Abstract: Voice communication network defense security which allows for managing and/or preventing voice calls based on which telecommunication carrier provided the calling number. By managing calls based on telecommunication carrier as opposed to the calling number, the present invention seeks to prevent intrusion by wrongdoers who may otherwise be in possession with an unlimited supply of calling numbers. Further, by implementing the security measures at the voice communication network perimeter, voice calls can be managed and/or prevented/block in real-time while the call is in a pre-answer state. As a result, the present invention provides the capability to prevent/block wrongdoers from accessing the intra-voice communication network or, at a minimum ensures that potential wrongdoers are properly vetted through an investigative process.

Abstract: An automatic tattoo apparatus can be used to robotically apply tattoos. A customer can shop on an online tattoo marketplace to select designs created by various artists located anywhere. The online tattoo marketplace can process and manage payments, artist and/or customer profiles, bookings, tattoo design uploads, browsing and design selection, design changes, and/or perform other actions. The automatic tattoo device can apply tattoos precisely, quickly, and may with reduced pain. The tattoo apparatus can apply a wide range of different types of tattoos, including but not limited to micro tattoos, dotwork, blackwork tattoos, realism tattoos, fine-line tattoos, etc.

Abstract: A method for fabricating a copper pillar. The method includes forming a layer of titanium tungsten (TiW) over a semiconductor wafer, forming a layer of zinc (Zn) over the layer of TiW, and forming a copper pillar over the via. In addition, the method includes performing an anneal to diffuse the layer of Zn into the copper pillar. A semiconductor device that includes a layer of TiW coupled to a via of a semiconductor wafer and a copper pillar coupled to the layer of TiW. The copper pillar has interdiffused Zn within its bottom portion. Another method for fabricating a copper pillar includes forming a layer of TiW over a semiconductor wafer, forming a first patterned photoresist, forming a layer of Zn, and then removing the first patterned photoresist. The method further includes forming a second patterned photoresist and forming a copper pillar.

Abstract: A system in a package (SIP) includes carrier layer regions that have a dielectric material with a metal post therethrough, where adjacent carrier layer regions define a gap. A driver IC die is positioned in the gap having nodes connected to bond pads exposed by openings in a top side of a first passivation layer, with the bond pads facing up. A dielectric layer is on the first passivation layer and carrier layer region that includes filled through vias coupled to the bond pads and to the metal post. A light blocking layer is on sidewalls and a bottom of the substrate. A first device includes a light emitter that has first bondable features. The light blocking layer can block at least 90% of incident light. The first bondable features are flipchip mounted to a first portion of the bond pads.

Abstract: A segmented rotor blade for a wind turbine. The segmented rotor blade including at least a first blade segment and a second blade segment extending in opposite directions from a joint. Each of the first and second blade segments including at least one shell member defining an airfoil surface. A joint assembly coupling the first blade segment to the second blade segment via a dovetail connection at the joint. The joint assembly including at least one receiving section defining a receiving cavity, a joining structure received within the at least one receiving section to establish a dovetail connection, and a securement assembly securing the joining structure within the at least one receiving section so as to secure the dovetail connection.

Abstract: Systems, computer program products, and methods are described herein for enhanced reconfiguration of access management protocols. The present invention is configured to electronically receive, via a first communication channel, a user request from a user to reconfigure an access management protocol; initiate, via the first communication channel, an access identifier request to the user; electronically receive, via the first communication channel, an access identifier in response to the access identifier request; initiate, via a preferred communication channel, an access reconfiguration protocol to the user to confirm the user request to reconfigure the access management protocol; electronically receive, via the preferred communication channel, a user confirmation to reconfigure the access management protocol in response to the access reconfiguration protocol; and implement one or more actions to initiate the reconfiguration of the access management protocol in response to receiving the user confirmation.

Abstract: A protocol that is managed by a coordinating network element or third-party intermediary or peer network elements and utilizes tokens prohibits any subset of a union of the coordinating network element or third-party intermediary, if any, and a proper subset of the processors involved in token generation from substantively accessing underlying data. By one approach, processors utilize uniquely-held secrets. By one approach, an audit capability involves a plurality of processors. By one approach, the protocol enables data transference and/or corroboration. By one approach, transferred data is hosted independently of the coordinating network element. By one approach, the coordinating network element or third-party intermediary or a second requesting network element is at least partially blinded from access to tokens submitted by a first requesting network element. By one approach, a third-party intermediary uses a single- or consortium-sourced database.

Abstract: A package comprises a die and a redistribution layer coupled to the die. The redistribution layer comprises a metal layer, a brass layer abutting the metal layer, and a polymer layer abutting the brass layer. The package is a wafer chip scale package (WCSP). The package further includes a solder ball attached to the redistribution layer.

Abstract: In an illustrative configuration, a method for monitoring air quality is disclosed. The method includes accepting analyte gas into a cell and reflecting light rays into the analyte gas repeatedly across the cell into at least one sensor. The light scattered by particulate matter in the analyte gas and amount of spectra-absorption due to presence of a gaseous chemical is then measured. Based on the determined amount of spectra-absorption and the measured scattered light the gaseous chemical is then measured.

