Abstract: A system and method automatically repairs a reference corresponding to a missing constraint of a component feature in a computer aided drafting (CAD) environment. A first component is identified where the reference indicates the missing component feature belongs. A solid or surface body of the first component is identified. A candidate replacement feature of the first solid or surface body is identified. The candidate replacement feature is compared with the missing feature. If the candidate comparison meets a predetermined criteria, the missing constraint reference is replaced with a reference to the candidate replacement feature.

Abstract: A system and method automatically repairs a reference corresponding to a missing constraint of a tessellated component feature in a computer aided drafting (CAD) environment. A first component is identified where the reference indicates the missing component feature belongs. A solid or surface body of the first component is identified. A candidate replacement feature of the first solid or surface body is identified. The candidate replacement feature is compared with the missing feature. If the candidate comparison meets a predetermined criteria, the missing constraint reference is replaced with a reference to the candidate replacement feature.

Abstract: A batch scheduler receives a task. Further, a processor, at the batch scheduler, generates a virtual machine corresponding to the task. In addition, the virtual machine is deployed from the batch scheduler to a compute node. The task is also dispatched from the batch scheduler to the virtual machine at the compute node.

Abstract: A server receives a first set of file activity data from a first file monitor. The first set of file activity data indicates activity associated with a first set of files accessed at a first compute node in communication with a network. Further, the server receives a second set of file activity data from a second file monitor. The second set of file activity data indicates activity associated with a second set of files accessed at a second compute node in communication with the network. In addition, the server aggregates the first set of file activity data and the second set of file activity data into an aggregated set of network file activity data.

Abstract: A request from a client to perform a task is received. The client has a predetermined limit of compute resources. The task is dispatched from a batch scheduler to a compute node as a non-speculative task if a quantity of compute resources is available at the compute node to process the task, and the quantity of compute resources in addition to a total quantity of compute resources being utilized by the client is less than or equal to the predetermined limit, such that the non-speculative task is processed without being preempted by an additional task requested by an additional client. The task is dispatched, from the batch scheduler to the compute node, as a speculative task if the quantity of compute resources is available to process the task, and the quantity of compute resources in addition to the total quantity of compute resources is greater than the predetermined limit.

Abstract: A resource broker determines availability of a portion of a set of compute resources in real-time. The set of compute resources is assigned as a priority to a master process. Further, the resource broker assigns the portion of the set of compute resources to an auxiliary process if the portion of the set of compute resources is available. In addition, the resource broker determines that the master process is attempting to utilize the portion of the set of compute resources. The resource broker also assigns the portion of the set of compute resources to the master process from the auxiliary process without an interruption that exceeds a predetermined time threshold of processing being performed by the master process.

Abstract: A batch scheduler receives a task. Further, a processor, at the batch scheduler, generates a virtual machine corresponding to the task. In addition, the virtual machine is deployed from the batch scheduler to a compute node. The task is also dispatched from the batch scheduler to the virtual machine at the compute node.

Abstract: A request from a client to perform a task is received. The client has a predetermined limit of compute resources. The task is dispatched from a batch scheduler to a compute node as a non-speculative task if a quantity of compute resources is available at the compute node to process the task, and the quantity of compute resources in addition to a total quantity of compute resources being utilized by the client is less than or equal to the predetermined limit, such that the non-speculative task is processed without being preempted by an additional task requested by an additional client. The task is dispatched, from the batch scheduler to the compute node, as a speculative task if the quantity of compute resources is available to process the task, and the quantity of compute resources in addition to the total quantity of compute resources is greater than the predetermined limit.

Abstract: A server receives a first set of file activity data from a first file monitor. The first set of file activity data indicates activity associated with a first set of files accessed at a first compute node in communication with a network. Further, the server receives a second set of file activity data from a second file monitor. The second set of file activity data indicates activity associated with a second set of files accessed at a second compute node in communication with the network. In addition, the server aggregates the first set of file activity data and the second set of file activity data into an aggregated set of network file activity data.

Abstract: The present invention provides a method and an apparatus for etching a photolithographic substrate. The photolithographic substrate is placed on a support member in a vacuum chamber. A processing gas for etching a material from the photolithographic substrate is introduced into the vacuum chamber, and a plasma is generated. An RF bias is supplied to the support member in the vacuum chamber through an RF bias frequency generator at or below the ion transit frequency. Exposed material is etched from the photolithographic substrate with improved CD Etch Linearity and CD Etch Bias since the low frequency bias allows the developed charge on the photolithographic substrate, generated by the plasma, to dissipate.

Abstract: The present invention provides a method and an apparatus for etching a photolithographic substrate. The photolithographic substrate is placed on a support member in a vacuum chamber. A processing gas for etching a material from the photolithographic substrate is introduced into the vacuum chamber, and a plasma is generated. An RF bias is supplied to the support member in the vacuum chamber through an RF bias frequency generator at or below the ion transit frequency. Exposed material is etched from the photolithographic substrate with improved CD Etch Linearity and CD Etch Bias since the low frequency bias allows the developed charge on the photolithographic substrate, generated by the plasma, to dissipate.

Abstract: Disclosed is a method and apparatus for the etching of a thin film upon a photomask. The etching is carried out in a reactor via an inductively coupled pulsed plasma. Pulsing of the plasma is achieved by regulating the time period (or duty cycle) in which the plasma is generated. It has been found that by decreasing the duty cycle, high etch selectively can be achieved and feature sizes can be faithfully maintained.

Abstract: An embedded attenuated phase shift mask (“EAPSM”) includes an etch stop layer that can be plasma etched in a process that is highly selective to the underlying quartz substrate. Selectivity to the underlying quartz maintains a desired 180 degree phase shift uniformly across the active mask area. Conventional plasma etching techniques can be utilized without damage to the underlying quartz substrate. Alternatively, the etch stop layer comprises a transparent material that can remain intact in the mask structure.

Abstract: A thermal ink jet printhead contains, on a front face, a remote plasma deposited fluoropolymer film. The fluoropolymer film has a high fluorine to carbon ratio. The film also possesses excellent mechanical durability.

Abstract: An embedded attenuated phase shift mask (“EAPSM”) includes an etch stop layer that can be plasma etched in a process that is highly selective to the underlying quartz substrate. Selectivity to the underlying quartz maintains a desired 180 degree phase shift uniformly across the active mask area. Conventional plasma etching techniques can be utilized without damage to the underlying quartz substrate. Alternatively, the etch stop layer comprises a transparent material that can remain intact in the mask structure.

Abstract: A thermal ink jet printhead contains, on a front face, a remote plasma deposited fluoropolymer film. The fluoropolymer film has a high fluorine to carbon ratio. The film also possesses excellent mechanical durability. The film may be prepared by forming a remote plasma from precursor gases containing fluorocarbons and depositing from the remote plasma onto a front face of a thermal ink jet printhead.

Abstract: A dry etching method. According to the present invention, a gaseous plasma comprising, at least in part, boron trichloride, methane, and hydrogen may be used for dry etching of a compound semiconductor material containing layers including aluminum, or indium, or both. Material layers of a compound semiconductor alloy such as AlGaInP or the like may be anisotropically etched for forming electronic devices including field-effect transistors and heterojunction bipolar transistors and for forming photonic devices including vertical-cavity surface-emitting lasers, edge-emitting lasers, and reflectance modulators.