Bond pattern for substrate

Info

Patent number: D1031026
Type: Grant
Filed: Nov 8, 2022
Date of Patent: Jun 11, 2024
Assignee: The Procter & Gamble Company (Cincinnati, OH)
Inventors: Ray Dennis Dria (Mason, OH), Michael Joseph Page (Cincinnati, OH), Joseph Leslie Grolmes (Madeira, OH), Scott Alan King (Liberty Township, OH), Matthew Steven Ritter (Liberty Township, OH), Christopher Colin Arp (Mason, OH)
Primary Examiner: Samantha Q Lawrence
Application Number: 29/859,142

Description

Description

FIG. 1 is a perspective view of a bond pattern for a substrate;

FIG. 2 is a view of the front side of the bond pattern for a substrate of FIG. 1;

FIG. 3 is a view of the right side of the bond pattern for a substrate of FIG. 1;

FIG. 4 is a view of the back side of the bond pattern for a substrate of FIG. 1;

FIG. 5 is a view of the left side of the bond pattern for a substrate of FIG. 1;

FIG. 6 is a view of the top side of the bond pattern for a substrate of FIG. 1; and,

FIG. 7 is a view of the bottom side of the bond pattern for a substrate of FIG. 1.

The broken lines are included for the purpose of illustrating environment and form no part of the claimed design.

Claims

The ornamental design for the bond pattern for a substrate, as shown and described above.