Patents by Inventor Christopher Gregory Malone
Christopher Gregory Malone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10587115Abstract: This specification describes a power distribution system comprising a first section that receives power from a first source. The power received from the first source is adjusted by a first rectifier unit coupled to a first power bus of the first section. The system also comprises a second section that is separate from the first section and that receives power from a second source. The power received from the second source is adjusted by a second rectifier unit coupled to a second power bus of the second distribution section. The system includes a swing rectifier connected to the first section and connected to the second section. The swing rectifier is configured to provide power to the first power bus and to the second power bus and to dynamically adjust the power capacity of the first section that is available to computing loads, and to dynamically adjust the power capacity of the second section that is available to computing loads.Type: GrantFiled: December 20, 2016Date of Patent: March 10, 2020Assignee: Google Inc.Inventors: Eduardo Lao, Jyoti Sastry, James Kennedy, Christopher Gregory Malone, Varun Sakalkar
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Publication number: 20200053902Abstract: A data center power system includes an electrical power conductor that includes a live conductor surface and is configured to carry direct current (DC) power from a power source through a human-occupiable workspace of a data center; a grounded conductor positioned in the human-occupiable workspace apart from the electrical power conductor; a first electrical connector configured to mount to a data center rack that supports a plurality of electronic devices, the first electrical connector moveable to electrically contact the live conductor surface of the electrical power conductor; and a second electrical conductor positioned on the rack and configured to electrically contact the grounded conductor.Type: ApplicationFiled: October 21, 2019Publication date: February 13, 2020Inventors: Varun Sakalkar, Jyoti Sastry, James Kennedy, Eduardo Lao, Christopher Gregory Malone, Pascal Kam
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Publication number: 20200037472Abstract: A data center cooling system includes an evaporative cooling system. The evaporative cooling system includes fans configured to circulate outside air at ambient conditions through an entry zone of a data center, and atomizers positioned upstream of the entry zone configured to spray atomized water into the circulating outside air. The atomized water evaporates in an evaporation zone and cools the outside air to produce cooled air, which is directed through racks of computers positioned downstream of the evaporation zone.Type: ApplicationFiled: October 4, 2019Publication date: January 30, 2020Inventors: Andrew B. Carlson, Christopher Gregory Malone, Jimmy Clidaras
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Patent number: 10548240Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member that includes a first number of inlet ports and a second number of outlet ports that are in fluid communication with a cooling liquid flow path defined through the heat transfer member, the first number of inlet ports being different that the second number of outlet ports.Type: GrantFiled: January 11, 2019Date of Patent: January 28, 2020Assignee: Google LLCInventors: Madhusudan Krishnan Iyengar, Christopher Gregory Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang, Norman Paul Jouppi
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Patent number: 10492340Abstract: Techniques for operating a data center include providing at least one fan coil unit operable to circulate a cooling airflow to a human-occupiable workspace of the data center; providing a plurality of computer racks arranged in one or more rows in the human-occupiable workspace; forming one or more warm air aisles between the one or more rows of the plurality of computer racks that are in fluid communication with an inlet of the fan coil unit through a warm air plenum, and also with an outlet of the fan coil unit through the human-occupiable workspace and the plurality of computer racks arranged in one or more rows; adjusting the associated electrical power density of one or more of the plurality of computer racks; and based on the adjustment, adjusting a characteristic of the data center.Type: GrantFiled: April 16, 2018Date of Patent: November 26, 2019Assignee: Google LLCInventors: Thomas R. Kowalski, Christopher Gregory Malone, Ankit Somani
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Patent number: 10492329Abstract: A data center power system includes an electrical power conductor that includes a live conductor surface and is configured to carry direct current (DC) power from a power source through a human-occupiable workspace of a data center; a grounded conductor positioned in the human-occupiable workspace apart from the electrical power conductor; a first electrical connector configured to mount to a data center rack that supports a plurality of electronic devices, the first electrical connector moveable to electrically contact the live conductor surface of the electrical power conductor; and a second electrical conductor positioned on the rack and configured to electrically contact the grounded conductor.Type: GrantFiled: December 30, 2016Date of Patent: November 26, 2019Assignee: Google LLCInventors: Varun Sakalkar, Jyoti Sastry, James Kennedy, Eduardo Lao, Christopher Gregory Malone, Pascal Kam
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Publication number: 20190327859Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.Type: ApplicationFiled: April 19, 2018Publication date: October 24, 2019Inventors: Madhusudan Krishnan Iyengar, Christopher Gregory Malone, Yuan Li, Jorge Padilla, Woon Seong Kwon, Teckgyu Kang, Norman Paul Jouppi
