Abstract: A tuned mass damper (TMD) system in combination with a floating offshore wind turbine (FOWT) platform includes a barge type FOWT platform having a hull configured to have a wind turbine tower mounted thereon. A TMD system is mounted in the hull and has a first TMD configured to operate at a first frequency, and a second TMD configured to operate at a second frequency different than the first frequency.

Abstract: Methods and systems for a thin bonded interposer package are disclosed and may, for example, include bonding a semiconductor die to a first surface of a substrate, forming contacts on the first surface of the substrate, encapsulating the semiconductor die, formed contacts, and first surface of the substrate using a mold material while leaving a top surface of the semiconductor die not encapsulated by mold material, forming vias through the mold material to expose the formed contacts. A bond line may be dispensed on the mold material and the semiconductor die for bonding the substrate to an interposer. A thickness of the bond line may be defined by standoffs formed on the top surface of the semiconductor die.

Abstract: A computer-implemented method, computer program product, and computing system is provided for scoping searches within a website. In an implementation, a method may receiving a search request. The method may also include identifying a location of a search scoping feature within a website hierarchy. The method may further include setting a search scope relative to the search request based on, at least in part, the location of the search scoping feature.

Abstract: Methods and systems for a thin bonded interposer package are disclosed and may, for example, include bonding a semiconductor die to a first surface of a substrate, forming contacts on the first surface of the substrate, encapsulating the semiconductor die, formed contacts, and first surface of the substrate using a mold material while leaving a top surface of the semiconductor die not encapsulated by mold material, forming vias through the mold material to expose the formed contacts. A bond line may be dispensed on the mold material and the semiconductor die for bonding the substrate to an interposer. A thickness of the bond line may be defined by standoffs formed on the top surface of the semiconductor die.

Abstract: Methods and systems for a thin bonded interposer package are disclosed and may, for example, include bonding a semiconductor die to a first surface of a substrate, forming contacts on the first surface of the substrate, encapsulating the semiconductor die, formed contacts, and first surface of the substrate using a mold material while leaving a top surface of the semiconductor die not encapsulated by mold material, forming vias through the mold material to expose the formed contacts. A bond line may be dispensed on the mold material and the semiconductor die for bonding the substrate to an interposer. A thickness of the bond line may be defined by standoffs formed on the top surface of the semiconductor die.

Abstract: Methods and systems for a thin bonded interposer package are disclosed and may, for example, include bonding a semiconductor die to a first surface of a substrate, forming contacts on the first surface of the substrate, encapsulating the semiconductor die, formed contacts, and first surface of the substrate using a mold material while leaving a top surface of the semiconductor die not encapsulated by mold material, forming vias through the mold material to expose the formed contacts. A bond line may be dispensed on the mold material and the semiconductor die for bonding the substrate to an interposer. A thickness of the bond line may be defined by standoffs formed on the top surface of the semiconductor die.

Abstract: A data processing system to implement wiring/silicon blockages via parameterized cells (pCells) includes a front end-of-line placement/blockage (FEOL P/B) controller to generate a placement blockage based on an input parameter corresponding to a physical design of an integrated circuit (IC). The FEOL P/B outputs a placement blockage parameter that is stored in a wire track allocation database to indicate the placement blockage. A back end-of-line wiring track (BEOL WT) controller generates a wire track blockage of the IC. A BEOL power track (BEOL PT) controller generates a metal blockage within the wire track blockage. A combination of the metal blockage and the wire track blockage defines a parent-child contract to enable concurrent physical design of the IC without creating shorts and overlaps in a child block of the IC.

Abstract: Methods and systems for a thin bonded interposer package are disclosed and may, for example, include bonding a semiconductor die to a first surface of a substrate, forming contacts on the first surface of the substrate, encapsulating the semiconductor die, formed contacts, and first surface of the substrate using a mold material while leaving a top surface of the semiconductor die not encapsulated by mold material, forming vias through the mold material to expose the formed contacts. A bond line may be dispensed on the mold material and the semiconductor die for bonding the substrate to an interposer. A thickness of the bond line may be defined by standoffs formed on the top surface of the semiconductor die.

Abstract: Embodiments relate to managing layer promotion of interconnects in the routing phase of integrated circuit design. An aspect includes a system to manage layer promotion in a routing phase of integrated circuit design. The system includes a memory device to store instructions, and a processor to execute the instructions to identify a set of candidate interconnects for layer promotion, score and sort the set of candidate interconnects according to a respective score to thereby establish a respective rank, assess routing demand and resource availability based on layer promotion of the set of candidate interconnects, and manage the set of candidate interconnects based on the respective rank and the resource availability, the processor assessing the routing demand and resource availability and managing the set of candidate interconnects iteratively, wherein the processor, in at least one iteration, generates a second set of candidate interconnects by reducing the set of candidate interconnects.

