200
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: December 20, 2022
    Assignee: The Procter & Gamble Company
    Inventors: Ray Dennis Dria, Michael Joseph Page, Joseph Leslie Grolmes, Scott Alan King, Matthew Steven Ritter, Christopher Colin Arp