Abstract: A patient platform for patient engagement and treatment compliance is disclosed. In an example, a home therapy machine of a patient is configured to transmit treatment information and a clinician database is configured to store a medical record and a registration file identifying the home therapy machine and a personal device of the patient as registered devices. The registration file also identifies whether the personal device installed an application for viewing the treatment information. A server is configured to store the treatment information to the medical record, receive an indication that the treatment information is to be displayed at the personal device, and determine from the registration file if the application is installed on the personal device. If the application is not installed, the server converts the treatment information to text message or Short Messaging Service (“SMS”) format for transmission.

Abstract: Embodiments of the present invention provide systems and methods for generation and maintenance of verified data records. The system may receive a data submission from a user device over one or more communication channels and convert the data submission into a normalized text format for processing and analysis. The data submission may then be analyzed using one or more trained machined learning models in order to identify factual statements and modifiers within the data submission, and generate a confidence score of verified factual information based on corroboration with one or more additional data sources. Additionally, identified modifiers may be analyzed to determine positive or negative sentiment.

Abstract: An integrated circuit (IC) includes a substrate including circuitry configured for a function, the circuitry including at least one stress sensitive circuit portion, with at least a portion of nodes in the circuitry electrically coupled to bond pads provided by a top metal layer. A metal wall that is ring-shaped is positioned above the top metal layer that is not electrically coupled to the circuitry. The stress sensitive circuit portion is with at least a majority of its area within an inner area of the substrate that is framed by the metal wall to provide a cavity.

Abstract: A dynamic Scalable Vector Graphics (SVG) system and associated methods are provided for rendering an interactive software-product demonstration presentation for an envisioned software product within a webpage. A script can be executed to digest an exported SVG file by: querying for target objects having particular attributes named in a target format, and/or particular tag names. For each of the target objects, methods are called to modify that target object based on a first found tag name, a first found attribute, and/or contents of the first found attribute. The called methods can be used to manipulate attributes and/or contents of that target object to modify it and generate a manipulated object that includes the outputs of each called method (e.g., appropriate contents to be inserted into the SVG file). The manipulated objects with the appropriate contents can then be inserted into the SVG file to generate a final SVG file.

Abstract: An apparatus for separating an analyte from a test sample, such as bacteria from blood components, based on their dielectric properties, localizing or condensing the analyte, flushing substantially all remaining waste products from the test sample, and detecting low concentrations of the analyte. The module array includes a plurality of microfluidic channels with connecting microfluidic waste channels for directing undesired material away from the analyte.

Abstract: Embodiments of the invention are directed to a system that performs virtual private network authentication with a read only sandbox integration for virtual private network security. In this way, the invention matches an internet protocol address to a user portrait of user internet protocol addresses to confirm that the connecting device is the authentic user for accessing the virtual private network. If there is a discrepancy between the user portrait and the internet protocol address of the connecting device, the system launches a read only sandbox for connecting device interaction. The read only sandbox allows for bilateral communication with the connecting device where the system has full access to the connection device at a file level to interrogate file level data for confirmation.

Abstract: In some examples, a chip scale package (CSP) comprises a semiconductor die; a passivation layer abutting the semiconductor die; a via extending through the passivation layer; and a first metal layer abutting the via. The CSP also includes an insulation layer abutting the first metal layer, with the insulation layer having an orifice with a maximal horizontal area of less than 32400 microns2. The CSP further includes a second metal layer abutting the insulation layer and adapted to couple to a solder ball. The second metal layer abuts the first metal layer at a point of contact defined by the orifice in the insulation layer.

Abstract: An automatic tattoo apparatus can be used to robotically apply tattoos. A customer can shop on an online tattoo marketplace to select designs created by various artists located anywhere. The online tattoo marketplace can process and manage payments, artist and/or customer profiles, bookings, tattoo design uploads, browsing and design selection, design changes, and/or perform other actions. The automatic tattoo device can apply tattoos precisely, quickly, and may with reduced pain. The tattoo apparatus can apply a wide range of different types of tattoos, including but not limited to micro tattoos, dotwork, blackwork tattoos, realism tattoos, fine-line tattoos, etc.

Abstract: An air handling unit (AHU) for a heating, ventilation, air conditioning, and refrigeration (HVACR) system includes a housing and a combustion heater disposed within the housing. The housing includes a combustion section with a first channel and a second channel. The combustion heater includes heat exchanger tubes and a tube support that supports heat exchanger tubes within the combustion section. The tube support slidably disposed in the first channel and the second channel. The combustion heater configured to be slidably removable from the AHU. An AHU for an HVACR system includes a housing with a fan section and a fan assembly disposed within the housing. The fan assembly including a pair of grooves slidably disposed on a pair of rails of the housing. The fan assembly configured to be both slidably removable from the AHU and liftably removable from the AHU.

Abstract: In a described example, an apparatus includes: a package substrate having a die mount portion and lead portions; at least one semiconductor device die over the die mount portion of the package substrate, the semiconductor device die having bond pads on an active surface facing away from the package substrate; electrical connections between at least one of the bond pads and one of the lead portions; a post interconnect over at least one of the bond pads, the post interconnect extending away from the active surface of the semiconductor device die; and a dielectric material covering a portion of the package substrate, the semiconductor device die, a portion of the post interconnect, and the electrical connections, forming a packaged semiconductor device, wherein the post interconnect extends through the dielectric material and had an end facing away from the semiconductor device die that is exposed from the dielectric material.