Abstract: A system and a computer implemented method for interior pinning in a macro block of an integrated circuit are provided. The method includes receiving child level information of the macro block including at least a location of a logic leaflet, receiving parent level information including at least edge direction information for pin connection and routing resource values of each slot of the macro block at each metal layer, and selecting a pin location based on the child level information and the parent level information.

Abstract: A method and system to identify a region of a design block of an integrated circuit for redesign are described. The method includes dividing the design block into grids, each of the grids including a corresponding number of logic elements. The method also includes filtering each of the grids based on a specified criteria, the filtering including determining a number (B) of the corresponding logic elements among a total number (A) of the logic elements in each grid that meet the specified criteria. The region is a set of two or more of the grids based on a result of the filtering.

Abstract: A data processing system to implement wiring/silicon blockages via parameterized cells (pCells) includes a front end-of-line placement/blockage (FEOL P/B) controller to generate a placement blockage based on an input parameter corresponding to a physical design of an integrated circuit (IC). The FEOL P/B outputs a placement blockage parameter that is stored in a wire track allocation database to indicate the placement blockage. A back end-of-line wiring track (BEOL WT) controller generates a wire track blockage of the IC. A BEOL power track (BEOL PT) controller generates a metal blockage within the wire track blockage. A combination of the metal blockage and the wire track blockage defines a parent-child contract to enable concurrent physical design of the IC without creating shorts and overlaps in a child block of the IC.

Abstract: A first open path in a microprocessor design is identified. At least one modification to a design of that first open path is simulated. An updated arrival time at a pin is calculated based on the simulated modification or modifications. An updated path time is then calculated based on the updated arrival time.

Abstract: A first open path in a microprocessor design is identified. At least one modification to a design of that first open path is simulated. An updated arrival time at a pin is calculated based on the simulated modification or modifications. An updated path time is then calculated based on the updated arrival time.

Abstract: A system and a computer implemented method for interior pinning in a macro block of an integrated circuit are provided. The method includes receiving child level information of the macro block including at least a location of a logic leaflet, receiving parent level information including at least edge direction information for pin connection and routing resource values of each slot of the macro block at each metal layer, and selecting a pin location based on the child level information and the parent level information.

Abstract: A system and a computer implemented method for interior pinning in a macro block of an integrated circuit are provided. The method includes receiving child level information of the macro block including at least a location of a logic leaflet, receiving parent level information including at least edge direction information for pin connection and routing resource values of each slot of the macro block at each metal layer, and selecting a pin location based on the child level information and the parent level information.

Abstract: A computer-implemented method, computer program product, and computing system is provided for scoping searches within a website. In an implementation, a method may receiving a search request. The method may also include identifying a location of a search scoping feature within a website hierarchy. The method may further include setting a search scope relative to the search request based on, at least in part, the location of the search scoping feature.

Abstract: A computer-implemented method, computer program product, and computing system is provided for scoping searches within a website. In an implementation, a method may receiving a search request. The method may also include identifying a location of a search scoping feature within a website hierarchy. The method may further include setting a search scope relative to the search request based on, at least in part, the location of the search scoping feature.

Abstract: Methods for copper pillar protection may include forming a metal post over a contact on a semiconductor die, where the metal post comprises a sidewall. A metal cap may be formed on the metal post and may be wider than the width of the metal post. A solder bump may be formed on the metal cap, and a conformal passivation layer may be formed on at least the sidewall of the metal post. The metal cap may be rounded shaped or rectangular shaped in cross-section. The metal post and the metal cap may comprise copper. The metal cap may comprise a copper layer and a nickel layer. The seed metal layer may comprise one or more of titanium, tungsten, and copper. The conformal passivation layer may comprise a nonwettable polymer. Horizontal portions of the conformal passivation layer may be removed utilizing an anisotropic etch such as a plasma etch.

Abstract: A system and a computer implemented method for interior pinning in a macro block of an integrated circuit are provided. The method includes receiving child level information of the macro block including at least a location of a logic leaflet, receiving parent level information including at least edge direction information for pin connection and routing resource values of each slot of the macro block at each metal layer, and selecting a pin location based on the child level information and the parent level information.