Abstract: A fluid-flow balancer mimics the air-flow resistance of a component omitted from an electronic system so that omission causes little or no disruption to or alteration of the flow of a cooling fluid. This prevents overheating that such disruption or alteration may otherwise cause. In addition, the fluid-flow balancer may also mimic the EMI suppression characteristics of the omitted component. Thus, a system not fully populated with components can still be adequately cooled and shielded without changing the cooling or shielding systems.

Abstract: A method and apparatus to provide structural support to one or more daughter-cards attached to a motherboard substrate. One embodiment of the invention involves a method to assemble a daughter-card support to a motherboard. A second embodiment of the invention involves a method to fabricate a daughter-card support. A third embodiment of the invention involves an assembled motherboard substrate with a daughter-card support.

Abstract: A method and apparatus to attach multiple components to a common heat dissipation device. One embodiment of the invention involves a method to assemble a plurality of components on a substrate to a heat dissipation device. A second embodiment of the invention involves another method to assemble a plurality of components on a substrate to a heat dissipation device containing one or more heat-pipes. A third embodiment of the invention involves an assembled substrate with a plurality of electrical components attached to a common heat dissipation device.

Abstract: A method and apparatus to provide air-flow balancing with a card guide frame. One embodiment of the invention involves a method to assemble an air-flow balancing card guide frame and one or more substrates. A second embodiment of the invention involves a method to design an air-flow balancing card guide frame. A third embodiment of the invention involves an assembled air-flow balancing card guide frame and one or more substrates.