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Patent number: 10440861Abstract: A data center cooling system includes an evaporative cooling system. The evaporative cooling system includes fans configured to circulate outside air at ambient conditions through an entry zone of a data center, and atomizers positioned upstream of the entry zone configured to spray atomized water into the circulating outside air. The atomized water evaporates in an evaporation zone and cools the outside air to produce cooled air, which is directed through racks of computers positioned downstream of the evaporation zone.Type: GrantFiled: November 21, 2016Date of Patent: October 8, 2019Assignee: Google LLCInventors: Andrew B. Carlson, Christopher Gregory Malone, Jimmy Clidaras
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Patent number: 10404322Abstract: A data center power connector includes a conduit that defines an inner volume; and at least one conductor that extends through the inner volume of the conduit and is configured to carry electrical power from a source of main power of a data center to at least one electronic device mounted in a rack deployed in a human-occupiable workspace of the data center and data between the at least one electronic device and a data center control system.Type: GrantFiled: December 30, 2016Date of Patent: September 3, 2019Assignee: Google LLCInventors: Varun Sakalkar, Jyoti Sastry, James Kennedy, Eduardo Lao, Christopher Gregory Malone, Pascal Kam
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Patent number: 10306797Abstract: A data center power system includes an enclosure that defines an inner volume; a first direct current (DC) power bus mounted in the inner volume and extending externally to electrically couple to a source of main power; a second DC power bus mounted in the inner volume and extending externally to electrically couple to the source of main power; a plurality of transfer switches mounted in the inner volume, each transfer switch electrically coupled to one of the first DC power bus or the second DC power bus; and a plurality of DC power conductors that are electrically coupled to a pair of transfer switches that includes one transfer switch electrically coupled to the first DC power bus and one transfer switch electrically coupled to the second DC power bus; each DC power conductor configured to electrically couple to a data center rack that supports a plurality of electronic devices.Type: GrantFiled: December 30, 2016Date of Patent: May 28, 2019Assignee: Google LLCInventors: Varun Sakalkar, Jyoti Sastry, James Kennedy, Eduardo Lao, Christopher Gregory Malone, Pascal Kam
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Patent number: 10032695Abstract: A semiconductor package includes a substrate, an integrated circuit disposed on the substrate, a memory support disposed on the integrated circuit, stacked memory disposed on the memory support and in communication with the integrated circuit, and a lid connected to the substrate. The integrated circuit has a low power region and a high power region. The memory support is disposed on the low power region of the integrated circuit and is configured to allow a flow of fluid therethrough to conduct heat away from the low power region of the integrated circuit. The lid defines a first port, a second port, and a lid volume fluidly connecting the first port and the second port. The lid volume is configured to house the integrated circuit, the memory support, and the stacked memory, while directing the flow of fluid to flow over the integrated circuit, the memory support, and the stacked memory.Type: GrantFiled: February 19, 2016Date of Patent: July 24, 2018Assignee: Google LLCInventors: Madhu Krishnan Iyengar, Teck-Gyu Kang, Christopher Gregory Malone, Norman Paul Jouppi
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Publication number: 20180192539Abstract: A data center power system includes an enclosure that defines an inner volume; a first direct current (DC) power bus mounted in the inner volume and extending externally to electrically couple to a source of main power; a second DC power bus mounted in the inner volume and extending externally to electrically couple to the source of main power; a plurality of transfer switches mounted in the inner volume, each transfer switch electrically coupled to one of the first DC power bus or the second DC power bus; and a plurality of DC power conductors that are electrically coupled to a pair of transfer switches that includes one transfer switch electrically coupled to the first DC power bus and one transfer switch electrically coupled to the second DC power bus; each DC power conductor configured to electrically couple to a data center rack that supports a plurality of electronic devices.Type: ApplicationFiled: December 30, 2016Publication date: July 5, 2018Inventors: Varun Sakalkar, Jyoti Sastry, James Kennedy, Eduardo Lao, Christopher Gregory Malone, Pascal Kam
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Publication number: 20180191401Abstract: A data center power connector includes a conduit that defines an inner volume; and at least one conductor that extends through the inner volume of the conduit and is configured to carry electrical power from a source of main power of a data center to at least one electronic device mounted in a rack deployed in a human-occupiable workspace of the data center and data between the at least one electronic device and a data center control system.Type: ApplicationFiled: December 30, 2016Publication date: July 5, 2018Inventors: Varun Sakalkar, Jyoti Sastry, James Kennedy, Eduardo Lao, Christopher Gregory Malone, Pascal Kam
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Publication number: 20180192538Abstract: A data center power system includes an electrical power conductor that includes a live conductor surface and is configured to carry direct current (DC) power from a power source through a human-occupiable workspace of a data center; a grounded conductor positioned in the human-occupiable workspace apart from the electrical power conductor; a first electrical connector configured to mount to a data center rack that supports a plurality of electronic devices, the first electrical connector moveable to electrically contact the live conductor surface of the electrical power conductor; and a second electrical conductor positioned on the rack and configured to electrically contact the grounded conductor.Type: ApplicationFiled: December 30, 2016Publication date: July 5, 2018Inventors: Varun Sakalkar, Jyoti Sastry, James Kennedy, Eduardo Lao, Christopher Gregory Malone, Pascal Kam
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Publication number: 20180175618Abstract: This specification describes a power distribution system comprising a first section that receives power from a first source. The power received from the first source is adjusted by a first rectifier unit coupled to a first power bus of the first section. The system also comprises a second section that is separate from the first section and that receives power from a second source. The power received from the second source is adjusted by a second rectifier unit coupled to a second power bus of the second distribution section. The system includes a swing rectifier connected to the first section and connected to the second section. The swing rectifier is configured to provide power to the first power bus and to the second power bus and to dynamically adjust the power capacity of the first section that is available to computing loads, and to dynamically adjust the power capacity of the second section that is available to computing loads.Type: ApplicationFiled: December 20, 2016Publication date: June 21, 2018Inventors: Eduardo Lao, Jyoti Sastry, James Kennedy, Christopher Gregory Malone, Varun Sakalkar
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Publication number: 20170243806Abstract: A semiconductor package includes a substrate, an integrated circuit disposed on the substrate, a memory support disposed on the integrated circuit, stacked memory disposed on the memory support and in communication with the integrated circuit, and a lid connected to the substrate. The integrated circuit has a low power region and a high power region. The memory support is disposed on the low power region of the integrated circuit and is configured to allow a flow of fluid therethrough to conduct heat away from the low power region of the integrated circuit. The lid defines a first port, a second port, and a lid volume fluidly connecting the first port and the second port. The lid volume is configured to house the integrated circuit, the memory support, and the stacked memory, while directing the flow of fluid to flow over the integrated circuit, the memory support, and the stacked memory.Type: ApplicationFiled: February 19, 2016Publication date: August 24, 2017Applicant: Google Inc.Inventors: Madhu Krishnan Iyengar, Teck-Gyu Kang, Christopher Gregory Malone, Norman Paul Jouppi
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Publication number: 20170071077Abstract: A data center cooling system includes an evaporative cooling system. The evaporative cooling system includes fans configured to circulate outside air at ambient conditions through an entry zone of a data center, and atomizers positioned upstream of the entry zone configured to spray atomized water into the circulating outside air. The atomized water evaporates in an evaporation zone and cools the outside air to produce cooled air, which is directed through racks of computers positioned downstream of the evaporation zone.Type: ApplicationFiled: November 21, 2016Publication date: March 9, 2017Inventors: Andrew B. Carlson, Christopher Gregory Malone, Jimmy Clidaras
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Patent number: 9167724Abstract: A multi-floor data center, comprising in one implementation, a plurality of floors; a first set of server racks disposed about a first vertical center axis on each floor, the first set of server racks formed in a substantially closed shape, with a substantially vertical open center comprising a first airflow plenum at least for air flow; a first opening in each of the floors, with the first opening aligned with the substantially vertical first airflow plenum on it respective floor, wherein the substantially vertical first airflow plenums on the floors are aligned for communication through the first openings in the floors; outer wall; a roof with a roof opening therein.Type: GrantFiled: January 12, 2015Date of Patent: October 20, 2015Assignee: Google Inc.Inventors: Ankit Somani, Christopher Gregory Malone
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Patent number: 8931221Abstract: A multi-floor data center, comprising in one implementation, a plurality of floors; a first set of server racks disposed about a first vertical center axis on each floor, the first set of server racks formed in a substantially closed shape, with a substantially vertical open center comprising a first airflow plenum at least for air flow; a first opening in each of the floors, with the first opening aligned with the substantially vertical first airflow plenum on it respective floor, wherein the substantially vertical first airflow plenums on the floors are aligned for communication through the first openings in the floors; outer wall; a roof with a roof opening therein.Type: GrantFiled: November 21, 2012Date of Patent: January 13, 2015Assignee: Google Inc.Inventors: Ankit Somani, Christopher Gregory Malone
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Publication number: 20140137491Abstract: A multi-floor data center, comprising in one implementation, a plurality of floors; a first set of server racks disposed about a first vertical center axis on each floor, the first set of server racks formed in a substantially closed shape, with a substantially vertical open center comprising a first airflow plenum at least for air flow; a first opening in each of the floors, with the first opening aligned with the substantially vertical first airflow plenum on it respective floor, wherein the substantially vertical first airflow plenums on the floors are aligned for communication through the first openings in the floors; outer wall; a roof with a roof opening therein.Type: ApplicationFiled: November 21, 2012Publication date: May 22, 2014Inventors: Ankit SOMANI, Christopher Gregory MALONE